Sao-Ling Chiu

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of semiconductor package
- Patent number 12,283,541
- Issue date Apr 22, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method thereof
- Patent number 12,170,237
- Issue date Dec 17, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional integrated circuit structures and methods of form...
- Patent number 12,113,027
- Issue date Oct 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through Chip-On-Wafer-On-Substrate
- Patent number 11,967,546
- Issue date Apr 23, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,916,009
- Issue date Feb 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure
- Patent number 11,901,306
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming same
- Patent number 11,810,793
- Issue date Nov 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Giga interposer integration through chip-on-wafer-on-substrate
- Patent number 11,728,254
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Board substrates, three-dimensional integrated circuit structures a...
- Patent number 11,728,278
- Issue date Aug 15, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,715,675
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,715,681
- Issue date Aug 1, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of manufacturing the same
- Patent number 11,552,054
- Issue date Jan 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages and methods of forming the same
- Patent number 11,545,438
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating semiconductor st...
- Patent number 11,502,043
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semicondutor packages and methods of forming same
- Patent number 11,495,472
- Issue date Nov 8, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,373,946
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,302,600
- Issue date Apr 12, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with interposers and methods for forming the same
- Patent number 11,152,312
- Issue date Oct 19, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sao-Ling Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 11,107,758
- Issue date Aug 31, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,978,346
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for fabricating semiconductor st...
- Patent number 10,978,404
- Issue date Apr 13, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,854,567
- Issue date Dec 1, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D packages and methods for forming the same
- Patent number 10,529,679
- Issue date Jan 7, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 10,510,648
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive vias in semiconductor packages and methods of forming same
- Patent number 10,510,603
- Issue date Dec 17, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 10,163,770
- Issue date Dec 25, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packages with interposers and methods for forming the same
- Patent number 9,984,981
- Issue date May 29, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sao-Ling Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package structure and method
- Patent number 9,953,911
- Issue date Apr 24, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated fan-out package and method of fabricating the same
- Patent number 9,824,902
- Issue date Nov 21, 2017
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hao-Cheng Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-on-wafer process control monitoring for chip-on-wafer-on-subst...
- Patent number 9,786,567
- Issue date Oct 10, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wei-Cheng Wu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20250218922
- Publication date Jul 3, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME
- Publication number 20250149486
- Publication date May 8, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yao-Jen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20250069980
- Publication date Feb 27, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20240371782
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20240222242
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE
- Publication number 20240153861
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...
- Publication number 20230335502
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20230326826
- Publication date Oct 12, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE
- Publication number 20230112229
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Packages and Methods of Forming Same
- Publication number 20220367208
- Publication date Nov 17, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE
- Publication number 20220359355
- Publication date Nov 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20220336362
- Publication date Oct 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220293508
- Publication date Sep 15, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220189844
- Publication date Jun 16, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210407963
- Publication date Dec 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Ting Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20210391242
- Publication date Dec 16, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Giga Interposer Integration through Chip-On-Wafer-On-Substrate
- Publication number 20210366814
- Publication date Nov 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20210327723
- Publication date Oct 21, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210305145
- Publication date Sep 30, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chi-Ming Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR ST...
- Publication number 20210233863
- Publication date Jul 29, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chung-Yu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20210202389
- Publication date Jul 1, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Yen Hsieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20210193550
- Publication date Jun 24, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wensen Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR ST...
- Publication number 20210057350
- Publication date Feb 25, 2021
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOARD SUBSTRATES, THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES A...
- Publication number 20200312770
- Publication date Oct 1, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chung-Yu Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Packages and Methods for Forming the Same
- Publication number 20200126938
- Publication date Apr 23, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shang-Yun Hou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20200051900
- Publication date Feb 13, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20200006143
- Publication date Jan 2, 2020
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fan-Out Package Structure and Method
- Publication number 20190148277
- Publication date May 16, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Tzu-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME
- Publication number 20190067104
- Publication date Feb 28, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sung-Hui Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packages with Interposers and Methods for Forming the Same
- Publication number 20180277495
- Publication date Sep 27, 2018
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sao-Ling Chiu
- H01 - BASIC ELECTRIC ELEMENTS

Sao-Ling Chiu

Person

Patents Grantslast 30 patents

Manufacturing method of semiconductor package

Semiconductor structure and manufacturing method thereof

Three-dimensional integrated circuit structures and methods of form...

Giga interposer integration through Chip-On-Wafer-On-Substrate

Semiconductor package and manufacturing method thereof

Semiconductor structure

Semiconductor packages and methods of forming same

Giga interposer integration through chip-on-wafer-on-substrate

Board substrates, three-dimensional integrated circuit structures a...

Semiconductor device and manufacturing method thereof

Fan-out package structure and method

Package structure and method of manufacturing the same

Semiconductor packages and methods of forming the same

Semiconductor structure and method for fabricating semiconductor st...

Semicondutor packages and methods of forming same

Semiconductor package and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Packages with interposers and methods for forming the same

Fan-out package structure and method

Conductive vias in semiconductor packages and methods of forming same

Semiconductor structure and method for fabricating semiconductor st...

3D packages and methods for forming the same

3D packages and methods for forming the same

Fan-out package structure and method

Conductive vias in semiconductor packages and methods of forming same

Fan-out package structure and method

Packages with interposers and methods for forming the same

Fan-out package structure and method

Integrated fan-out package and method of fabricating the same

Chip-on-wafer process control monitoring for chip-on-wafer-on-subst...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE

THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES AND METHODS OF FORM...

SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE

Semiconductor Packages and Methods of Forming Same

GIGA INTERPOSER INTEGRATION THROUGH CHIP-ON-WAFER-ON-SUBSTRATE

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

Fan-Out Package Structure and Method

Giga Interposer Integration through Chip-On-Wafer-On-Substrate

SEMICONDUTOR PACKAGES AND METHODS OF FORMING SAME

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR ST...

SEMICONDUCTOR PACKAGES AND METHODS OF FORMING THE SAME

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR STRUCTURE AND METHOD FOR FABRICATING SEMICONDUCTOR ST...

BOARD SUBSTRATES, THREE-DIMENSIONAL INTEGRATED CIRCUIT STRUCTURES A...

3D Packages and Methods for Forming the Same

Fan-Out Package Structure and Method

CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

Fan-Out Package Structure and Method

CONDUCTIVE VIAS IN SEMICONDUCTOR PACKAGES AND METHODS OF FORMING SAME

Packages with Interposers and Methods for Forming the Same