Sanh D. Tang

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Driver placement in memories having stacked memory arrays
- Patent number 12,200,938
- Issue date Jan 14, 2025
- Haitao Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having voids along regions of gates, and meth...
- Patent number 12,150,292
- Issue date Nov 19, 2024
- Micron Technology, Inc.
- Sanh D. Tang
Information Patent Grant
Transistor structures having conductive structures along pillars of...
- Patent number 12,142,680
- Issue date Nov 12, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies having conductive material...
- Patent number 12,069,852
- Issue date Aug 20, 2024
- Micron Technology, Inc.
- Hong Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated structures comprising vertical channel material and havi...
- Patent number 12,029,039
- Issue date Jul 2, 2024
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic devices including two-dimensional materials, and re...
- Patent number 11,943,919
- Issue date Mar 26, 2024
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of horizontally extending and vertically overlapping features...
- Patent number 11,923,289
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatuses including elongate pillars of access devices
- Patent number 11,925,014
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Song Guo
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated assemblies having transistor body regions coupled to car...
- Patent number 11,910,597
- Issue date Feb 20, 2024
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays
- Patent number 11,864,386
- Issue date Jan 2, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Driver placement in memories having stacked memory arrays
- Patent number 11,805,653
- Issue date Oct 31, 2023
- Micron Technology, Inc.
- Haitao Liu
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays
- Patent number RE49715
- Issue date Oct 24, 2023
- Micron Technology, Inc.
- Martin C. Roberts
Information Patent Grant
Array of capacitors, an array of memory cells, a method of forming...
- Patent number 11,744,061
- Issue date Aug 29, 2023
- Micron Technology, Inc.
- Sanh D. Tang
Information Patent Grant
Integrated assemblies comprising memory cells and shielding materia...
- Patent number 11,706,909
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional memory and methods of forming the same
- Patent number 11,700,730
- Issue date Jul 11, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory arrays comprising memory cells
- Patent number 11,631,678
- Issue date Apr 18, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having conductive material along three of fou...
- Patent number 11,600,535
- Issue date Mar 7, 2023
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having shield lines between digit lines, and...
- Patent number 11,581,317
- Issue date Feb 14, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Charge storage apparatus and methods
- Patent number 11,581,324
- Issue date Feb 14, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated structures comprising vertical channel material and havi...
- Patent number 11,569,266
- Issue date Jan 31, 2023
- Micron Technology, Inc.
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies, and methods of forming integrated assemblies
- Patent number 11,508,734
- Issue date Nov 22, 2022
- Micron Technology, Inc.
- Amirhasan Nourbakhsh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory devices including void spaces between transistor features, a...
- Patent number 11,476,259
- Issue date Oct 18, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Array of recessed access gate lines
- Patent number 11,462,544
- Issue date Oct 4, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having voids along regions of gates, and meth...
- Patent number 11,456,299
- Issue date Sep 27, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming integrated assemblies having conductive material...
- Patent number 11,444,088
- Issue date Sep 13, 2022
- Micron Technology, Inc.
- Hong Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays
- Patent number 11,404,440
- Issue date Aug 2, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Access devices formed with conductive contacts
- Patent number 11,393,928
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Haitao Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack of horizontally extending and vertically overlapping features...
- Patent number 11,393,748
- Issue date Jul 19, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- G11 - INFORMATION STORAGE
Information Patent Grant
Memory arrays
- Patent number 11,374,007
- Issue date Jun 28, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies having transistor body regions coupled to car...
- Patent number 11,348,932
- Issue date May 31, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20250022955
- Publication date Jan 16, 2025
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Assemblies Having Conductive Material...
- Publication number 20240365538
- Publication date Oct 31, 2024
- Micron Technology, Inc.
- Hong Li
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Structures Comprising Vertical Channel Material and Havi...
- Publication number 20240357819
- Publication date Oct 24, 2024
- Lodestar Licensing Group LLC
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRING DRIVER ASSEMBLIES INCLUDING TWO-DIMENSIONAL MATERIALS, AND R...
- Publication number 20240224516
- Publication date Jul 4, 2024
- Lodestar Licensing Group LLC
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack of Horizontally Extending and Vertically Overlapping Features...
- Publication number 20240186234
- Publication date Jun 6, 2024
- Micron Technology, Inc.
- Sanh D. Tang
- G11 - INFORMATION STORAGE
Information Patent Application
Integrated Assemblies Having Transistor Body Regions Coupled to Car...
- Publication number 20240172432
- Publication date May 23, 2024
- Micron Technology, Inc.
- Kamal M. Karda
- G11 - INFORMATION STORAGE
Information Patent Application
DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS
- Publication number 20240147729
- Publication date May 2, 2024
- Lodestar Licensing Group LLC
- Haitao Liu
- G11 - INFORMATION STORAGE
Information Patent Application
THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME
- Publication number 20230413559
- Publication date Dec 21, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHARGE STORAGE APPARATUS AND METHODS
- Publication number 20230269937
- Publication date Aug 24, 2023
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Comprising Vertical Channel Material and Havi...
- Publication number 20230171962
- Publication date Jun 1, 2023
- Micron Technology, Inc.
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Voids Along Regions of Gates, and Meth...
- Publication number 20220406785
- Publication date Dec 22, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Integrated Assemblies Having Conductive Material...
- Publication number 20220344350
- Publication date Oct 27, 2022
- Micron Technology, Inc.
- Hong Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays
- Publication number 20220320136
- Publication date Oct 6, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Stack of Horizontally Extending and Vertically Overlapping Features...
- Publication number 20220302015
- Publication date Sep 22, 2022
- Micron Technology, Inc.
- Sanh D. Tang
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICES INCLUDING VOID SPACES BETWEEN TRANSISTOR FEATURES, A...
- Publication number 20220302317
- Publication date Sep 22, 2022
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Transistor Body Regions Coupled to Car...
- Publication number 20220262813
- Publication date Aug 18, 2022
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES INCLUDING ELONGATE PILLARS OF ACCESS DEVICES
- Publication number 20220102351
- Publication date Mar 31, 2022
- Micron Technology, Inc.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC DEVICES INCLUDING TWO-DIMENSIONAL MATERIALS, AND RE...
- Publication number 20210375893
- Publication date Dec 2, 2021
- Micron Technology, Inc.
- Kamal M. Karda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies having Conductive Material Along Three of Fou...
- Publication number 20210351087
- Publication date Nov 11, 2021
- Micron Technology, Inc.
- Litao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Utilizing Etch-Stop Material During Fabrication of Capac...
- Publication number 20210327881
- Publication date Oct 21, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Shield Lines Between Digit Lines, and...
- Publication number 20210327883
- Publication date Oct 21, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Arrays Comprising Memory Cells
- Publication number 20210280586
- Publication date Sep 9, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Assemblies Having Conductive Structures Along Pillars of Semiconduc...
- Publication number 20210265500
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Voids Along Regions of Gates, and Meth...
- Publication number 20210265356
- Publication date Aug 26, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Structures Comprising Vertical Channel Material and Havi...
- Publication number 20210257387
- Publication date Aug 19, 2021
- Micron Technology, Inc.
- Guangyu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies Having Voids Along Regions of Gates, and Meth...
- Publication number 20210202489
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AN APPARATUS INCLUDING DEVICE STRUCTURES INCLUDI...
- Publication number 20210202487
- Publication date Jul 1, 2021
- Micron Technology, Inc.
- Song Guo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME
- Publication number 20210183887
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Memory Devices and Methods of Forming Memory Devices
- Publication number 20210183873
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Robert B. Goodwin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Array Of Capacitors, An Array Of Memory Cells, A Method Of Forming...
- Publication number 20210151440
- Publication date May 20, 2021
- Micron Technology, Inc.
- Sanh D. Tang
- H01 - BASIC ELECTRIC ELEMENTS

