Sankar Paul

Person

Bradford, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Circuit materials with improved fire retardant system and articles...
- Patent number 10,104,769
- Issue date Oct 16, 2018
- Rogers Corporation
- William F. Scholz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dielectric bond plies for circuits and multilayer circuits, and met...
- Patent number 9,918,384
- Issue date Mar 13, 2018
- Rogers Corporation
- Dirk M. Baars
- B44 - DECORATIVE ARTS
Information Patent Grant
Dielectric materials, methods of forming subassemblies therefrom, a...
- Patent number 9,265,160
- Issue date Feb 16, 2016
- Rogers Corporation
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dielectric bond plies for circuits and multilayer circuits, and met...
- Patent number 8,809,690
- Issue date Aug 19, 2014
- Rogers Corporation
- Dirk M. Baars
- B44 - DECORATIVE ARTS
Information Patent Grant
Circuit materials with improved bond, method of manufacture thereof...
- Patent number 8,722,192
- Issue date May 13, 2014
- World Properties, Inc.
- Sankar K. Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Dielectric materials, methods of forming subassemblies therefrom, a...
- Patent number 8,632,874
- Issue date Jan 21, 2014
- Rogers Corporation
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit materials with improved bond, method of manufacture thereof...
- Patent number 8,519,273
- Issue date Aug 27, 2013
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit materials with improved bond, method of manufacture thereof...
- Patent number 8,431,222
- Issue date Apr 30, 2013
- World Properties, Inc.
- Sankar K. Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Organosilicon copolymer composites, method of manufacture, and arti...
- Patent number 8,349,460
- Issue date Jan 8, 2013
- World Properties, Inc.
- Sankar K. Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit materials with improved bond, method of manufacture thereof...
- Patent number 8,257,820
- Issue date Sep 4, 2012
- World Properties, Inc.
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Grant
Circuit materials, circuits laminates, and method of manufacture th...
- Patent number 8,187,696
- Issue date May 29, 2012
- World Properties, Inc.
- Sankar K. Paul
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Liquid crystalline polymer composites, method of manufacture thereo...
- Patent number 6,994,896
- Issue date Feb 7, 2006
- World Properties, Inc.
- Murali Sethumadhavan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT MATERIALS WITH IMPROVED FIRE RETARDANT SYSTEM AND ARTICLES...
- Publication number 20150351237
- Publication date Dec 3, 2015
- Rogers Corporation
- William F. Scholz
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND MET...
- Publication number 20140318698
- Publication date Oct 30, 2014
- Dirk M. Baars
- B44 - DECORATIVE ARTS
Information Patent Application
DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...
- Publication number 20140090767
- Publication date Apr 3, 2014
- Sankar Paul
- B32 - LAYERED PRODUCTS
Information Patent Application
CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...
- Publication number 20130034725
- Publication date Feb 7, 2013
- World Properties, Inc.
- Sankar K. Paul
- B32 - LAYERED PRODUCTS
Information Patent Application
DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND MET...
- Publication number 20110214906
- Publication date Sep 8, 2011
- Rogers Corporation
- Dirk M. Baars
- B44 - DECORATIVE ARTS
Information Patent Application
CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...
- Publication number 20110031003
- Publication date Feb 10, 2011
- Rogers Corporation
- Sankar Paul
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...
- Publication number 20100307803
- Publication date Dec 9, 2010
- Sankar Paul
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ORGANOSILICON COPOLYMER COMPOSITES, METHOD OF MANUFACTURE, AND ARTI...
- Publication number 20100255319
- Publication date Oct 7, 2010
- SANKAR K. PAUL
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE TH...
- Publication number 20100015404
- Publication date Jan 21, 2010
- World Properties, Inc.
- Sankar K. Paul
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...
- Publication number 20090191387
- Publication date Jul 30, 2009
- Sankar Paul
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...
- Publication number 20080038528
- Publication date Feb 14, 2008
- World Properties, Inc.
- Sankar K. Paul
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Circuit board materials with improved bond to conductive metals and...
- Publication number 20070093035
- Publication date Apr 26, 2007
- Robert C. Daigle
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrically conductive pressure sensitive adhesives, method of man...
- Publication number 20050062024
- Publication date Mar 24, 2005
- Michael D. Bessette
- B82 - NANO-TECHNOLOGY
Information Patent Application
Electrically conductive, flame retardant fillers, method of manufac...
- Publication number 20050059754
- Publication date Mar 17, 2005
- Michael S. Lunt
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Liquid crystalline polymer composites, method of manufacture thereo...
- Publication number 20040124405
- Publication date Jul 1, 2004
- Murali Sethumadhavan
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Sankar Paul

Person

Patents Grantslast 30 patents

Circuit materials with improved fire retardant system and articles...

Dielectric bond plies for circuits and multilayer circuits, and met...

Dielectric materials, methods of forming subassemblies therefrom, a...

Dielectric bond plies for circuits and multilayer circuits, and met...

Circuit materials with improved bond, method of manufacture thereof...

Dielectric materials, methods of forming subassemblies therefrom, a...

Circuit materials with improved bond, method of manufacture thereof...

Circuit materials with improved bond, method of manufacture thereof...

Organosilicon copolymer composites, method of manufacture, and arti...

Circuit materials with improved bond, method of manufacture thereof...

Circuit materials, circuits laminates, and method of manufacture th...

Liquid crystalline polymer composites, method of manufacture thereo...

Patents Applicationslast 30 patents

CIRCUIT MATERIALS WITH IMPROVED FIRE RETARDANT SYSTEM AND ARTICLES...

DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND MET...

DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...

CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...

DIELECTRIC BOND PLIES FOR CIRCUITS AND MULTILAYER CIRCUITS, AND MET...

CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...

DIELECTRIC MATERIALS, METHODS OF FORMING SUBASSEMBLIES THEREFROM, A...

ORGANOSILICON COPOLYMER COMPOSITES, METHOD OF MANUFACTURE, AND ARTI...

CIRCUIT MATERIALS, CIRCUITS LAMINATES, AND METHOD OF MANUFACTURE TH...

CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...

CIRCUIT MATERIALS WITH IMPROVED BOND, METHOD OF MANUFACTURE THEREOF...

Circuit board materials with improved bond to conductive metals and...

Electrically conductive pressure sensitive adhesives, method of man...

Electrically conductive, flame retardant fillers, method of manufac...

Liquid crystalline polymer composites, method of manufacture thereo...