Sathid Jitjongruck

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Patents Grantslast 30 patents

Information Patent Grant
Encapsulant materials and a method of making thereof
- Patent number 9,607,916
- Issue date Mar 28, 2017
- MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and encapsulant for flip-chip assembly
- Patent number 9,064,820
- Issue date Jun 23, 2015
- MEKIEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ENCAPSULANT MATERIALS AND A METHOD OF MAKING THEREOF
- Publication number 20150056756
- Publication date Feb 26, 2015
- MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND ENCAPSULANT FOR FLIP-CHIP ASSEMBLY
- Publication number 20150054154
- Publication date Feb 26, 2015
- MEKTEC MANUFACTURING CORPORATION (THAILAND) LTD
- Sathid Jitjongruck
- H01 - BASIC ELECTRIC ELEMENTS