Sanh D. Tang

Person

Patents Grantslast 30 patents

Driver placement in memories having stacked memory arrays

Integrated assemblies having voids along regions of gates, and meth...

Transistor structures having conductive structures along pillars of...

Methods of forming integrated assemblies having conductive material...

Integrated structures comprising vertical channel material and havi...

Microelectronic devices including two-dimensional materials, and re...

Stack of horizontally extending and vertically overlapping features...

Apparatuses including elongate pillars of access devices

Integrated assemblies having transistor body regions coupled to car...

Memory arrays

Driver placement in memories having stacked memory arrays

Memory arrays

Array of capacitors, an array of memory cells, a method of forming...

Integrated assemblies comprising memory cells and shielding materia...

Three dimensional memory and methods of forming the same

Memory arrays comprising memory cells

Integrated assemblies having conductive material along three of fou...

Integrated assemblies having shield lines between digit lines, and...

Charge storage apparatus and methods

Integrated structures comprising vertical channel material and havi...

Integrated assemblies, and methods of forming integrated assemblies

Memory devices including void spaces between transistor features, a...

Array of recessed access gate lines

Integrated assemblies having voids along regions of gates, and meth...

Methods of forming integrated assemblies having conductive material...

Memory arrays

Access devices formed with conductive contacts

Stack of horizontally extending and vertically overlapping features...

Memory arrays

Integrated assemblies having transistor body regions coupled to car...

Patents Applicationslast 30 patents

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

Methods of Forming Integrated Assemblies Having Conductive Material...

Integrated Structures Comprising Vertical Channel Material and Havi...

STRING DRIVER ASSEMBLIES INCLUDING TWO-DIMENSIONAL MATERIALS, AND R...

Stack of Horizontally Extending and Vertically Overlapping Features...

Integrated Assemblies Having Transistor Body Regions Coupled to Car...

DRIVER PLACEMENT IN MEMORIES HAVING STACKED MEMORY ARRAYS

THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME

CHARGE STORAGE APPARATUS AND METHODS

Integrated Structures Comprising Vertical Channel Material and Havi...

Integrated Assemblies Having Voids Along Regions of Gates, and Meth...

Methods of Forming Integrated Assemblies Having Conductive Material...

Memory Arrays

Stack of Horizontally Extending and Vertically Overlapping Features...

MEMORY DEVICES INCLUDING VOID SPACES BETWEEN TRANSISTOR FEATURES, A...

Integrated Assemblies Having Transistor Body Regions Coupled to Car...

APPARATUSES INCLUDING ELONGATE PILLARS OF ACCESS DEVICES

MICROELECTRONIC DEVICES INCLUDING TWO-DIMENSIONAL MATERIALS, AND RE...

Integrated Assemblies having Conductive Material Along Three of Fou...

Methods of Utilizing Etch-Stop Material During Fabrication of Capac...

Integrated Assemblies Having Shield Lines Between Digit Lines, and...

Memory Arrays Comprising Memory Cells

Assemblies Having Conductive Structures Along Pillars of Semiconduc...

Integrated Assemblies Having Voids Along Regions of Gates, and Meth...

Integrated Structures Comprising Vertical Channel Material and Havi...

Integrated Assemblies Having Voids Along Regions of Gates, and Meth...

METHODS OF FORMING AN APPARATUS INCLUDING DEVICE STRUCTURES INCLUDI...

THREE DIMENSIONAL MEMORY AND METHODS OF FORMING THE SAME

Memory Devices and Methods of Forming Memory Devices

Array Of Capacitors, An Array Of Memory Cells, A Method Of Forming...