Satish Yeldandi

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Boise, ID, US

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Patents Grantslast 30 patents

Information Patent Grant
Under-bump metal structures for interconnecting semiconductor dies...
- Patent number 9,966,347
- Issue date May 8, 2018
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Under-bump metal structures for interconnecting semiconductor dies...
- Patent number 9,704,781
- Issue date Jul 11, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
UNDER-BUMP METAL STRUCTURES FOR INTERCONNECTING SEMICONDUCTOR DIES...
- Publication number 20170287857
- Publication date Oct 5, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER-BUMP METAL STRUCTURES FOR INTERCONNECTING SEMICONDUCTOR DIES...
- Publication number 20150137353
- Publication date May 21, 2015
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS