Sangwhoo Lim

Person

Johor Bahru, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and dual a...
- Patent number 9,018,667
- Issue date Apr 28, 2015
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base/flange heat spreader and...
- Patent number 8,415,703
- Issue date Apr 9, 2013
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 8,241,962
- Issue date Aug 14, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and cerami...
- Patent number 8,232,576
- Issue date Jul 31, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader, signal po...
- Patent number 8,212,279
- Issue date Jul 3, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with base heat spreader and cavity in base
- Patent number 8,207,553
- Issue date Jun 26, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip assembly with post/base heat spreader and cavity...
- Patent number 8,193,556
- Issue date Jun 5, 2012
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 8,076,182
- Issue date Dec 13, 2011
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 8,003,416
- Issue date Aug 23, 2011
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a semiconductor chip assembly with a post/base hea...
- Patent number 7,939,375
- Issue date May 10, 2011
- Bridge Semiconductor Corporation
- Charles W. C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20110059578
- Publication date Mar 10, 2011
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER, SIGNAL PO...
- Publication number 20110049558
- Publication date Mar 3, 2011
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLA...
- Publication number 20110003437
- Publication date Jan 6, 2011
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/FLANGE HEAT SPREADER AND...
- Publication number 20100327310
- Publication date Dec 30, 2010
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20100210049
- Publication date Aug 19, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20100203679
- Publication date Aug 12, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND DUAL A...
- Publication number 20100193830
- Publication date Aug 5, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BASE HEAT SPR...
- Publication number 20100190300
- Publication date Jul 29, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...
- Publication number 20100190297
- Publication date Jul 29, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY...
- Publication number 20100181594
- Publication date Jul 22, 2010
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE
- Publication number 20100155769
- Publication date Jun 24, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY...
- Publication number 20100155768
- Publication date Jun 24, 2010
- Bridge Semiconductor Corporation
- Charles W.C. Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Sangwhoo Lim

Person

Patents Grantslast 30 patents

Semiconductor chip assembly with post/base heat spreader and dual a...

Semiconductor chip assembly with post/base/flange heat spreader and...

Method of making a semiconductor chip assembly with a post/base hea...

Semiconductor chip assembly with post/base heat spreader and cerami...

Semiconductor chip assembly with post/base heat spreader, signal po...

Semiconductor chip assembly with base heat spreader and cavity in base

Semiconductor chip assembly with post/base heat spreader and cavity...

Method of making a semiconductor chip assembly with a post/base hea...

Method of making a semiconductor chip assembly with a post/base hea...

Method of making a semiconductor chip assembly with a post/base hea...

Patents Applicationslast 30 patents

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER, SIGNAL PO...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE/FLA...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE/FLANGE HEAT SPREADER AND...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND DUAL A...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A BASE HEAT SPR...

METHOD OF MAKING A SEMICONDUCTOR CHIP ASSEMBLY WITH A POST/BASE HEA...

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY...

SEMICONDUCTOR CHIP ASSEMBLY WITH BASE HEAT SPREADER AND CAVITY IN BASE

SEMICONDUCTOR CHIP ASSEMBLY WITH POST/BASE HEAT SPREADER AND CAVITY...