Sathish Veeraraghavan

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Process-induced distortion prediction and feedforward and feedback...
- Patent number 11,761,880
- Issue date Sep 19, 2023
- KLA Corporation
- Pradeep Vukkadala
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Breakdown analysis of geometry induced overlay and utilization of b...
- Patent number 10,509,329
- Issue date Dec 17, 2019
- KLA-Tencor Corporation
- Sathish Veeraraghavan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process-induced distortion prediction and feedforward and feedback...
- Patent number 10,401,279
- Issue date Sep 3, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Systems, methods and metrics for wafer high order shape characteriz...
- Patent number 10,379,061
- Issue date Aug 13, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overlay and semiconductor process control using a wafer geometry me...
- Patent number 10,249,523
- Issue date Apr 2, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Grant
System and method to emulate finite element model based prediction...
- Patent number 10,025,894
- Issue date Jul 17, 2018
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems and methods for effective pattern wafer surface measurement...
- Patent number 9,865,047
- Issue date Jan 9, 2018
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Predicting and controlling critical dimension issues and pattern de...
- Patent number 9,558,545
- Issue date Jan 31, 2017
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Systems, methods and metrics for wafer high order shape characteriz...
- Patent number 9,546,862
- Issue date Jan 17, 2017
- KLA-Tencor Corporation
- Haiguang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Using wafer geometry to improve scanner correction effectiveness fo...
- Patent number 9,513,565
- Issue date Dec 6, 2016
- KLA-Tencor Corporation
- Craig MacNaughton
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
System and method to emulate finite element model based prediction...
- Patent number 9,430,593
- Issue date Aug 30, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Overlay and semiconductor process control using a wafer geometry me...
- Patent number 9,354,526
- Issue date May 31, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Grant
Using wafer geometry to improve scanner correction effectiveness fo...
- Patent number 9,029,810
- Issue date May 12, 2015
- KLA-Tencor Corporation
- Craig MacNaughton
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Site based quantification of substrate topography and its relation...
- Patent number 8,768,665
- Issue date Jul 1, 2014
- KLA-Tencor Technologies Corporation
- Sathish Veeraraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Localized substrate geometry characterization
- Patent number 8,065,109
- Issue date Nov 22, 2011
- KLA-Tencor Corporation
- Sathish Veeraraghavan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Process-Induced Distortion Prediction and Feedforward and Feedback...
- Publication number 20190353582
- Publication date Nov 21, 2019
- KLA-Tencor Corporation
- Pradeep Vukkadala
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZ...
- Publication number 20190271654
- Publication date Sep 5, 2019
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
Overlay and Semiconductor Process Control Using a Wafer Geometry Me...
- Publication number 20160372353
- Publication date Dec 22, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
System and Method to Emulate Finite Element Model Based Prediction...
- Publication number 20160283625
- Publication date Sep 29, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Predicting and Controlling Critical Dimension Issues and Pattern De...
- Publication number 20160163033
- Publication date Jun 9, 2016
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Breakdown Analysis of Geometry Induced Overlay and Utilization of B...
- Publication number 20160062252
- Publication date Mar 3, 2016
- KLA-Tencor Corporation
- Sathish Veeraraghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...
- Publication number 20150212429
- Publication date Jul 30, 2015
- KLA-Tencor Corporation
- Craig MacNaughton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process-Induced Distortion Prediction and Feedforward and Feedback...
- Publication number 20150120216
- Publication date Apr 30, 2015
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...
- Publication number 20140353527
- Publication date Dec 4, 2014
- KLA-Tencor Corporation
- Craig MacNaughton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems, Methods and Metrics for Wafer High Order Shape Characteriz...
- Publication number 20140114597
- Publication date Apr 24, 2014
- KLA-Tencor Corporation
- Haiguang Chen
- G01 - MEASURING TESTING
Information Patent Application
System and Method to Emulate Finite Element Model Based Prediction...
- Publication number 20140107998
- Publication date Apr 17, 2014
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
OVERLAY AND SEMICONDUCTOR PROCESS CONTROL USING A WAFER GEOMETRY ME...
- Publication number 20130089935
- Publication date Apr 11, 2013
- KLA-Tencor Corporation
- Pradeep Vukkadala
- G01 - MEASURING TESTING
Information Patent Application
SITE BASED QUANTIFICATION OF SUBSTRATE TOPOGRAPHY AND ITS RELATION...
- Publication number 20110172982
- Publication date Jul 14, 2011
- KLA-Tencor Technologies Corp.
- Sathish Veeraraghavan
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Localized Substrate Geometry Characterization
- Publication number 20110144943
- Publication date Jun 16, 2011
- KLA-Tencor Corporation
- Sathish Veeraraghavan
- H01 - BASIC ELECTRIC ELEMENTS

Sathish Veeraraghavan

Person

Patents Grantslast 30 patents

Process-induced distortion prediction and feedforward and feedback...

Breakdown analysis of geometry induced overlay and utilization of b...

Process-induced distortion prediction and feedforward and feedback...

Systems, methods and metrics for wafer high order shape characteriz...

Overlay and semiconductor process control using a wafer geometry me...

System and method to emulate finite element model based prediction...

Systems and methods for effective pattern wafer surface measurement...

Predicting and controlling critical dimension issues and pattern de...

Systems, methods and metrics for wafer high order shape characteriz...

Using wafer geometry to improve scanner correction effectiveness fo...

System and method to emulate finite element model based prediction...

Overlay and semiconductor process control using a wafer geometry me...

Using wafer geometry to improve scanner correction effectiveness fo...

Site based quantification of substrate topography and its relation...

Localized substrate geometry characterization

Patents Applicationslast 30 patents

Process-Induced Distortion Prediction and Feedforward and Feedback...

SYSTEMS, METHODS AND METRICS FOR WAFER HIGH ORDER SHAPE CHARACTERIZ...

Overlay and Semiconductor Process Control Using a Wafer Geometry Me...

System and Method to Emulate Finite Element Model Based Prediction...

Predicting and Controlling Critical Dimension Issues and Pattern De...

Breakdown Analysis of Geometry Induced Overlay and Utilization of B...

Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...

Process-Induced Distortion Prediction and Feedforward and Feedback...

Using Wafer Geometry to Improve Scanner Correction Effectiveness fo...

Systems, Methods and Metrics for Wafer High Order Shape Characteriz...

System and Method to Emulate Finite Element Model Based Prediction...

OVERLAY AND SEMICONDUCTOR PROCESS CONTROL USING A WAFER GEOMETRY ME...

SITE BASED QUANTIFICATION OF SUBSTRATE TOPOGRAPHY AND ITS RELATION...

Localized Substrate Geometry Characterization