Sanjay Basak

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Phoenix, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Two-step chemical-mechanical planarization for damascene structures...
- Patent number 6,555,466
- Issue date Apr 29, 2003
- Speedfam Corporation
- Thomas Laursen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad conditioning for copper-based semiconductor wafers
- Patent number 6,387,188
- Issue date May 14, 2002
- SpeedFam-IPEC Corporation
- Thomas Laursen
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
Method for polishing copper on a workpiece surface
- Publication number 20060255016
- Publication date Nov 16, 2006
- Novellus Systems, Inc.
- Julia Svirchevski
- B24 - GRINDING POLISHING