Santosh Pabba

Follow

Person

Aloha, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package for a semiconductor die, method for making a die packaging...
- Patent number 10,483,177
- Issue date Nov 19, 2019
- Intel Corporation
- Bassam Ziadeh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURES FOR MICRO LED LASER RELEASE
- Publication number 20230049007
- Publication date Feb 16, 2023
- Intel Corporation
- Khaled Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package for a semiconductor die, method for making a die packaging...
- Publication number 20190006251
- Publication date Jan 3, 2019
- Intel Corporation
- Bassam Ziadeh
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR