Sanjoy Kumar Saha

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,943,931
- Issue date Apr 17, 2018
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High performance transient uniform cooling solution for thermal com...
- Patent number 9,434,029
- Issue date Sep 6, 2016
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat sink including extended surfaces
- Patent number 8,027,160
- Issue date Sep 27, 2011
- Dell Products L.P.
- Thoong Hung Seow
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS
- Publication number 20240349457
- Publication date Oct 17, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE
- Publication number 20240179832
- Publication date May 30, 2024
- Phil Geng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...
- Publication number 20240096741
- Publication date Mar 21, 2024
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...
- Publication number 20230307379
- Publication date Sep 28, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM
- Publication number 20230092972
- Publication date Mar 23, 2023
- Intel Corporation
- Phil GENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CRIMP A...
- Publication number 20230031457
- Publication date Feb 2, 2023
- Intel Corporation
- Phil Geng
- B21 - MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL PUNCHING...
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20170014957
- Publication date Jan 19, 2017
- Intel Corporation
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL (3D) INTEGRATED HEAT SPREADER FOR MULTICHIP PACKAGES
- Publication number 20150170989
- Publication date Jun 18, 2015
- Hemanth K. Dhavaleswarapu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...
- Publication number 20130299133
- Publication date Nov 14, 2013
- Zhihua Li
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat Sink
- Publication number 20100182751
- Publication date Jul 22, 2010
- Dell Products L.P.
- Thoong Hung Seow
- H01 - BASIC ELECTRIC ELEMENTS

Sanjoy Kumar Saha

Person

Patents Grantslast 30 patents

High performance transient uniform cooling solution for thermal com...

High performance transient uniform cooling solution for thermal com...

Heat sink including extended surfaces

Patents Applicationslast 30 patents

DAMPING ASSEMBLIES FOR HEAT SINKS AND RELATED METHODS

MULTI-ENTRY SOCKET POWER DELIVERY STRUCTURE AND BACKPLATE

COOLING SYSTEMS WITH MAIN AND REMOTE COOLING MASSES HAVING INTEGRAT...

BGA STIFFENER ATTACHMENT WITH LOW EOLIFE ADHESIVE STRENGTH AT HIGH...

DIMM COOLING ASSEMBLY WITH HEAT SPREADER ANTI-ROTATION MECHANISM

METHODS, SYSTEMS, APPARATUS, AND ARTICLES OF MANUFACTURE TO CRIMP A...

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

THREE-DIMENSIONAL (3D) INTEGRATED HEAT SPREADER FOR MULTICHIP PACKAGES

HIGH PERFORMANCE TRANSIENT UNIFORM COOLING SOLUTION FOR THERMAL COM...

Heat Sink