TREA

Sanjay Dandia

Follow

Person

  • Sunnyvale, CA, US
People

Patents Grantslast 30 patents

  • Information Patent Grant

    Back side metallization
    • Patent number 11,488,922
    • Issue date Nov 1, 2022
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Back side metallization
    • Patent number 10,957,669
    • Issue date Mar 23, 2021
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Land pad design for high speed terminals
    • Patent number 10,636,736
    • Issue date Apr 28, 2020
    • Advanced Micro Devices, Inc.
    • Sanjay Dandia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Back side metallization
    • Patent number 10,431,562
    • Issue date Oct 1, 2019
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Circuit board socket with rail frame
    • Patent number 10,389,053
    • Issue date Aug 20, 2019
    • Advanced Micro Devices, Inc.
    • Stephen F. Heng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Back side metallization
    • Patent number 10,242,962
    • Issue date Mar 26, 2019
    • Advanced Micro Devices, Inc.
    • Thomas P. Dolbear
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Grant

    Circuit board socket with rail frame
    • Patent number 9,466,900
    • Issue date Oct 11, 2016
    • Advanced Micro Devices, Inc.
    • Stephen F. Heng
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Semiconductor chip package with stiffener frame and configured lid
    • Patent number 8,216,887
    • Issue date Jul 10, 2012
    • Advanced Micro Devices, Inc.
    • Stephen F. Heng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Socket assembly
    • Patent number D661667
    • Issue date Jun 12, 2012
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Circuit package lid
    • Patent number D658607
    • Issue date May 1, 2012
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Socket housing
    • Patent number D648688
    • Issue date Nov 15, 2011
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Socket assembly
    • Patent number D645426
    • Issue date Sep 20, 2011
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Circuit package lid
    • Patent number D641720
    • Issue date Jul 19, 2011
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Socket housing
    • Patent number D633880
    • Issue date Mar 8, 2011
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Socket frame
    • Patent number D633877
    • Issue date Mar 8, 2011
    • Advanced Micro Devices, Inc.
    • Stephen Heng
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    High performance flip-chip semiconductor device
    • Patent number 6,246,121
    • Issue date Jun 12, 2001
    • VLSI Technology, Inc.
    • Sanjay Dandia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Interconnect layout pattern for integrated circuit packages and the...
    • Patent number 6,198,635
    • Issue date Mar 6, 2001
    • VSLI Technology, Inc.
    • Jayarama N. Shenoy
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor die with staggered bond pads
    • Patent number 5,814,892
    • Issue date Sep 29, 1998
    • LSI Logic Corporation
    • Michael J. Steidl
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Progressive staggered bonding pads
    • Patent number 5,796,171
    • Issue date Aug 18, 1998
    • LSI Logic Corporation
    • Aydin Koc
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Vacuum chuck tool for a making a plastic-package ball-grid array in...
    • Patent number 5,753,070
    • Issue date May 19, 1998
    • LSI Logic Corporation
    • Sanjay Dandia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for making a surface-mount technology plastic-package ball-g...
    • Patent number 5,749,999
    • Issue date May 12, 1998
    • LSI Logic Corporation
    • Sanjay Dandia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wire bondable package design with maxium electrical performance and...
    • Patent number 5,691,568
    • Issue date Nov 25, 1997
    • LSI Logic Corporation
    • Tai-Yu Chou
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    BACK SIDE METALLIZATION
    • Publication number 20210183805
    • Publication date Jun 17, 2021
    • Thomas P. Dolbear
    • C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
  • Information Patent Application

    BACK SIDE METALLIZATION
    • Publication number 20190371758
    • Publication date Dec 5, 2019
    • ADVANCED MICRO DEVICES, INC.
    • Thomas P. Dolbear
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Land Pad Design for High Speed Terminals
    • Publication number 20190181087
    • Publication date Jun 13, 2019
    • ADVANCED MICRO DEVICES, INC.
    • Sanjay Dandia
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUIT BOARD SOCKET WITH RAIL FRAME
    • Publication number 20170104286
    • Publication date Apr 13, 2017
    • Stephen F. Heng
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Semiconductor Chip Package with Stiffener Frame and Configured Lid
    • Publication number 20100276799
    • Publication date Nov 4, 2010
    • Stephen F. Heng
    • H01 - BASIC ELECTRIC ELEMENTS