Satoru Katsurayama

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device
- Patent number 8,704,378
- Issue date Apr 22, 2014
- Sumitomo Bakelite Co., Ltd.
- Mitsuo Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer dicing employing edge region underfill removal
- Patent number 8,652,941
- Issue date Feb 18, 2014
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor electronic component and semiconductor device using t...
- Patent number 8,629,564
- Issue date Jan 14, 2014
- Sumitomo Bakelite Co., Ltd.
- Satoru Katsurayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive film
- Patent number 8,597,785
- Issue date Dec 3, 2013
- Sumitomo Bakelite Co., Ltd.
- Toshio Komiyatani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing electronic component, and electronic compo...
- Patent number 8,531,028
- Issue date Sep 10, 2013
- Sumitomo Bakelite Co., Ltd.
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive tape and semiconductor device using the same
- Patent number 8,319,350
- Issue date Nov 27, 2012
- Sumitomo Bakelite Co., Ltd.
- Satoru Katsurayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Encapsulating resin composition for preapplication, semiconductor d...
- Patent number 8,169,090
- Issue date May 1, 2012
- Sumitomo Bakelite Company, Ltd.
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Method for bonding semiconductor wafers and method for manufacturin...
- Patent number 8,039,305
- Issue date Oct 18, 2011
- Sumitomo Bakelite Company, Ltd.
- Kenzou Mejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressurized underfill cure
- Patent number 8,008,122
- Issue date Aug 30, 2011
- International Business Machines Corporation
- Michael A. Gaynes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive tape, connected structure and semiconductor package
- Patent number 7,838,984
- Issue date Nov 23, 2010
- Sumitomo Bakelite Company, Ltd.
- Satoru Katsurayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device and method for manufacturing semiconductor device
- Patent number 7,829,992
- Issue date Nov 9, 2010
- Sumitomo Bakelite Company, Ltd.
- Mitsuo Sugino
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20130324641
- Publication date Dec 5, 2013
- SUMITOMO BAKELITE CO., LTD.
- Kenzou MAEJIMA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL
- Publication number 20130149841
- Publication date Jun 13, 2013
- International Business Machines Corporation
- Richard F. Indyk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND S...
- Publication number 20120156502
- Publication date Jun 21, 2012
- SUMITOMO BAKELITE CO., LTD.
- Kenzou Maejima
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...
- Publication number 20120061820
- Publication date Mar 15, 2012
- Kenzou Maejima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USI...
- Publication number 20110311790
- Publication date Dec 22, 2011
- SUMITOMO BAKELITE CO., LTD.
- Wataru Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLEXIBLE SUBSTRATE AND ELECTRONIC DEVICE
- Publication number 20110262697
- Publication date Oct 27, 2011
- Satoru Katsurayama
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...
- Publication number 20110068483
- Publication date Mar 24, 2011
- Sumitomo Bakelite Co. Ltd
- Satoru Katsurayama
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE TAPE
- Publication number 20100203307
- Publication date Aug 12, 2010
- SUMITOMO BAKELITE CO., LTD.
- Toshio Komiyatani
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor Device
- Publication number 20100181686
- Publication date Jul 22, 2010
- Mitsuo Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Tape, Semiconductor Package and Electronics
- Publication number 20100155964
- Publication date Jun 24, 2010
- SUMITOMO BAKELITE CO., LTD.
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
METHOD FOR BONDING SEMICONDUCTOR WAFERS AND METHOD FOR MANUFACTURIN...
- Publication number 20100129960
- Publication date May 27, 2010
- SUMITOMO BAKELITE COMPANY LIMITED
- Kenzou Mejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING T...
- Publication number 20100102446
- Publication date Apr 29, 2010
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME
- Publication number 20100078830
- Publication date Apr 1, 2010
- SUMITOMO BAKELITE CO., LTD.
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor Device and Method for Manufacturing Semiconductor Device
- Publication number 20090243065
- Publication date Oct 1, 2009
- Mitsuo Sugino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATING RESIN COMPOSITION FOR PREAPPLICATION, SEMICONDUCTOR D...
- Publication number 20090166897
- Publication date Jul 2, 2009
- Satoru Katsurayama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Satoru Katsurayama

Person

Patents Grantslast 30 patents

Semiconductor device

Wafer dicing employing edge region underfill removal

Semiconductor electronic component and semiconductor device using t...

Adhesive film

Method for manufacturing electronic component, and electronic compo...

Adhesive tape and semiconductor device using the same

Encapsulating resin composition for preapplication, semiconductor d...

Method for bonding semiconductor wafers and method for manufacturin...

Pressurized underfill cure

Adhesive tape, connected structure and semiconductor package

Semiconductor device and method for manufacturing semiconductor device

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

WAFER DICING EMPLOYING EDGE REGION UNDERFILL REMOVAL

ADHESIVE FILM, MULTILAYER CIRCUIT BOARD, ELECTRONIC COMPONENT AND S...

METHOD FOR MANUFACTURING ELECTRONIC COMPONENT, AND ELECTRONIC COMPO...

CONDUCTIVE CONNECTING MATERIAL, METHOD FOR CONNECTING TERMINALS USI...

FLEXIBLE SUBSTRATE AND ELECTRONIC DEVICE

METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DE...

ADHESIVE TAPE

Semiconductor Device

Adhesive Tape, Semiconductor Package and Electronics

METHOD FOR BONDING SEMICONDUCTOR WAFERS AND METHOD FOR MANUFACTURIN...

SEMICONDUCTOR ELECTRONIC COMPONENT AND SEMICONDUCTOR DEVICE USING T...

ADHESIVE TAPE AND SEMICONDUCTOR DEVICE USING THE SAME

Semiconductor Device and Method for Manufacturing Semiconductor Device

ENCAPSULATING RESIN COMPOSITION FOR PREAPPLICATION, SEMICONDUCTOR D...