Santhiran S/O Nadarajah

Person

Melaka, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Sawn power package and method of fabricating same
- Patent number 7,470,978
- Issue date Dec 30, 2008
- National Semiconductor Corporation
- Eng Hwa Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for miniature semiconductor packages
- Patent number 7,419,855
- Issue date Sep 2, 2008
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sawn power package
- Patent number 7,342,297
- Issue date Mar 11, 2008
- National Semiconductor Corporation
- Eng Hwa Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding on thinned portions of a lead-frame configured for use...
- Patent number 7,259,460
- Issue date Aug 21, 2007
- National Semiconductor Corporation
- Jamie A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress relieving film for semiconductor packages
- Patent number 7,187,075
- Issue date Mar 6, 2007
- National Semiconductor Corporation
- Tan Eng Hwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a micro-array integrated circuit package
- Patent number 7,186,588
- Issue date Mar 6, 2007
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for miniature semiconductor packages
- Patent number 7,161,232
- Issue date Jan 9, 2007
- National Semiconductor Corporation
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die attach region for use in a micro-array integrated circuit package
- Patent number 7,064,419
- Issue date Jun 20, 2006
- National Semiconductor Corporation
- Jaime A. Bayan
- H01 - BASIC ELECTRIC ELEMENTS

Santhiran S/O Nadarajah

Person

Patents Grantslast 30 patents

Sawn power package and method of fabricating same

Apparatus and method for miniature semiconductor packages

Sawn power package

Wire bonding on thinned portions of a lead-frame configured for use...

Stress relieving film for semiconductor packages

Method of fabricating a micro-array integrated circuit package

Apparatus and method for miniature semiconductor packages

Die attach region for use in a micro-array integrated circuit package