Satoru Akita

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Sohka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder paste for reflow soldering
- Patent number 6,896,172
- Issue date May 24, 2005
- Senju Metal Industry Co., Ltd.
- Toshihiko Taguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Lead-free solder paste for reflow soldering
- Publication number 20040217152
- Publication date Nov 4, 2004
- Senju Metal Industry Co., Ltd.
- Toshihiko Taguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR