Sanka Ganesan

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Low cost embedded integrated circuit dies
- Patent number 12,368,089
- Issue date Jul 22, 2025
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies with direct attach to circuit boards
- Patent number 12,347,782
- Issue date Jul 1, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coreless electronic substrates having embedded inductors
- Patent number 12,334,242
- Issue date Jun 17, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,261,124
- Issue date Mar 25, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die architecture and method of making
- Patent number 12,224,245
- Issue date Feb 11, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 12,176,292
- Issue date Dec 24, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit assemblies with direct chip attach to circuit bo...
- Patent number 12,170,273
- Issue date Dec 17, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture of interconnect bridge...
- Patent number 12,142,568
- Issue date Nov 12, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on active silicon semiconductor packages
- Patent number 11,978,727
- Issue date May 7, 2024
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scalable high speed high bandwidth IO signaling package architectur...
- Patent number 11,869,842
- Issue date Jan 9, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,817,390
- Issue date Nov 14, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,804,426
- Issue date Oct 31, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
- Patent number 11,756,889
- Issue date Sep 12, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die ultrafine pitch patch architecture and method of making
- Patent number 11,694,959
- Issue date Jul 4, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,640,942
- Issue date May 2, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale thin 3D die stacked package
- Patent number 11,581,287
- Issue date Feb 14, 2023
- Intel Corporation
- Robert Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coupled cooling fins in ultra-small systems
- Patent number 11,574,851
- Issue date Feb 7, 2023
- Intel Corporation
- Aastha Uppal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with stud bump electrical connections
- Patent number 11,552,035
- Issue date Jan 10, 2023
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal management solutions for integrated circuit packages
- Patent number 11,545,407
- Issue date Jan 3, 2023
- Intel Corporation
- Kumar Abhishek Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wafer-level active die and external di...
- Patent number 11,545,441
- Issue date Jan 3, 2023
- Intel Corporation
- Vipul Vijay Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin, hyper-density semiconductor packages
- Patent number 11,430,724
- Issue date Aug 30, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked silicon die architecture with mixed flipcip and wirebond in...
- Patent number 11,410,919
- Issue date Aug 9, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interposer package-on-package (PoP) with solder array thermal contacts
- Patent number 11,387,175
- Issue date Jul 12, 2022
- Intel Corporation
- Debendra Mallik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic component having molded regions with through-mold vias
- Patent number 11,302,643
- Issue date Apr 12, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planar integrated circuit package interconnects
- Patent number 11,276,630
- Issue date Mar 15, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with stud bump electrical connections
- Patent number 11,127,706
- Issue date Sep 21, 2021
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit structures in package substrates
- Patent number 11,107,757
- Issue date Aug 31, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having wafer-level active die and external di...
- Patent number 10,910,317
- Issue date Feb 2, 2021
- Intel Corporation
- Vipul Vijay Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit packages
- Patent number 10,903,166
- Issue date Jan 26, 2021
- Intel IP Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rlink—die to die channel interconnect configurations to improve sig...
- Patent number 10,784,204
- Issue date Sep 22, 2020
- Intel Corporation
- Kemal Aygun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20250226323
- Publication date Jul 10, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20250118641
- Publication date Apr 10, 2025
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20250118698
- Publication date Apr 10, 2025
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20250070030
- Publication date Feb 27, 2025
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20250029929
- Publication date Jan 23, 2025
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...
- Publication number 20240088047
- Publication date Mar 14, 2024
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20240030116
- Publication date Jan 25, 2024
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20240030142
- Publication date Jan 25, 2024
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAN 3D POWER BLOCK
- Publication number 20230307441
- Publication date Sep 28, 2023
- Intel Corporation
- Ahmed ABOU-ALFOTOUH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
- Publication number 20230260914
- Publication date Aug 17, 2023
- Intel Corporation
- Sanka GANESAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGING USING EMBEDDED-IN-MOLD (EIM) OPTICAL MODULE INTEG...
- Publication number 20230204879
- Publication date Jun 29, 2023
- Intel Corporation
- Dowon Kim
- G02 - OPTICS
Information Patent Application
HYBRID BONDED STACKED MEMORY WITH TSV AS CHIPLET FOR PACKAGE STRUCTURE
- Publication number 20230207475
- Publication date Jun 29, 2023
- Intel Corporation
- Xavier F. BRUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED OPTICAL PACKAGE
- Publication number 20230194778
- Publication date Jun 22, 2023
- Intel Corporation
- Dowon KIM
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20230134770
- Publication date May 4, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20230138543
- Publication date May 4, 2023
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF L...
- Publication number 20230086356
- Publication date Mar 23, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE
- Publication number 20230089096
- Publication date Mar 23, 2023
- Intel Corporation
- Andrew COLLINS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES
- Publication number 20230086691
- Publication date Mar 23, 2023
- Intel Corporation
- Sriram Srinivasan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
- Publication number 20230088170
- Publication date Mar 23, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
- Publication number 20230082706
- Publication date Mar 16, 2023
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW COST EMBEDDED INTEGRATED CIRCUIT DIES
- Publication number 20230074181
- Publication date Mar 9, 2023
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INORGANIC REDISTRIBUTION LAYER ON ORGANIC SUBSTRATE IN INTEGRATED C...
- Publication number 20220375844
- Publication date Nov 24, 2022
- Intel Corporation
- Xavier Francois Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
- Publication number 20220344247
- Publication date Oct 27, 2022
- Intel Corporation
- Debendra MALLIK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20220293327
- Publication date Sep 15, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20220181262
- Publication date Jun 9, 2022
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH DIRECT CHIP ATTACH TO CIRCUIT BO...
- Publication number 20220173046
- Publication date Jun 2, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
- Publication number 20220157701
- Publication date May 19, 2022
- Intel Corporation
- Robert L. Sankman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE WITH STUD BUMP ELECTRICAL CONNECTIONS
- Publication number 20210366862
- Publication date Nov 25, 2021
- Intel Corporation
- Zhaozhi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
- Publication number 20210351116
- Publication date Nov 11, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
- Publication number 20210305162
- Publication date Sep 30, 2021
- Intel Corporation
- Sanka Ganesan
- H01 - BASIC ELECTRIC ELEMENTS

