Sari K. Christensen

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Ft. Collins, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
High-performance laminate for integrated circuit interconnection
- Patent number 6,630,628
- Issue date Oct 7, 2003
- Agilent Technologies, Inc.
- Nurwati S Devnani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
HIGH-PERFORMANCE LAMINATE FOR INTEGRATED CIRCUIT INTERCONNECTION
- Publication number 20030148077
- Publication date Aug 7, 2003
- Nurwati S. Devnani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR