Satoru Kuramochi

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,183,661
- Issue date Dec 31, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 12,136,591
- Issue date Nov 5, 2024
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 12,080,637
- Issue date Sep 3, 2024
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 11,742,273
- Issue date Aug 29, 2023
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 11,728,243
- Issue date Aug 15, 2023
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 11,362,028
- Issue date Jun 14, 2022
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 10,950,533
- Issue date Mar 16, 2021
- Dai Nippon Printing Co., Ltd.
- Takamasa Takano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through electrode substrate and semiconductor device
- Patent number 10,847,444
- Issue date Nov 24, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,790,221
- Issue date Sep 29, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate
- Patent number 10,580,727
- Issue date Mar 3, 2020
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through-hole electrode substrate and semiconductor device using thr...
- Patent number 10,256,176
- Issue date Apr 9, 2019
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and production method thereof
- Patent number 8,114,714
- Issue date Feb 14, 2012
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing multilayer wiring board
- Patent number 8,069,560
- Issue date Dec 6, 2011
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device and production method thereof
- Patent number 7,772,684
- Issue date Aug 10, 2010
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a multilayer wiring board
- Patent number 7,690,109
- Issue date Apr 6, 2010
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multilayer wiring board and manufacture method thereof
- Patent number 7,091,589
- Issue date Aug 15, 2006
- Dai Nippon Printing Co., Ltd.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrode for plasma display panel and process for producing the same
- Patent number 7,011,931
- Issue date Mar 14, 2006
- Dai Nippon Printing, Co., Ltd.
- Sakurako Hatori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact/noncontact type data carrier module
- Patent number 6,634,564
- Issue date Oct 21, 2003
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electrode for plasma display panel and process for producing the same
- Patent number 6,333,140
- Issue date Dec 25, 2001
- Dai Nippon Printing Co., Ltd.
- Sakurako Hatori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Electrode for plasma display panel and process for producing the same
- Patent number 6,156,433
- Issue date Dec 5, 2000
- Dai Nippon Printing Co., Ltd.
- Sakurako Hatori
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Liquid development apparatus for developing electrostatic latent im...
- Patent number 6,141,517
- Issue date Oct 31, 2000
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Transfer sheet, and pattern-forming method
- Patent number 5,992,320
- Issue date Nov 30, 1999
- Dai Nippon Printing Co., Ltd.
- Yozo Kosaka
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Process for producing plasma display panel
- Patent number 5,909,083
- Issue date Jun 1, 1999
- Dai Nippon Printing Co., Ltd.
- Masaaki Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Liquid development apparatus for electrostatic latent image using a...
- Patent number 5,666,614
- Issue date Sep 9, 1997
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Liquid development and transfer apparatus for electrostatic latent...
- Patent number 5,477,313
- Issue date Dec 19, 1995
- Dai Nippon Printing Co., Ltd.
- Satoru Kuramochi
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Printing plate and printing process
- Patent number 5,165,343
- Issue date Nov 24, 1992
- Dai Nippon Insatsu Kabushiki Kaisha
- Eiichi Inoue
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20250046681
- Publication date Feb 6, 2025
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-VIA SUBSTRATE, MOUNTING SUBSTRATE, AND METHOD FOR MANUFACTU...
- Publication number 20240429149
- Publication date Dec 26, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20240404934
- Publication date Dec 5, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH VIA SUBSTRATE
- Publication number 20240339389
- Publication date Oct 10, 2024
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230335465
- Publication date Oct 19, 2023
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20230282557
- Publication date Sep 7, 2023
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20220246512
- Publication date Aug 4, 2022
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20210159153
- Publication date May 27, 2021
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20210028090
- Publication date Jan 28, 2021
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20200357733
- Publication date Nov 12, 2020
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20200152564
- Publication date May 14, 2020
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20190304888
- Publication date Oct 3, 2019
- DAI NIPPON PRINTING CO., LTD.
- Takamasa TAKANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE
- Publication number 20190198427
- Publication date Jun 27, 2019
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH-HOLE ELECTRODE SUBSTRATE
- Publication number 20190172780
- Publication date Jun 6, 2019
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE USING THROUGH...
- Publication number 20160276257
- Publication date Sep 22, 2016
- DAI NIPPON PRINTING CO., LTD.
- Satoru KURAMOCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF
- Publication number 20110035939
- Publication date Feb 17, 2011
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF
- Publication number 20070287230
- Publication date Dec 13, 2007
- DAI NIPPON PRINTING CO., LTD.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board and manufacture method thereof
- Publication number 20060185141
- Publication date Aug 24, 2006
- DAI NIPPON PRINTING CO., LTD.
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic device and production method thereof
- Publication number 20050157477
- Publication date Jul 21, 2005
- DAI NIPPON PRINTING CO., LTD.
- Satoru Kuramochi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Multilayer wiring board and manufacture method thereof
- Publication number 20050012217
- Publication date Jan 20, 2005
- Toshiaki Mori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Contact / noncontact type data carrier module
- Publication number 20020162894
- Publication date Nov 7, 2002
- Satoru Kuramochi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electrode for plasma display panel and process for producing the same
- Publication number 20020048730
- Publication date Apr 25, 2002
- DAI NIPPON PRINTING CO. , LTD.
- Sakurako Hatori
- H01 - BASIC ELECTRIC ELEMENTS

Satoru Kuramochi

Person

Patents Grantslast 30 patents

Through electrode substrate and semiconductor device

Through electrode substrate and semiconductor device

Through-hole electrode substrate

Through electrode substrate and semiconductor device

Through electrode substrate and semiconductor device

Through-hole electrode substrate

Through electrode substrate and semiconductor device

Through electrode substrate and semiconductor device

Through-hole electrode substrate

Through-hole electrode substrate

Through-hole electrode substrate and semiconductor device using thr...

Electronic device and production method thereof

Method of manufacturing multilayer wiring board

Electronic device and production method thereof

Method of manufacturing a multilayer wiring board

Multilayer wiring board and manufacture method thereof

Electrode for plasma display panel and process for producing the same

Contact/noncontact type data carrier module

Electrode for plasma display panel and process for producing the same

Electrode for plasma display panel and process for producing the same

Liquid development apparatus for developing electrostatic latent im...

Transfer sheet, and pattern-forming method

Process for producing plasma display panel

Liquid development apparatus for electrostatic latent image using a...

Liquid development and transfer apparatus for electrostatic latent...

Printing plate and printing process

Patents Applicationslast 30 patents

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH-VIA SUBSTRATE, MOUNTING SUBSTRATE, AND METHOD FOR MANUFACTU...

THROUGH-HOLE ELECTRODE SUBSTRATE

THROUGH VIA SUBSTRATE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH-HOLE ELECTRODE SUBSTRATE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH-HOLE ELECTRODE SUBSTRATE

THROUGH-HOLE ELECTRODE SUBSTRATE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE

THROUGH-HOLE ELECTRODE SUBSTRATE

THROUGH ELECTRODE SUBSTRATE AND SEMICONDUCTOR DEVICE USING THROUGH...

MULTILAYER WIRING BOARD AND MANUFACTURE METHOD THEREOF

ELECTRONIC DEVICE AND PRODUCTION METHOD THEREOF

Multilayer wiring board and manufacture method thereof

Electronic device and production method thereof

Multilayer wiring board and manufacture method thereof

Contact / noncontact type data carrier module

Electrode for plasma display panel and process for producing the same