TREA

Sanjeev Jain

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  • Sunnyvale, CA, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    In-line wafer thickness sensing
    • Patent number 8,628,376
    • Issue date Jan 14, 2014
    • Applied Materials, Inc.
    • Garrett H. Sin
    • B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

  • Information Patent Application

    In-Line Wafer Thickness Sensing
    • Publication number 20100120333
    • Publication date May 13, 2010
    • Applied Materials, Inc.
    • Garrett H. Sin
    • B24 - GRINDING POLISHING