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Sangsick Park

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  • Hwaseong-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package
    • Patent number 12,176,313
    • Issue date Dec 24, 2024
    • Samsung Electronics Co., Ltd.
    • Hyoungjoo Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,791,308
    • Issue date Oct 17, 2023
    • Samsung Electronics Co., Ltd.
    • Jihwan Hwang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,688,707
    • Issue date Jun 27, 2023
    • Samsung Electronics Co., Ltd.
    • Joonho Jun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with chip end design and trenches to control...
    • Patent number 11,469,099
    • Issue date Oct 11, 2022
    • Samsung Electronics Co., Ltd.
    • Jungmin Ko
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,362,062
    • Issue date Jun 14, 2022
    • Samsung Electronics Co., Ltd.
    • Jihwan Hwang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250079378
    • Publication date Mar 6, 2025
    • Samsung Electronics Co., Ltd.
    • Hyoungjoo Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240421012
    • Publication date Dec 19, 2024
    • Samsung Electronics Co., Ltd.
    • Sangsick PARK
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
    • Publication number 20240186289
    • Publication date Jun 6, 2024
    • Samsung Electronics Co., Ltd.
    • Hanmin Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING BUMPS WITH A PLURALITY OF SEPARATIO...
    • Publication number 20240128221
    • Publication date Apr 18, 2024
    • Samsung Electronics Co., Ltd.
    • Minsoo Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FAN-OUT TYPE SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE...
    • Publication number 20230420336
    • Publication date Dec 28, 2023
    • Samsung Electronics Co., Ltd.
    • Joonho JUN
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230121888
    • Publication date Apr 20, 2023
    • Samsung Electronics Co., Ltd.
    • Minsoo KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230011778
    • Publication date Jan 12, 2023
    • Samsung Electronics Co., Ltd.
    • Hyoungjoo Lee
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220285312
    • Publication date Sep 8, 2022
    • Samsung Electronics Co., Ltd.
    • Jihwan HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220020713
    • Publication date Jan 20, 2022
    • Samsung Electronics Co., Ltd.
    • Joonho Jun
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210375823
    • Publication date Dec 2, 2021
    • Samsung Electronics Co., Ltd.
    • Jihwan HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20210143008
    • Publication date May 13, 2021
    • Samsung Electronics Co., Ltd.
    • Jungmin Ko
    • H01 - BASIC ELECTRIC ELEMENTS