Satoru Fukunaga

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Osaka-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Method of thinning semiconductor wafer capable of preventing its fr...
- Patent number 6,984,586
- Issue date Jan 10, 2006
- Sharp Kabushiki Kaisha
- Noriki Iwasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Method of thinning semiconductor wafer capable of preventing its fr...
- Patent number 6,520,844
- Issue date Feb 18, 2003
- Sharp Kabushiki Kaisha
- Noriki Iwasaki
- B24 - GRINDING POLISHING
Information Patent Grant
Jig used for assembling semiconductor devices
- Patent number 6,423,102
- Issue date Jul 23, 2002
- Sharp Kabushiki Kaisha
- Satoru Fukunaga
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Grant
Testing apparatus for semiconductor device formed on tape carrier
- Patent number 5,412,314
- Issue date May 2, 1995
- Sharp Kabushiki Kaisha
- Satoru Fukunaga
- G01 - MEASURING TESTING
Information Patent Grant
Burn-in apparatus and method of use thereof
- Patent number 5,247,248
- Issue date Sep 21, 1993
- Sharp Kabushiki Kaisha
- Satoru Fukunaga
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
Method of thinning semiconductor wafer capable of preventing its fr...
- Publication number 20030082915
- Publication date May 1, 2003
- Sharp Kabushiki Kaisha
- Noriki Iwasaki
- B24 - GRINDING POLISHING
Information Patent Application
Method of thinning semiconductor wafer capable of preventing its fr...
- Publication number 20020016135
- Publication date Feb 7, 2002
- Noriki Iwasaki
- B24 - GRINDING POLISHING