Satoru AMOU

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Epoxy-vinyl copolymerization type liquid resin composition, cured p...
- Patent number 9,493,605
- Issue date Nov 15, 2016
- Hitachi Industrial Equipment Systems Co., Ltd.
- Satoru Amou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Organic-inorganic composite materials containing triazine rings and...
- Patent number 9,090,796
- Issue date Jul 28, 2015
- Hitachi, Ltd.
- Tomokazu Tanase
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thermosetting adhesive composition, and heat resistant adhesive fil...
- Patent number 9,034,475
- Issue date May 19, 2015
- Hitachi Metals, Ltd.
- Satoru Amou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive composition, varnish, adhesive film and wiring film
- Patent number 9,028,970
- Issue date May 12, 2015
- Hitachi Metals, Ltd.
- Satoru Amou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Electric equipment having insulation structure at welding parts
- Patent number 8,735,724
- Issue date May 27, 2014
- Hitachi, Ltd.
- Takahito Muraki
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Low softening point glass composition, bonding material using same...
- Patent number 8,685,872
- Issue date Apr 1, 2014
- Hitachi Chemical Co., Ltd.
- Takashi Naito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Adhesive composition, adhesive film and wiring film using the same
- Patent number 8,507,592
- Issue date Aug 13, 2013
- Hitachi Cable, Ltd.
- Satoru Amou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low softening point glass composition, bonding material using same...
- Patent number 8,470,723
- Issue date Jun 25, 2013
- Hitachi Powdered Metals Co., Ltd.
- Takashi Naito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Resin composition, prepreg, laminate sheet and printed wiring board...
- Patent number 8,420,210
- Issue date Apr 16, 2013
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg and printed wiring board using thin quartz glass cloth
- Patent number 8,227,361
- Issue date Jul 24, 2012
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Prepreg and its application products for low thermal expansion and...
- Patent number 8,115,105
- Issue date Feb 14, 2012
- Hitachi Chemical Co., Ltd.
- Satoru Amou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Phase-separation-controlled polybutadiene resin composition and pri...
- Patent number 8,097,545
- Issue date Jan 17, 2012
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- B32 - LAYERED PRODUCTS
Information Patent Grant
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet...
- Patent number 7,638,564
- Issue date Dec 29, 2009
- Hitachi Chemical Co., Ltd.
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low dielectric loss tangent resin composition, curable film and cur...
- Patent number 7,375,155
- Issue date May 20, 2008
- Hitachi, Ltd.
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thin film capacitor and electronic circuit component
- Patent number 7,294,905
- Issue date Nov 13, 2007
- Hitachi, Ltd.
- Masahiko Ogino
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Resin composition, prepreg, laminate sheet and printed wiring board...
- Patent number 7,273,900
- Issue date Sep 25, 2007
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device using low dielectric loss tangent insulators for...
- Patent number 7,193,009
- Issue date Mar 20, 2007
- Hitachi, Ltd.
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Low dielectric loss tangent films and wiring films
- Patent number 7,112,627
- Issue date Sep 26, 2006
- Hitachi, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low dielectric loss tangent resin composition, curable film and cur...
- Patent number 6,930,140
- Issue date Aug 16, 2005
- Hitachi, Ltd.
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 6,855,952
- Issue date Feb 15, 2005
- Hitachi, Ltd.
- Akira Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low dielectric loss tangent resin composition, curable film and cur...
- Patent number 6,756,441
- Issue date Jun 29, 2004
- Hitachi, Ltd.
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer circuit board having insulating layer with via-holes
- Patent number 6,306,481
- Issue date Oct 23, 2001
- Hitachi, Ltd.
- Satoru Amou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive resin composition, and multilayer printed circuit bo...
- Patent number 6,190,834
- Issue date Feb 20, 2001
- Hitachi, Ltd.
- Masatoshi Narahara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Multilayer circuit board and photosensitive resin composition used...
- Patent number 5,914,216
- Issue date Jun 22, 1999
- Hitachi, Ltd.
- Satoru Amou
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Polymerizable compouund, process for producing same and setting com...
- Patent number 5,565,536
- Issue date Oct 15, 1996
- Hitachi, Ltd.
- Shin Nishimura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Polymerizable compound, process for producing same and setting comp...
- Patent number 5,410,069
- Issue date Apr 25, 1995
- Hitachi, Ltd.
- Shin Nishimura
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Heat transfer sheet, method for producing it, and method of heat tr...
- Patent number 5,071,824
- Issue date Dec 10, 1991
- Hitachi, Ltd.
- Shuichi Ohara
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
RESIN COMPOSITION AND ELECTRICAL DEVICE
- Publication number 20170145209
- Publication date May 25, 2017
- Hitachi, Ltd
- Yuri KAJIHARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Wire and Dynamo-Electric Machine Using the Same
- Publication number 20160163420
- Publication date Jun 9, 2016
- Hitachi, Ltd
- Koutarou ARAYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulated Wire, Rotary Electric Machine, and Method for Manufacturi...
