SARAH HANEY

Person

APEX, NC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Hermetic encapsulation for microelectromechanical systems (MEMS) de...
- Patent number 10,179,729
- Issue date Jan 15, 2019
- Intel Corporation
- Sarah K. Haney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Floating bond pad for power semiconductor devices
- Patent number 10,068,834
- Issue date Sep 4, 2018
- Cree, Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
mmWave antennas and transmission lines on standard substrate materials
- Patent number 10,033,093
- Issue date Jul 24, 2018
- Intel Corporation
- Adel A. Elsherbini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnet placement for integrated sensor packages
- Patent number 9,791,470
- Issue date Oct 17, 2017
- Intel Corporation
- Feras Eid
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Device, system and method for providing MEMS structures of a semico...
- Patent number 9,505,610
- Issue date Nov 29, 2016
- Intel Corporation
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integration of pressure sensors into integrated circuit fabrication...
- Patent number 9,501,068
- Issue date Nov 22, 2016
- Intel Corporation
- Kyu Oh Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Magnetic field shielding for packaging build-up architectures
- Patent number 9,345,184
- Issue date May 17, 2016
- Intel Corporation
- Sasha Oster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bidirectional silicon carbide transient voltage supression devices
- Patent number 9,312,256
- Issue date Apr 12, 2016
- Cree, Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of pressure or inertial sensors into integrated circuit...
- Patent number 9,260,294
- Issue date Feb 16, 2016
- Intel Corporation
- Kyu Oh Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Hermetic encapsulation for microelectromechanical systems (MEMS) de...
- Patent number 9,242,854
- Issue date Jan 26, 2016
- Intel Corporation
- Sarah K. Haney
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bidirectional silicon carbide transient voltage suppression devices
- Patent number 8,445,917
- Issue date May 21, 2013
- Cree, Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor transistor with P type re-grown channel layer
- Patent number 7,795,691
- Issue date Sep 14, 2010
- Cree, Inc.
- Qingchun Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...
- Publication number 20170022050
- Publication date Jan 26, 2017
- Sarah K. HANEY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATION OF PRESSURE SENSORS INTO INTEGRATED CIRCUIT FABRICATION...
- Publication number 20160161957
- Publication date Jun 9, 2016
- Intel Corporation
- KYU OH LEE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
IN-PACKAGE TEMPERATURE SENSOR AND METHODS THEREFOR
- Publication number 20150355035
- Publication date Dec 10, 2015
- Intel Corporation
- Feras Eid
- G01 - MEASURING TESTING
Information Patent Application
HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...
- Publication number 20150291415
- Publication date Oct 15, 2015
- Sarah K. HANEY
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ARRANGEMENT OF THROUGH-HOLE STRUCTURES OF A SEMICONDUCTOR PACKAGE
- Publication number 20150217995
- Publication date Aug 6, 2015
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MAGNET PLACEMENT FOR INTEGRATED SENSOR PACKAGES
- Publication number 20150185247
- Publication date Jul 2, 2015
- Feras Eid
- G01 - MEASURING TESTING
Information Patent Application
MAGNETIC FIELD SHIELDING FOR PACKAGING BUILD-UP ARCHITECTURES
- Publication number 20150189797
- Publication date Jul 2, 2015
- Intel Corporation
- Sasha Oster
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MMWAVE ANTENNAS AND TRANSMISSION LINES ON STANDARD SUBSTRATE MATERIALS
- Publication number 20150188218
- Publication date Jul 2, 2015
- Adel A. ELSHERBINI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF PRESSURE OR INERTIAL SENSORS INTO INTEGRATED CIRCUIT...
- Publication number 20150183635
- Publication date Jul 2, 2015
- Kyu Oh Lee
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICO...
- Publication number 20150084139
- Publication date Mar 26, 2015
- Weng Hong Teh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLOATING BOND PAD FOR POWER SEMICONDUCTOR DEVICES
- Publication number 20140246790
- Publication date Sep 4, 2014
- Cree, Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIDIRECTIONAL SILICON CARBIDE TRANSIENT VOLTAGE SUPRESSION DEVICES
- Publication number 20130240908
- Publication date Sep 19, 2013
- Cree, Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIDIRECTIONAL SILICON CARBIDE TRANSIENT VOLTAGE SUPPRESSION DEVICES
- Publication number 20100237356
- Publication date Sep 23, 2010
- Cree , Inc.
- Sarah Kay Haney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR TRANSISTOR WITH P TYPE RE-GROWN CHANNEL LAYER
- Publication number 20090189228
- Publication date Jul 30, 2009
- QINGCHUN ZHANG
- H01 - BASIC ELECTRIC ELEMENTS

SARAH HANEY

Person

Patents Grantslast 30 patents

Hermetic encapsulation for microelectromechanical systems (MEMS) de...

Floating bond pad for power semiconductor devices

mmWave antennas and transmission lines on standard substrate materials

Magnet placement for integrated sensor packages

Device, system and method for providing MEMS structures of a semico...

Integration of pressure sensors into integrated circuit fabrication...

Magnetic field shielding for packaging build-up architectures

Bidirectional silicon carbide transient voltage supression devices

Integration of pressure or inertial sensors into integrated circuit...

Hermetic encapsulation for microelectromechanical systems (MEMS) de...

Bidirectional silicon carbide transient voltage suppression devices

Semiconductor transistor with P type re-grown channel layer

Patents Applicationslast 30 patents

HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...

INTEGRATION OF PRESSURE SENSORS INTO INTEGRATED CIRCUIT FABRICATION...

IN-PACKAGE TEMPERATURE SENSOR AND METHODS THEREFOR

HERMETIC ENCAPSULATION FOR MICROELECTROMECHANICAL SYSTEMS (MEMS) DE...

ARRANGEMENT OF THROUGH-HOLE STRUCTURES OF A SEMICONDUCTOR PACKAGE

MAGNET PLACEMENT FOR INTEGRATED SENSOR PACKAGES

MAGNETIC FIELD SHIELDING FOR PACKAGING BUILD-UP ARCHITECTURES

MMWAVE ANTENNAS AND TRANSMISSION LINES ON STANDARD SUBSTRATE MATERIALS

INTEGRATION OF PRESSURE OR INERTIAL SENSORS INTO INTEGRATED CIRCUIT...

DEVICE, SYSTEM AND METHOD FOR PROVIDING MEMS STRUCTURES OF A SEMICO...

FLOATING BOND PAD FOR POWER SEMICONDUCTOR DEVICES

BIDIRECTIONAL SILICON CARBIDE TRANSIENT VOLTAGE SUPRESSION DEVICES

BIDIRECTIONAL SILICON CARBIDE TRANSIENT VOLTAGE SUPPRESSION DEVICES

SEMICONDUCTOR TRANSISTOR WITH P TYPE RE-GROWN CHANNEL LAYER