Sanjay Dabral

Person

Cupertino, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 12,322,730
- Issue date Jun 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 12,261,132
- Issue date Mar 25, 2025
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable large system based on organic interconnect
- Patent number 12,237,269
- Issue date Feb 25, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling device using stored charge reverse recovery
- Patent number 12,176,803
- Issue date Dec 24, 2024
- Apple Inc.
- Chi Nung Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High density 3D interconnect configuration
- Patent number 12,159,835
- Issue date Dec 3, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Very fine pitch and wiring density organic side by side chiplet int...
- Patent number 12,119,304
- Issue date Oct 15, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 12,087,689
- Issue date Sep 10, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnecting dies by stitch routing
- Patent number 12,021,035
- Issue date Jun 25, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectable monolithic or external scalable die-to-die interconnecti...
- Patent number 11,862,557
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seal ring designs supporting efficient die to die routing
- Patent number 11,862,481
- Issue date Jan 2, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for implementing a scalable system
- Patent number 11,831,312
- Issue date Nov 28, 2023
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Structure and method for sealing a silicon IC
- Patent number 11,824,015
- Issue date Nov 21, 2023
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Decoupling device using stored charge reverse recovery
- Patent number 11,811,303
- Issue date Nov 7, 2023
- Apple Inc.
- Chi Nung Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,735,526
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,735,567
- Issue date Aug 22, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die stitching and harvesting of arrayed structures
- Patent number 11,728,266
- Issue date Aug 15, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management system switched capacitor voltage regulator with i...
- Patent number 11,699,949
- Issue date Jul 11, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die-to-die routing through a seal ring
- Patent number 11,476,203
- Issue date Oct 18, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for implementing a scalable system
- Patent number 11,309,895
- Issue date Apr 19, 2022
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High density 3D interconnect configuration
- Patent number 11,309,246
- Issue date Apr 19, 2022
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer reconstitution and die-stitching
- Patent number 11,158,607
- Issue date Oct 26, 2021
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management system switched capacitor voltage regulator with i...
- Patent number 11,101,732
- Issue date Aug 24, 2021
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for forming die sets with die-to-die routing an...
- Patent number 10,985,107
- Issue date Apr 20, 2021
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power management system switched capacitor voltage regulator with i...
- Patent number 10,756,622
- Issue date Aug 25, 2020
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for implementing a scalable system
- Patent number 10,742,217
- Issue date Aug 11, 2020
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flexible system integration to improve thermal properties
- Patent number 10,714,425
- Issue date Jul 14, 2020
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth routing for die to die interposer and on-chip applic...
- Patent number 10,566,286
- Issue date Feb 18, 2020
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnecting dies by stitch routing
- Patent number 10,438,896
- Issue date Oct 8, 2019
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Compact system with memory and PMU integration
- Patent number 10,311,938
- Issue date Jun 4, 2019
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High bandwidth routing for die to die interposer and on-chip applic...
- Patent number 10,217,708
- Issue date Feb 26, 2019
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20250157991
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
- Publication number 20250158619
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20250157940
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT SYSTEM SWITCHED CAPACITOR VOLTAGE REGULATOR WITH I...
- Publication number 20250158519
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- G05 - CONTROLLING REGULATING
Information Patent Application
Scalable Large System Based on Organic Interconnect
- Publication number 20250157936
- Publication date May 15, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer based...
- Publication number 20250112192
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power, Signaling and Thermal Path Co-optimization
- Publication number 20250112154
- Publication date Apr 3, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...
- Publication number 20250062236
- Publication date Feb 20, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20250046715
- Publication date Feb 6, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20250029921
- Publication date Jan 23, 2025
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20240387390
- Publication date Nov 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
- Publication number 20240103238
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- G02 - OPTICS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105702
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...
- Publication number 20240105704
- Publication date Mar 28, 2024
- Apple Inc.
- Chonghua Zhong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package with Local Interconnect and Chiplet Integration
- Publication number 20240105626
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding
- Publication number 20240105545
- Publication date Mar 28, 2024
- Apple Inc.
- Jiongxin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D System and Wafer Reconstitution with Mid-layer Interposer
- Publication number 20240105699
- Publication date Mar 28, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Seal Ring Designs Supporting Efficient Die to Die Routing
- Publication number 20240096648
- Publication date Mar 21, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling Device Using Stored Charge Reverse Recovery
- Publication number 20240088779
- Publication date Mar 14, 2024
- Apple Inc.
- Chi Nung Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20240047353
- Publication date Feb 8, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and Method for Sealing a Silicon IC
- Publication number 20240038689
- Publication date Feb 1, 2024
- Apple Inc.
- Vidhya Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM
- Publication number 20240039539
- Publication date Feb 1, 2024
- Apple Inc.
- Sanjay Dabral
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
WAFER RECONSTITUTION AND DIE-STITCHING
- Publication number 20240014178
- Publication date Jan 11, 2024
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES
- Publication number 20230402373
- Publication date Dec 14, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High Density 3D Interconnect Configuration
- Publication number 20230335494
- Publication date Oct 19, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MANAGEMENT SYSTEM SWITCHED CAPACITOR VOLTAGE REGULATOR WITH I...
- Publication number 20230299668
- Publication date Sep 21, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Scalable Large System Based on Organic Interconnect
- Publication number 20230299007
- Publication date Sep 21, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Decoupling Device Using Stored Charge Reverse Recovery
- Publication number 20230098000
- Publication date Mar 30, 2023
- Apple Inc.
- Chi Nung Ni
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Selectable Monolithic or External Scalable Die-to-Die Interconnecti...
- Publication number 20230085890
- Publication date Mar 23, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR INTERCONNECTING DIES
- Publication number 20230052432
- Publication date Feb 16, 2023
- Apple Inc.
- Sanjay Dabral
- H01 - BASIC ELECTRIC ELEMENTS

