Sangmin Yong

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Cheonan-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having an interposer and method of manufactur...
- Patent number 12,021,032
- Issue date Jun 25, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with memory stack structure connected to logi...
- Patent number 11,935,867
- Issue date Mar 19, 2024
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interposer and method of manufactur...
- Patent number 11,694,961
- Issue date Jul 4, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20230326862
- Publication date Oct 12, 2023
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220189916
- Publication date Jun 16, 2022
- Samsung Electronics Co., Ltd.
- YANGGYOO JUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERPOSER AND METHOD OF MANUFACTUR...
- Publication number 20210391265
- Publication date Dec 16, 2021
- Samsung Electronics Co., Ltd.
- Yanggyoo Jung
- H01 - BASIC ELECTRIC ELEMENTS