Sarasvathi THANGARAJU

Person

Malta, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Through silicon via device having low stress, thin film gaps and me...
- Patent number 10,043,764
- Issue date Aug 7, 2018
- GLOBALFOUNDRIES Inc.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods of forming the same with metal laye...
- Patent number 9,761,481
- Issue date Sep 12, 2017
- GLOBALFOUNDRIES, INC.
- Chun Yu Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via device having low stress, thin film gaps and me...
- Patent number 9,455,188
- Issue date Sep 27, 2016
- GLOBALFOUNDRIES Inc.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods of forming the same with multiple e...
- Patent number 9,245,790
- Issue date Jan 26, 2016
- GLOBALFOUNDRIES, INC.
- Sarasvathi Thangaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Customized alleviation of stresses generated by through-substrate v...
- Patent number 9,236,301
- Issue date Jan 12, 2016
- GLOBALFOUNDRIES Inc.
- GuoXiang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit structures and methods of fabrication with enhanced contact...
- Patent number 8,907,496
- Issue date Dec 9, 2014
- GLOBALFOUNDRIES Inc.
- GuoXiang Ning
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device resolution enhancement by etching multiple sid...
- Patent number 8,895,211
- Issue date Nov 25, 2014
- Globalfoundries, Inc.
- Guoxiang Ning
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
THROUGH SILICON VIA DEVICE HAVING LOW STRESS, THIN FILM GAPS AND ME...
- Publication number 20160372425
- Publication date Dec 22, 2016
- GLOBALFOUNDRIES Inc.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CUSTOMIZED ALLEVIATION OF STRESSES GENERATED BY THROUGH-SUBSTRATE V...
- Publication number 20150017803
- Publication date Jan 15, 2015
- GLOBALFOUNDRIES INC.
- Guoxiang NING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT STRUCTURES AND METHODS OF FABRICATION WITH ENHANCED CONTACT...
- Publication number 20140353843
- Publication date Dec 4, 2014
- GuoXiang NING
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA DEVICE HAVING LOW STRESS, THIN FILM GAPS AND ME...
- Publication number 20140203446
- Publication date Jul 24, 2014
- GLOBALFOUNDRIES INC.
- Huang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME WITH METAL LAYE...
- Publication number 20140203449
- Publication date Jul 24, 2014
- GLOBALFOUNDRIES, Inc.
- Chun Yu Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME WITH EMBEDDED I...
- Publication number 20140203827
- Publication date Jul 24, 2014
- GLOBALFOUNDRIES, Inc.
- Sarasvathi Thangaraju
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE RESOLUTION ENHANCEMENT BY ETCHING MULTIPLE SID...
- Publication number 20140162176
- Publication date Jun 12, 2014
- GLOBALFOUNDRIES, Inc.
- Guoxiang NING
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Sarasvathi THANGARAJU

Person

Patents Grantslast 30 patents

Through silicon via device having low stress, thin film gaps and me...

Integrated circuits and methods of forming the same with metal laye...

Through silicon via device having low stress, thin film gaps and me...

Integrated circuits and methods of forming the same with multiple e...

Customized alleviation of stresses generated by through-substrate v...

Circuit structures and methods of fabrication with enhanced contact...

Semiconductor device resolution enhancement by etching multiple sid...

Patents Applicationslast 30 patents

THROUGH SILICON VIA DEVICE HAVING LOW STRESS, THIN FILM GAPS AND ME...

CUSTOMIZED ALLEVIATION OF STRESSES GENERATED BY THROUGH-SUBSTRATE V...

CIRCUIT STRUCTURES AND METHODS OF FABRICATION WITH ENHANCED CONTACT...

THROUGH SILICON VIA DEVICE HAVING LOW STRESS, THIN FILM GAPS AND ME...

INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME WITH METAL LAYE...

INTEGRATED CIRCUITS AND METHODS OF FORMING THE SAME WITH EMBEDDED I...

SEMICONDUCTOR DEVICE RESOLUTION ENHANCEMENT BY ETCHING MULTIPLE SID...