Sanka Ganesan

Person

Patents Grantslast 30 patents

Low cost embedded integrated circuit dies

Microelectronic assemblies with direct attach to circuit boards

Coreless electronic substrates having embedded inductors

Embedded die architecture and method of making

Embedded die architecture and method of making

Microelectronic component having molded regions with through-mold vias

Integrated circuit assemblies with direct chip attach to circuit bo...

Multi-die ultrafine pitch patch architecture of interconnect bridge...

Package on active silicon semiconductor packages

Scalable high speed high bandwidth IO signaling package architectur...

Microelectronic component having molded regions with through-mold vias

Integrated circuit structures in package substrates

Ultrathin bridge and multi-die ultrafine pitch patch architecture a...

Multi-die ultrafine pitch patch architecture and method of making

Microelectronic component having molded regions with through-mold vias

Chip scale thin 3D die stacked package

Coupled cooling fins in ultra-small systems

Electronic package with stud bump electrical connections

Thermal management solutions for integrated circuit packages

Semiconductor package having wafer-level active die and external di...

Ultra-thin, hyper-density semiconductor packages

Stacked silicon die architecture with mixed flipcip and wirebond in...

Interposer package-on-package (PoP) with solder array thermal contacts

Microelectronic component having molded regions with through-mold vias

Planar integrated circuit package interconnects

Electronic package with stud bump electrical connections

Integrated circuit structures in package substrates

Semiconductor package having wafer-level active die and external di...

Integrated circuit packages

Rlink—die to die channel interconnect configurations to improve sig...

Patents Applicationslast 30 patents

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

GAN 3D POWER BLOCK

MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING

OPTICAL PACKAGING USING EMBEDDED-IN-MOLD (EIM) OPTICAL MODULE INTEG...

HYBRID BONDED STACKED MEMORY WITH TSV AS CHIPLET FOR PACKAGE STRUCTURE

INTEGRATED OPTICAL PACKAGE

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF L...

MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE

MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES

MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...

MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS

LOW COST EMBEDDED INTEGRATED CIRCUIT DIES

INORGANIC REDISTRIBUTION LAYER ON ORGANIC SUBSTRATE IN INTEGRATED C...

ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES

CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS

INTEGRATED CIRCUIT ASSEMBLIES WITH DIRECT CHIP ATTACH TO CIRCUIT BO...

PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS

ELECTRONIC PACKAGE WITH STUD BUMP ELECTRICAL CONNECTIONS

INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES

MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS