Sanjiv K. Mittal

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Fremont, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
High throughput interlevel dielectric gap filling process
- Patent number 5,279,865
- Issue date Jan 18, 1994
- Digital Equipment Corporation
- Robert P. Chebi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Surface planarization method for VLSI technology
- Patent number 4,775,550
- Issue date Oct 4, 1988
- Intel Corporation
- John K. Chu
- H01 - BASIC ELECTRIC ELEMENTS