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Sanka Ganesan
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Package on active silicon semiconductor packages
Patent number
11,978,727
Issue date
May 7, 2024
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scalable high speed high bandwidth IO signaling package architectur...
Patent number
11,869,842
Issue date
Jan 9, 2024
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,817,390
Issue date
Nov 14, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures in package substrates
Patent number
11,804,426
Issue date
Oct 31, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultrathin bridge and multi-die ultrafine pitch patch architecture a...
Patent number
11,756,889
Issue date
Sep 12, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-die ultrafine pitch patch architecture and method of making
Patent number
11,694,959
Issue date
Jul 4, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,640,942
Issue date
May 2, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip scale thin 3D die stacked package
Patent number
11,581,287
Issue date
Feb 14, 2023
Intel Corporation
Robert Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Coupled cooling fins in ultra-small systems
Patent number
11,574,851
Issue date
Feb 7, 2023
Intel Corporation
Aastha Uppal
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with stud bump electrical connections
Patent number
11,552,035
Issue date
Jan 10, 2023
Intel Corporation
Zhaozhi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Thermal management solutions for integrated circuit packages
Patent number
11,545,407
Issue date
Jan 3, 2023
Intel Corporation
Kumar Abhishek Singh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having wafer-level active die and external di...
Patent number
11,545,441
Issue date
Jan 3, 2023
Intel Corporation
Vipul Vijay Mehta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Ultra-thin, hyper-density semiconductor packages
Patent number
11,430,724
Issue date
Aug 30, 2022
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked silicon die architecture with mixed flipcip and wirebond in...
Patent number
11,410,919
Issue date
Aug 9, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interposer package-on-package (PoP) with solder array thermal contacts
Patent number
11,387,175
Issue date
Jul 12, 2022
Intel Corporation
Debendra Mallik
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Microelectronic component having molded regions with through-mold vias
Patent number
11,302,643
Issue date
Apr 12, 2022
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planar integrated circuit package interconnects
Patent number
11,276,630
Issue date
Mar 15, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic package with stud bump electrical connections
Patent number
11,127,706
Issue date
Sep 21, 2021
Intel Corporation
Zhaozhi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures in package substrates
Patent number
11,107,757
Issue date
Aug 31, 2021
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having wafer-level active die and external di...
Patent number
10,910,317
Issue date
Feb 2, 2021
Intel Corporation
Vipul Vijay Mehta
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit packages
Patent number
10,903,166
Issue date
Jan 26, 2021
Intel IP Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rlink—die to die channel interconnect configurations to improve sig...
Patent number
10,784,204
Issue date
Sep 22, 2020
Intel Corporation
Kemal Aygun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures in package substrates
Patent number
10,672,693
Issue date
Jun 2, 2020
Intel Corporation
Sanka Ganesan
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Edge-firing antenna walls built into substrate
Patent number
10,658,765
Issue date
May 19, 2020
Intel Corporation
Sri Chaitra Jyotsna Chavali
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density package interconnects
Patent number
10,658,279
Issue date
May 19, 2020
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Planar integrated circuit package interconnects
Patent number
10,651,116
Issue date
May 12, 2020
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Scalable package architecture and associated techniques and configu...
Patent number
10,580,758
Issue date
Mar 3, 2020
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Rlink-ground shielding attachment structures and shadow voiding for...
Patent number
10,396,036
Issue date
Aug 27, 2019
Intel Corporation
Yu Amos Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density package interconnects
Patent number
10,204,851
Issue date
Feb 12, 2019
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package on package architecture and method for making
Patent number
10,170,409
Issue date
Jan 1, 2019
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...
Publication number
20240088047
Publication date
Mar 14, 2024
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20240030116
Publication date
Jan 25, 2024
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20240030142
Publication date
Jan 25, 2024
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GAN 3D POWER BLOCK
Publication number
20230307441
Publication date
Sep 28, 2023
Intel Corporation
Ahmed ABOU-ALFOTOUH
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
Publication number
20230260914
Publication date
Aug 17, 2023
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL PACKAGING USING EMBEDDED-IN-MOLD (EIM) OPTICAL MODULE INTEG...
