Saori INOUE

Person

Omuta-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Composite sheet and method for manufacturing same, and laminate and...
- Patent number 11,912,011
- Issue date Feb 27, 2024
- DENKA COMPANY LIMITED
- Yoshitaka Minakata
- B32 - LAYERED PRODUCTS
Information Patent Grant
Nitride ceramic resin composite body
- Patent number 11,492,299
- Issue date Nov 8, 2022
- DENKA COMPANY LIMITED
- Yoshitaka Minakata
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Thermal conductive member and heat dissipation structure including...
- Patent number 11,034,623
- Issue date Jun 15, 2021
- DENKA COMPANY LIMITED
- Saori Inoue
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Heat dissipation structure for electric circuit device
- Patent number 10,615,096
- Issue date Apr 7, 2020
- Denka Company Limited
- Toshitaka Yamagata
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phosphor and application therefor
- Patent number 10,519,370
- Issue date Dec 31, 2019
- Denka Company Limited
- Saori Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ceramic resin composite body
- Patent number 10,487,013
- Issue date Nov 26, 2019
- DENKA COMPANY LIMITED
- Taiki Nishi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Boron nitride/resin composite circuit board, and circuit board incl...
- Patent number 9,516,741
- Issue date Dec 6, 2016
- Denka Company Limited
- Hideki Hirotsuru
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR
- Publication number 20240064895
- Publication date Feb 22, 2024
- DENKA COMPANY LIMITED
- Kenji MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE AND PRODUCTION METHOD FOR COMPOSITE
- Publication number 20230271888
- Publication date Aug 31, 2023
- Denka Company Limited
- Nobuya SUZUKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE BODY AND LAYERED BODY
- Publication number 20230227370
- Publication date Jul 20, 2023
- Denka Company Limited
- Nobuya SUZUKI
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
SEMICURED PRODUCT COMPLEX AND METHOD FOR PRODUCING SAME, CURED PROD...
- Publication number 20230122917
- Publication date Apr 20, 2023
- Denka Company Limited
- Eri KANEKO
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COMPOSITE SHEET AND METHOD FOR MANUFACTURING SAME, AND LAMINATE AND...
- Publication number 20220410530
- Publication date Dec 29, 2022
- Denka Company Limited
- Yoshitaka MINAKATA
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING COMPOSITE BODY
- Publication number 20220250994
- Publication date Aug 11, 2022
- Denka Company Limited
- Saori INOUE
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COMPOSITE, METHOD FOR PRODUCING COMPOSITE, LAMINATE, AND METHOD FOR...
- Publication number 20220194870
- Publication date Jun 23, 2022
- Denka Company Limited
- Yoshitaka MINAKATA
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
COMPOSITE BODY
- Publication number 20220177375
- Publication date Jun 9, 2022
- Denka Company Limited
- Saori INOUE
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
NITRIDE CERAMIC RESIN COMPOSITE BODY
- Publication number 20210032171
- Publication date Feb 4, 2021
- DENKA COMPANY LIMITED
- Yoshitaka MINAKATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TEMPORARY BONDING BODY OF CERAMIC RESIN COMPOSITE AND METAL PLATE,...
- Publication number 20200406586
- Publication date Dec 31, 2020
- DENKA COMPANY LIMITED
- Yoshitaka MINAKATA
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMAL CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE INCLUDING...
- Publication number 20200031723
- Publication date Jan 30, 2020
- DENKA COMPANY LIMITED
- Saori INOUE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION STRUCTURE FOR ELECTRIC CIRCUIT DEVICE
- Publication number 20190189534
- Publication date Jun 20, 2019
- DENKA COMPANY LIMITED
- Toshitaka YAMAGATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC RESIN COMPOSITE BODY
- Publication number 20190092695
- Publication date Mar 28, 2019
- DENKA COMPANY LIMITED
- Taiki Nishi
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
PHOSPHOR AND APPLICATION THEREFOR
- Publication number 20180265781
- Publication date Sep 20, 2018
- Denka Company Limited
- Saori Inoue
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCL...
- Publication number 20160227644
- Publication date Aug 4, 2016
- Denka Company Limited
- Hideki HIROTSURU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Saori INOUE

Person

Patents Grantslast 30 patents

Composite sheet and method for manufacturing same, and laminate and...

Nitride ceramic resin composite body

Thermal conductive member and heat dissipation structure including...

Heat dissipation structure for electric circuit device

Phosphor and application therefor

Ceramic resin composite body

Boron nitride/resin composite circuit board, and circuit board incl...

Patents Applicationslast 30 patents

CIRCUIT BOARD AND METHOD OF PRODUCTION THEREFOR

COMPOSITE AND PRODUCTION METHOD FOR COMPOSITE

COMPOSITE BODY AND LAYERED BODY

SEMICURED PRODUCT COMPLEX AND METHOD FOR PRODUCING SAME, CURED PROD...

COMPOSITE SHEET AND METHOD FOR MANUFACTURING SAME, AND LAMINATE AND...

METHOD FOR PRODUCING COMPOSITE BODY

COMPOSITE, METHOD FOR PRODUCING COMPOSITE, LAMINATE, AND METHOD FOR...

COMPOSITE BODY

NITRIDE CERAMIC RESIN COMPOSITE BODY

TEMPORARY BONDING BODY OF CERAMIC RESIN COMPOSITE AND METAL PLATE,...

THERMAL CONDUCTIVE MEMBER AND HEAT DISSIPATION STRUCTURE INCLUDING...

HEAT DISSIPATION STRUCTURE FOR ELECTRIC CIRCUIT DEVICE

CERAMIC RESIN COMPOSITE BODY

PHOSPHOR AND APPLICATION THEREFOR

BORON NITRIDE/RESIN COMPOSITE CIRCUIT BOARD, AND CIRCUIT BOARD INCL...