Sarel Bin Ismail

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Duyong, MY

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Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit package fabrication
- Patent number 9,859,197
- Issue date Jan 2, 2018
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with abutment surface
- Patent number 9,184,119
- Issue date Nov 10, 2015
- Texas Instruments Incorporated
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making
- Patent number 9,013,028
- Issue date Apr 21, 2015
- Texas Instruments Incorporated
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LEAD FRAME WITH ABUTMENT SURFACE
- Publication number 20150228563
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE FABRICATION
- Publication number 20150228581
- Publication date Aug 13, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@ Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING
- Publication number 20140191380
- Publication date Jul 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Lee Han Meng@Eugene Lee
- H01 - BASIC ELECTRIC ELEMENTS