Publication number
20230204879
Publication date
Jun 29, 2023
Intel Corporation
Dowon Kim
G02 - OPTICS
Information
Patent Application
HYBRID BONDED STACKED MEMORY WITH TSV AS CHIPLET FOR PACKAGE STRUCTURE
Publication number
20230207475
Publication date
Jun 29, 2023
Intel Corporation
Xavier F. BRUN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED OPTICAL PACKAGE
Publication number
20230194778
Publication date
Jun 22, 2023
Intel Corporation
Dowon KIM
G02 - OPTICS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20230134770
Publication date
May 4, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20230138543
Publication date
May 4, 2023
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS CORE SUBSTRATE INCLUDING BUILDUPS WITH DIFFERENT NUMBERS OF L...
Publication number
20230086356
Publication date
Mar 23, 2023
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTIPLE DIES COUPLED WITH A GLASS CORE SUBSTRATE
Publication number
20230089096
Publication date
Mar 23, 2023
Intel Corporation
Andrew COLLINS
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING SOLDER AND NON-SOLDER INTERCON...
Publication number
20230088170
Publication date
Mar 23, 2023
Intel Corporation
Xavier Francois Brun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING BRIDGES
Publication number
20230086691
Publication date
Mar 23, 2023
Intel Corporation
Sriram Srinivasan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC ASSEMBLIES WITH DIRECT ATTACH TO CIRCUIT BOARDS
Publication number
20230082706
Publication date
Mar 16, 2023
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LOW COST EMBEDDED INTEGRATED CIRCUIT DIES
Publication number
20230074181
Publication date
Mar 9, 2023
Intel Corporation
Xavier Francois Brun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INORGANIC REDISTRIBUTION LAYER ON ORGANIC SUBSTRATE IN INTEGRATED C...
Publication number
20220375844
Publication date
Nov 24, 2022
Intel Corporation
Xavier Francois Brun
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRA-THIN, HYPER-DENSITY SEMICONDUCTOR PACKAGES
Publication number
20220344247
Publication date
Oct 27, 2022
Intel Corporation
Debendra MALLIK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CORELESS ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
Publication number
20220293327
Publication date
Sep 15, 2022
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20220181262
Publication date
Jun 9, 2022
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT ASSEMBLIES WITH DIRECT CHIP ATTACH TO CIRCUIT BO...
Publication number
20220173046
Publication date
Jun 2, 2022
Intel Corporation
Wilfred Gomes
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLANAR INTEGRATED CIRCUIT PACKAGE INTERCONNECTS
Publication number
20220157701
Publication date
May 19, 2022
Intel Corporation
Robert L. Sankman
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC PACKAGE WITH STUD BUMP ELECTRICAL CONNECTIONS
Publication number
20210366862
Publication date
Nov 25, 2021
Intel Corporation
Zhaozhi Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES IN PACKAGE SUBSTRATES
Publication number
20210351116
Publication date
Nov 11, 2021
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MICROELECTRONIC COMPONENT HAVING MOLDED REGIONS WITH THROUGH-MOLD VIAS
Publication number
20210305162
Publication date
Sep 30, 2021
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED DIE ARCHITECTURE AND METHOD OF MAKING
Publication number
20210193579
Publication date
Jun 24, 2021
Intel Corporation
Sanka Ganesan
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE HAVING WAFER-LEVEL ACTIVE DIE AND EXTERNAL DI...
Publication number
20210082826
Publication date
Mar 18, 2021
Intel Corporation
Vipul Vijay MEHTA
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ULTRATHIN BRIDGE AND MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE A...
Publication number
20210043570
Publication date
Feb 11, 2021
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-DIE ULTRAFINE PITCH PATCH ARCHITECTURE AND METHOD OF MAKING
Publication number
20210035911
Publication date
Feb 4, 2021
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SCALABLE HIGH SPEED HIGH BANDWIDTH IO SIGNALING PACKAGE ARCHITECTUR...
Publication number
20210028116
Publication date
Jan 28, 2021
Intel Corporation
Sanka GANESAN
H01 - BASIC ELECTRIC ELEMENTS