Saravanan Sethuraman

Person

Pulau Pinang, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Interposer structures and methods for 2.5D and 3D packaging
- Patent number 11,955,431
- Issue date Apr 9, 2024
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for managing thermal behavior in multichip pa...
- Patent number 11,658,159
- Issue date May 23, 2023
- Intel Corporation
- Saravanan Sethuraman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Methods and apparatus for managing thermal behavior in multichip pa...
- Patent number 11,164,847
- Issue date Nov 2, 2021
- Intel Corporation
- Saravanan Sethuraman
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
ADAPTIVE RAS PLATFORM BASED ON CORRELATIVE PREDICTION
- Publication number 20220334736
- Publication date Oct 20, 2022
- Intel Corporation
- Francesc Guim Bernat
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS AND METHOD FOR PER MEMORY CHIP ADDRESSING
- Publication number 20220276958
- Publication date Sep 1, 2022
- Intel Corporation
- Saravanan SETHURAMAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Systems And Methods For Accessing Memory Devices Using Virtual Memo...
- Publication number 20220188019
- Publication date Jun 16, 2022
- Intel Corporation
- Ramkumar Jayaraman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND APPARATUS TO PERFORM CYCLIC REDUNDANCY CHECK TRAINING IN...
- Publication number 20220190844
- Publication date Jun 16, 2022
- Intel Corporation
- Tonia M. ROSE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PER BANK REFRESH HAZARD AVOIDANCE FOR LARGE SCALE MEMORY
- Publication number 20220108743
- Publication date Apr 7, 2022
- Intel Corporation
- Chang Kian TAN
- G11 - INFORMATION STORAGE
Information Patent Application
METHODS AND APPARATUS FOR MANAGING THERMAL BEHAVIOR IN MULTICHIP PA...
- Publication number 20220013505
- Publication date Jan 13, 2022
- Intel Corporation
- Saravanan Sethuraman
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PER CHANNEL THERMAL MANAGEMENT TECHNIQUES FOR STACKED MEMORY
- Publication number 20220011960
- Publication date Jan 13, 2022
- Intel Corporation
- Chang Kian TAN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Programmable Memory Controller Circuits And Methods
- Publication number 20220005521
- Publication date Jan 6, 2022
- Intel Corporation
- Saravanan Sethuraman
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
INTERPOSER STRUCTURES AND METHODS FOR 2.5D AND 3D PACKAGING
- Publication number 20210384133
- Publication date Dec 9, 2021
- Intel Corporation
- Jenny Shio Yin Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR MANAGING THERMAL BEHAVIOR IN MULTICHIP P...
- Publication number 20200105722
- Publication date Apr 2, 2020
- Intel Corporation
- Saravanan Sethuraman
- G06 - COMPUTING CALCULATING COUNTING

Saravanan Sethuraman

Person

Patents Grantslast 30 patents

Interposer structures and methods for 2.5D and 3D packaging

Methods and apparatus for managing thermal behavior in multichip pa...

Methods and apparatus for managing thermal behavior in multichip pa...

Patents Applicationslast 30 patents

ADAPTIVE RAS PLATFORM BASED ON CORRELATIVE PREDICTION

APPARATUS AND METHOD FOR PER MEMORY CHIP ADDRESSING

Systems And Methods For Accessing Memory Devices Using Virtual Memo...

METHOD AND APPARATUS TO PERFORM CYCLIC REDUNDANCY CHECK TRAINING IN...

PER BANK REFRESH HAZARD AVOIDANCE FOR LARGE SCALE MEMORY

METHODS AND APPARATUS FOR MANAGING THERMAL BEHAVIOR IN MULTICHIP PA...

PER CHANNEL THERMAL MANAGEMENT TECHNIQUES FOR STACKED MEMORY

Programmable Memory Controller Circuits And Methods

INTERPOSER STRUCTURES AND METHODS FOR 2.5D AND 3D PACKAGING

METHODS AND APPARATUS FOR MANAGING THERMAL BEHAVIOR IN MULTICHIP P...