Satoru Daido

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Patents Grantslast 30 patents

Information Patent Grant
Electronic component and method of manufacturing electronic component
- Patent number 11,396,164
- Issue date Jul 26, 2022
- Mitsubishi Materials Corporation
- Masayuki Ishikawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method for manufacturing package lid member and method for manufact...
- Patent number 11,264,534
- Issue date Mar 1, 2022
- Mitsubishi Materials Corporation
- Satoru Daido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lid material for packages including reflowed gold-tin layers, and m...
- Patent number 11,158,766
- Issue date Oct 26, 2021
- Mitsubishi Materials Corporation
- Satoru Daido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING ELECTRONIC COMPONENT
- Publication number 20210260853
- Publication date Aug 26, 2021
- MITSUBISHI MATERIALS CORPORATION
- Masayuki Ishikawa
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR MANUFACTURING PACKAGE LID MEMBER AND METHOD FOR MANUFACT...
- Publication number 20210249559
- Publication date Aug 12, 2021
- MITSUBISHI MATERIALS CORPORATION
- Satoru Daido
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LID MATERIAL FOR PACKAGES, AND PACKAGE
- Publication number 20210249567
- Publication date Aug 12, 2021
- MITSUBISHI MATERIALS CORPORATION
- Satoru Daido
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR