Satbir Madra

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Santa Clara, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Embedded die redistribution layers for active device
- Patent number 9,443,815
- Issue date Sep 13, 2016
- Maxim Integrated Products, Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial pad on semiconductor package device and method
- Patent number 9,397,027
- Issue date Jul 19, 2016
- Maxim Integrated Products, Inc.
- Xiansong Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED DIE REDISTRIBUTION LAYERS FOR ACTIVE DEVICE
- Publication number 20150243590
- Publication date Aug 27, 2015
- Maxim Integrated Products, Inc.
- Kai Liu
- H01 - BASIC ELECTRIC ELEMENTS