Saptarshi Das

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Willowbrook, IL, US

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Patents Grantslast 30 patents

Information Patent Grant
Methods for top-down fabrication of wafer scale TMDC monolayers
- Patent number 9,809,903
- Issue date Nov 7, 2017
- UChicago Argonne, LLC
- Saptarshi Das
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
All 2D, high mobility, flexible, transparent thin film transistor
- Patent number 9,548,394
- Issue date Jan 17, 2017
- UChicago Argonne, LLC
- Saptarshi Das
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SYSTEMS AND METHODS FOR TOP-DOWN FABRICATION OF WAFER SCALE TMDC MO...
- Publication number 20170253996
- Publication date Sep 7, 2017
- UChicago Argonne, LLC
- Saptarshi Das
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ALL 2D, HIGH MOBILITY, FLEXIBLE, TRANSPARENT THIN FILM TRANSISTOR
- Publication number 20150303315
- Publication date Oct 22, 2015
- UChicago Argonne, LLC
- Saptarshi Das
- H01 - BASIC ELECTRIC ELEMENTS