Santhiran Nadarajah

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Die attach pad for use in semiconductor manufacturing and method of...
- Patent number 7,227,245
- Issue date Jun 5, 2007
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced solder joint strength and ease of inspection of leadless l...
- Patent number 7,023,074
- Issue date Apr 4, 2006
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe packaging panel featuring peripheral dummy leads
- Patent number 7,002,239
- Issue date Feb 21, 2006
- National Semiconductor Corporation
- Santhiran Nadarajah
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking of mold compound to conductive substrate panels
- Patent number 6,963,124
- Issue date Nov 8, 2005
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe package design that provides a greater structura...
- Patent number 6,933,174
- Issue date Aug 23, 2005
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced solder joint strength and ease of inspection of leadless l...
- Patent number 6,872,599
- Issue date Mar 29, 2005
- National Semiconductor Corporation
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe package design that provides a greater structura...
- Patent number 6,818,970
- Issue date Nov 16, 2004
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking of mold compound to conductive substrate panels
- Patent number 6,808,961
- Issue date Oct 26, 2004
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking lead tips and die attach pad for a leadless package apparat...
- Patent number 6,686,652
- Issue date Feb 3, 2004
- National Semiconductor
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless leadframe package design that provides a greater structura...
- Patent number 6,677,667
- Issue date Jan 13, 2004
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Locking of mold compound to conductive substrate panels
- Patent number 6,576,989
- Issue date Jun 10, 2003
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance leadless package
- Patent number 6,452,255
- Issue date Sep 17, 2002
- National Semiconductor, Corp.
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pin indicator for leadless leadframe packages
- Patent number 6,448,107
- Issue date Sep 10, 2002
- National Semiconductor Corporation
- Harry Kam Cheng Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical isolation in panels of leadless IC packages
- Patent number 6,399,415
- Issue date Jun 4, 2002
- National Semiconductor Corporation
- Jaime Bayan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SAWN POWER PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20080096319
- Publication date Apr 24, 2008
- National Semiconductor Corporation
- Tan Eng Hwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced solder joint strength and ease of inspection of leadless l...
- Publication number 20050116321
- Publication date Jun 2, 2005
- National Semiconductor Corporation, A Delaware Corp.
- Felix C. Li
- H01 - BASIC ELECTRIC ELEMENTS

Santhiran Nadarajah

Person

Patents Grantslast 30 patents

Die attach pad for use in semiconductor manufacturing and method of...

Enhanced solder joint strength and ease of inspection of leadless l...

Leadless leadframe packaging panel featuring peripheral dummy leads

Locking of mold compound to conductive substrate panels

Leadless leadframe package design that provides a greater structura...

Enhanced solder joint strength and ease of inspection of leadless l...

Leadless leadframe package design that provides a greater structura...

Locking of mold compound to conductive substrate panels

Locking lead tips and die attach pad for a leadless package apparat...

Leadless leadframe package design that provides a greater structura...

Locking of mold compound to conductive substrate panels

Low inductance leadless package

Pin indicator for leadless leadframe packages

Electrical isolation in panels of leadless IC packages

Patents Applicationslast 30 patents

SAWN POWER PACKAGE AND METHOD OF FABRICATING SAME

Enhanced solder joint strength and ease of inspection of leadless l...