- Publication number 20160042836
- Publication date Feb 11, 2016
- Hitachi, Ltd
- Yoshiaki OKABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Melting-Point Glass Resin Composite Material and Electronic/Ele...
- Publication number 20150337106
- Publication date Nov 26, 2015
- Hitachi, Ltd
- Yuri KAJIHARA
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND ELECTRICAL DEVICE USING SAME
- Publication number 20150152230
- Publication date Jun 4, 2015
- Hitachi, Ltd
- Takahito Muraki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Epoxy-Vinyl Copolymerization Type Liquid Resin Composition, Cured P...
- Publication number 20140378580
- Publication date Dec 25, 2014
- Hitachi Industrial Equipment Systems Co., LTd.
- Satoru Amou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC-INORGANIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20140211373
- Publication date Jul 31, 2014
- Hitachi, Ltd
- Taku Oyama
- C07 - ORGANIC CHEMISTRY
Information Patent Application
SELF-REPAIRING LAMINATED STRUCTURE AND SELF-FUSING INSULATED WIRE
- Publication number 20140141254
- Publication date May 22, 2014
- Kotaro Araya
- B32 - LAYERED PRODUCTS
Information Patent Application
LOW SOFTENING POINT GLASS COMPOSITION, BONDING MATERIAL USING SAME...
- Publication number 20130333748
- Publication date Dec 19, 2013
- Takashi NAITO
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Application
Adhesive Composition, Varnish, Adhesive Film and Wiring Film
- Publication number 20130220674
- Publication date Aug 29, 2013
- Hitachi Cable, Ltd.
- Satoru AMOU
- B32 - LAYERED PRODUCTS
Information Patent Application
Thermosetting Adhesive Composition, and Heat Resistant Adhesive Fil...
- Publication number 20130220677
- Publication date Aug 29, 2013
- HITACHI CABLE FINE-TECH, LTD.
- Satoru AMOU
- B32 - LAYERED PRODUCTS
Information Patent Application
THERMOSETTING RESIN COMPOSITION, CURED MATERIAL, CONDUCTIVE WIRE, C...
- Publication number 20130209802
- Publication date Aug 15, 2013
- Hitachi, Ltd
- Takahito MURAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC-INORGANIC COMPOSITE MATERIALS CONTAINING TRIAZINE RINGS AND...
- Publication number 20130131248
- Publication date May 23, 2013
- Hitachi, Ltd
- Tomokazu TANASE
- B82 - NANO-TECHNOLOGY
Information Patent Application
ADHESIVE COMPOSITION, ADHESIVE FILM AND WIRING FILM USING THE SAME
- Publication number 20120138345
- Publication date Jun 7, 2012
- HITACHI CABLE, LTD.
- Satoru AMOU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ELECTRIC EQUIPMENT HAVING INSULATION STRUCTURE AT WELDING PARTS
- Publication number 20120097447
- Publication date Apr 26, 2012
- Takahito MURAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMOPLASTIC RESIN COMPOSITION, ADHESIVE FILM AND WIRING FILM USIN...
- Publication number 20120037410
- Publication date Feb 16, 2012
- HITACHI CABLE, LTD.
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
UNSATURATED POLYESTER RESIN COMPOSITION FOR COIL ADHESION
- Publication number 20110316661
- Publication date Dec 29, 2011
- Takahito MURAKI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER F...
- Publication number 20110088933
- Publication date Apr 21, 2011
- Satoru AMOU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LOW SOFTENING POINT GLASS COMPOSITION, BONDING MATERIAL USING SAME...
- Publication number 20100180934
- Publication date Jul 22, 2010
- HITACHI POWDERED METALS CO., LTD.
- Takashi Naito
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
THERMOSETTING RESIN COMPOSITION AND COIL FOR ELECTRIC MACHINE
- Publication number 20100156587
- Publication date Jun 24, 2010
- Hitachi, Ltd.
- Takahito Muraki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Prepreg and printed wiring board using thin quartz glass cloth
- Publication number 20090266591
- Publication date Oct 29, 2009
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND...
- Publication number 20090178832
- Publication date Jul 16, 2009
- HITACHI CHEMICAL CO., LTD.
- Satoru Amou
- B32 - LAYERED PRODUCTS
Information Patent Application
PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING...
- Publication number 20080261472
- Publication date Oct 23, 2008
- HITACHI CHEMICAL CO., LTD.
- Satoru AMOU
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
LOW DIELECTRIC LOSS TANGENT RESIN COMPOSITION, CURABLE FILM AND CUR...
- Publication number 20080221261
- Publication date Sep 11, 2008
- Hitachi, Ltd.
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Phase-Separation-Controlled Polybutadiene Resin Composition and Pri...
- Publication number 20080090478
- Publication date Apr 17, 2008
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
RESIN COMPOSITION, PREPREG, LAMINATE SHEET AND PRINTED WIRING BOARD...
- Publication number 20070292668
- Publication date Dec 20, 2007
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low dielectric loss tangent-resin varnish, prepreg, laminated sheet...
- Publication number 20070077413
- Publication date Apr 5, 2007
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Low dielectric loss tangent resin composition, curable film and cur...
- Publication number 20050277753
- Publication date Dec 15, 2005
- Satoru Amou
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Resin composition, prepreg, laminate sheet and printed wiring board...
- Publication number 20050064159
- Publication date Mar 24, 2005
- Hitachi Chemical Company, Ltd.
- Satoru Amou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Resin composition containing rubber component, and film and electro...
- Publication number 20050020781
- Publication date Jan 27, 2005
- Masatoshi Sugimasa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Satoru AMOU

Person

Patents Grantslast 30 patents

Epoxy-vinyl copolymerization type liquid resin composition, cured p...

