Satish D. Athavale

Person

Fishkill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for dry etching deep trenches in a substrate
- Patent number 6,821,900
- Issue date Nov 23, 2004
- Infineon Technologies AG
- Satish Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of patterning a multi-layer film stack and forming a lower...
- Patent number 6,670,233
- Issue date Dec 30, 2003
- International Business Machines Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of patterning a multi-layer film stack and forming a lower...
- Patent number 6,559,001
- Issue date May 6, 2003
- International Business Machines Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of plasma etching thin films of difficult to dry etch materials
- Patent number 6,548,414
- Issue date Apr 15, 2003
- Infineon Technologies AG
- Satish D. Athavale
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Structure and process for buried bitline and single sided buried co...
- Patent number 6,518,118
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removal of hard mask used to define noble metal electrode
- Patent number 6,420,272
- Issue date Jul 16, 2002
- Infineon Technologies A G
- Hua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten hard mask for dry etching aluminum-containing layers
- Patent number 6,420,099
- Issue date Jul 16, 2002
- Infineon Technologies AG
- Martin Gutsche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for minimizing semiconductor wafer arcing duri...
- Patent number 6,406,925
- Issue date Jun 18, 2002
- Tegal Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and manufacturing method
- Patent number 6,365,328
- Issue date Apr 2, 2002
- Infineon Technologies North America Corp.
- Hua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for 4F2 STC cell having vertical MOSFET and buried-bitline...
- Patent number 6,348,374
- Issue date Feb 19, 2002
- International Business Machines
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for minimizing semiconductor wafer arcing duri...
- Patent number 6,346,428
- Issue date Feb 12, 2002
- Tegal Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Easy to remove hard mask layer for semiconductor device fabrication
- Patent number 6,261,967
- Issue date Jul 17, 2001
- Infineon Technologies North America Corp.
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to prevent oxygen out-diffusion from BSTO containing micro-e...
- Patent number 6,214,661
- Issue date Apr 10, 2001
- Infineon Technologoies North America Corp.
- Heon Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High dielectric constant material deposition to achieve high capaci...
- Patent number 6,207,584
- Issue date Mar 27, 2001
- International Business Machines Corp.
- Hua Shen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method for forming a (111) oriented BSTO thin film layer for high d...
- Publication number 20050196917
- Publication date Sep 8, 2005
- Jingyu Lian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of patterning a multi-layer film stack and forming a lower...
- Publication number 20030143803
- Publication date Jul 31, 2003
- International Business Machines Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of patterning a multi-layer film stack and forming a lower...
- Publication number 20020192900
- Publication date Dec 19, 2002
- International Business Machines Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure and process for buried bitline and single sided buried co...
- Publication number 20020130346
- Publication date Sep 19, 2002
- International Business Machines Corporation
- Satish D. Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for dry etching deep trenches in a substrate
- Publication number 20020094690
- Publication date Jul 18, 2002
- Satish Athavale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLASMA ETCHING THIN FILMS OF DIFFICULT TO DRY ETCH MATERIALS
- Publication number 20010053610
- Publication date Dec 20, 2001
- SATISH D. ATHAVALE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Satish D. Athavale

Person

Patents Grantslast 30 patents

Method for dry etching deep trenches in a substrate

Methods of patterning a multi-layer film stack and forming a lower...

Methods of patterning a multi-layer film stack and forming a lower...

Method of plasma etching thin films of difficult to dry etch materials

Structure and process for buried bitline and single sided buried co...

Method for removal of hard mask used to define noble metal electrode

Tungsten hard mask for dry etching aluminum-containing layers

Method and apparatus for minimizing semiconductor wafer arcing duri...

Semiconductor structure and manufacturing method

Process for 4F2 STC cell having vertical MOSFET and buried-bitline...

Method and apparatus for minimizing semiconductor wafer arcing duri...

Easy to remove hard mask layer for semiconductor device fabrication

Method to prevent oxygen out-diffusion from BSTO containing micro-e...

High dielectric constant material deposition to achieve high capaci...

Patents Applicationslast 30 patents

Method for forming a (111) oriented BSTO thin film layer for high d...

Methods of patterning a multi-layer film stack and forming a lower...

Methods of patterning a multi-layer film stack and forming a lower...

Structure and process for buried bitline and single sided buried co...

Method for dry etching deep trenches in a substrate

METHOD OF PLASMA ETCHING THIN FILMS OF DIFFICULT TO DRY ETCH MATERIALS