Sanjay Dabral

Person

Patents Grantslast 30 patents

Wafer reconstitution and die-stitching

Structure and method for sealing a silicon IC

Scalable large system based on organic interconnect

Decoupling device using stored charge reverse recovery

High density 3D interconnect configuration

Very fine pitch and wiring density organic side by side chiplet int...

Selectable monolithic or external scalable die-to-die interconnecti...

Interconnecting dies by stitch routing

Selectable monolithic or external scalable die-to-die interconnecti...

Seal ring designs supporting efficient die to die routing

Systems and methods for implementing a scalable system

Structure and method for sealing a silicon IC

Decoupling device using stored charge reverse recovery

High density 3D interconnect configuration

Wafer reconstitution and die-stitching

Die stitching and harvesting of arrayed structures

Power management system switched capacitor voltage regulator with i...

Die-to-die routing through a seal ring

Systems and methods for implementing a scalable system

High density 3D interconnect configuration

Wafer reconstitution and die-stitching

Power management system switched capacitor voltage regulator with i...

Systems and methods for forming die sets with die-to-die routing an...

Power management system switched capacitor voltage regulator with i...

Systems and methods for implementing a scalable system

Flexible system integration to improve thermal properties

High bandwidth routing for die to die interposer and on-chip applic...

Interconnecting dies by stitch routing

Compact system with memory and PMU integration

High bandwidth routing for die to die interposer and on-chip applic...

Patents Applicationslast 30 patents

WAFER RECONSTITUTION AND DIE-STITCHING

SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

POWER MANAGEMENT SYSTEM SWITCHED CAPACITOR VOLTAGE REGULATOR WITH I...

Scalable Large System Based on Organic Interconnect

3D System and Wafer Reconstitution with Mid-layer Interposer based...

Power, Signaling and Thermal Path Co-optimization

Very Fine Pitch and Wiring Density Organic Side by Side Chiplet Int...

High Density 3D Interconnect Configuration

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

SYSTEMS AND METHODS FOR INTERCONNECTING DIES

3D System and Wafer Reconstitution with Mid-layer Interposer

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

3D Package with Chip-on-Reconstituted Wafer or Reconstituted Wafer-...

Semiconductor Package with Local Interconnect and Chiplet Integration

Thermally Enhanced Chip-on-Wafer or Wafer-on-Wafer Bonding

3D System and Wafer Reconstitution with Mid-layer Interposer

Seal Ring Designs Supporting Efficient Die to Die Routing

Decoupling Device Using Stored Charge Reverse Recovery

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

Structure and Method for Sealing a Silicon IC

SYSTEMS AND METHODS FOR IMPLEMENTING A SCALABLE SYSTEM

WAFER RECONSTITUTION AND DIE-STITCHING

DIE STITCHING AND HARVESTING OF ARRAYED STRUCTURES

High Density 3D Interconnect Configuration

POWER MANAGEMENT SYSTEM SWITCHED CAPACITOR VOLTAGE REGULATOR WITH I...

Scalable Large System Based on Organic Interconnect

Decoupling Device Using Stored Charge Reverse Recovery

Selectable Monolithic or External Scalable Die-to-Die Interconnecti...

SYSTEMS AND METHODS FOR INTERCONNECTING DIES