Organic-inorganic composite materials containing triazine rings and...

Thermosetting adhesive composition, and heat resistant adhesive fil...

Adhesive composition, varnish, adhesive film and wiring film

Electric equipment having insulation structure at welding parts

Low softening point glass composition, bonding material using same...

Adhesive composition, adhesive film and wiring film using the same

Low softening point glass composition, bonding material using same...

Resin composition, prepreg, laminate sheet and printed wiring board...

Prepreg and printed wiring board using thin quartz glass cloth

Prepreg and its application products for low thermal expansion and...

Phase-separation-controlled polybutadiene resin composition and pri...

Low dielectric loss tangent-resin varnish, prepreg, laminated sheet...

Low dielectric loss tangent resin composition, curable film and cur...

Thin film capacitor and electronic circuit component

Resin composition, prepreg, laminate sheet and printed wiring board...

Electronic device using low dielectric loss tangent insulators for...

Low dielectric loss tangent films and wiring films

Low dielectric loss tangent resin composition, curable film and cur...

Semiconductor device and semiconductor package

Low dielectric loss tangent resin composition, curable film and cur...

Multilayer circuit board having insulating layer with via-holes

Photosensitive resin composition, and multilayer printed circuit bo...

Multilayer circuit board and photosensitive resin composition used...

Polymerizable compouund, process for producing same and setting com...

Polymerizable compound, process for producing same and setting comp...

Heat transfer sheet, method for producing it, and method of heat tr...

Patents Applicationslast 30 patents

RESIN COMPOSITION AND ELECTRICAL DEVICE

Insulated Wire and Dynamo-Electric Machine Using the Same

Insulated Wire, Rotary Electric Machine, and Method for Manufacturi...

Low-Melting-Point Glass Resin Composite Material and Electronic/Ele...

THERMOSETTING RESIN COMPOSITION AND ELECTRICAL DEVICE USING SAME

Epoxy-Vinyl Copolymerization Type Liquid Resin Composition, Cured P...

ORGANIC-INORGANIC COMPOSITE AND METHOD FOR MANUFACTURING THE SAME

SELF-REPAIRING LAMINATED STRUCTURE AND SELF-FUSING INSULATED WIRE

LOW SOFTENING POINT GLASS COMPOSITION, BONDING MATERIAL USING SAME...

Adhesive Composition, Varnish, Adhesive Film and Wiring Film

Thermosetting Adhesive Composition, and Heat Resistant Adhesive Fil...

THERMOSETTING RESIN COMPOSITION, CURED MATERIAL, CONDUCTIVE WIRE, C...

ORGANIC-INORGANIC COMPOSITE MATERIALS CONTAINING TRIAZINE RINGS AND...

ADHESIVE COMPOSITION, ADHESIVE FILM AND WIRING FILM USING THE SAME

ELECTRIC EQUIPMENT HAVING INSULATION STRUCTURE AT WELDING PARTS

THERMOPLASTIC RESIN COMPOSITION, ADHESIVE FILM AND WIRING FILM USIN...

UNSATURATED POLYESTER RESIN COMPOSITION FOR COIL ADHESION

LOW DIELECTRIC LOSS WIRING BOARD, MULTILAYER WIRING BOARD, COPPER F...

LOW SOFTENING POINT GLASS COMPOSITION, BONDING MATERIAL USING SAME...

THERMOSETTING RESIN COMPOSITION AND COIL FOR ELECTRIC MACHINE

Prepreg and printed wiring board using thin quartz glass cloth

PREPREG AND ITS APPLICATION PRODUCTS FOR LOW THERMAL EXPANSION AND...

PREPREG, MULTILAYER PRINTED WIRING BOARD AND ELECTRONIC PARTS USING...

LOW DIELECTRIC LOSS TANGENT RESIN COMPOSITION, CURABLE FILM AND CUR...

Phase-Separation-Controlled Polybutadiene Resin Composition and Pri...

RESIN COMPOSITION, PREPREG, LAMINATE SHEET AND PRINTED WIRING BOARD...

Low dielectric loss tangent-resin varnish, prepreg, laminated sheet...

Low dielectric loss tangent resin composition, curable film and cur...

Resin composition, prepreg, laminate sheet and printed wiring board...

Resin composition containing rubber component, and film and electro...