Sanguk Han

Person

Asan-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Chip on film package with trench to reduce slippage and display dev...
- Patent number 12,148,337
- Issue date Nov 19, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Grant
Semiconductor package
- Patent number 12,087,696
- Issue date Sep 10, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,923,342
- Issue date Mar 5, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,869,818
- Issue date Jan 9, 2024
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip on film package and display apparatus including the same
- Patent number 11,842,945
- Issue date Dec 12, 2023
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,574,873
- Issue date Feb 7, 2023
- Samsung Electronics Co., Ltd.
- Sunkyoung Seo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 11,444,060
- Issue date Sep 13, 2022
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package and method of manufacturing same
- Patent number 11,328,966
- Issue date May 10, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20250014953
- Publication date Jan 9, 2025
- Samsung Electronics Co., Ltd.
- Duckgyu Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240404955
- Publication date Dec 5, 2024
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...
- Publication number 20240395747
- Publication date Nov 28, 2024
- Samsung Electronics Co., Ltd.
- Jaekul Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20240387421
- Publication date Nov 21, 2024
- Samsung Electronics Co., Ltd.
- Hyungsun JANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOCKET FOR TESTING SEMICONDUCTOR DEVICE
- Publication number 20240142493
- Publication date May 2, 2024
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20230170304
- Publication date Jun 1, 2023
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME
- Publication number 20230036519
- Publication date Feb 2, 2023
- Samsung Electronics Co., Ltd.
- Sanguk HAN
- G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20220262689
- Publication date Aug 18, 2022
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20220246530
- Publication date Aug 4, 2022
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20220216186
- Publication date Jul 7, 2022
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME
- Publication number 20220139799
- Publication date May 5, 2022
- Samsung Electronics Co., Ltd.
- Jaemin Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210193581
- Publication date Jun 24, 2021
- Samsung Electronics Co., Ltd.
- Sunkyoung SEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20210013181
- Publication date Jan 14, 2021
- Samsung Electronics Co., Ltd.
- Sanguk Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME
- Publication number 20200411393
- Publication date Dec 31, 2020
- Samsung Electronics Co., Ltd.
- Hyoeun Kim
- G01 - MEASURING TESTING

Person

Patents Grantslast 30 patents

Chip on film package with trench to reduce slippage and display dev...

Semiconductor package

Semiconductor package

Chip-stacked semiconductor package and method of manufacturing same

Chip on film package and display apparatus including the same

Semiconductor package

Semiconductor package

Chip-stacked semiconductor package and method of manufacturing same

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF INSPECTING THE SEMICONDUCTOR PA...

SEMICONDUCTOR PACKAGES AND METHODS OF MANUFACTURING THE SAME

SOCKET FOR TESTING SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE

CHIP ON FILM PACKAGE AND DISPLAY DEVICE INCLUDING THE SAME

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME

CHIP-ON-FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

CHIP ON FILM PACKAGE AND DISPLAY APPARATUS INCLUDING THE SAME

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

CHIP-STACKED SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING SAME