Sathyanarayanan Raghavan

Person

Ballston Lake, NY, US

People

Patents Applicationslast 30 patents

Information Patent Application
REDRESSING A CHIP SITE ON A MULTI-CHIP LAMINATE PACKAGE
- Publication number 20250191937
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION
- Publication number 20250140609
- Publication date May 1, 2025
- International Business Machines Corporation
- Nicholas Latham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dicing Street Design for Hybrid Bonding
- Publication number 20250087629
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Roy R. Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC OPTICAL FIBER PACKAGING
- Publication number 20250004208
- Publication date Jan 2, 2025
- International Business Machines Corporation
- Nicholas Alexander POLOMOFF
- G02 - OPTICS
Information Patent Application
DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING
- Publication number 20240290730
- Publication date Aug 29, 2024
- International Business Machines Corporation
- Sathyanarayanan Raghavan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS
- Publication number 20240113055
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER X-RAY SOURCE TARGET WITH STRESS RELIEVING LAYER
- Publication number 20200194212
- Publication date Jun 18, 2020
- GENERAL ELECTRIC COMPANY
- George Theodore Dalakos
- H01 - BASIC ELECTRIC ELEMENTS

Sathyanarayanan Raghavan

Person

Patents Applicationslast 30 patents

REDRESSING A CHIP SITE ON A MULTI-CHIP LAMINATE PACKAGE

NEGATIVE-TONE ORGANIC DIELECTRIC WITH FINE METAL PILLAR RESOLUTION

Dicing Street Design for Hybrid Bonding

PHOTONIC OPTICAL FIBER PACKAGING

DIE BENDING STIFFNESS MODIFICATION THROUGH GROOVING

STRUCTURE FOR HYBRID BOND CRACKSTOP WITH AIRGAPS

MULTILAYER X-RAY SOURCE TARGET WITH STRESS RELIEVING LAYER