Satoru Kurita

Person

Okayama, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding material and bonding method using same
- Patent number 12,048,964
- Issue date Jul 30, 2024
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joining material and joining method using same
- Patent number 11,453,053
- Issue date Sep 27, 2022
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,903,185
- Issue date Jan 26, 2021
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,821,558
- Issue date Nov 3, 2020
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,543,569
- Issue date Jan 28, 2020
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic part mounting substrate and method for producing same
- Patent number 10,510,557
- Issue date Dec 17, 2019
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method using same
- Patent number 10,328,534
- Issue date Jun 25, 2019
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of attaching an electronic part to a copper plate having a s...
- Patent number 9,831,157
- Issue date Nov 28, 2017
- Dowa Metaltech Co., Ltd.
- Naoya Sunachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal nanoparticle dispersion, method for producing metal nanoparti...
- Patent number 9,662,748
- Issue date May 30, 2017
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding method in which said bonding material...
- Patent number 9,533,380
- Issue date Jan 3, 2017
- Dowa Electronics Materials Co., Ltd.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material and bonding body, and bonding method
- Patent number 9,486,879
- Issue date Nov 8, 2016
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding material comprising coated silver nanoparticles and bonded...
- Patent number 9,273,235
- Issue date Mar 1, 2016
- Dowa Electronics Materials Co., Ltd.
- Satoru Kurita
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
BONDING MATERIAL AND BONDING METHOD EMPLOYING SAME
- Publication number 20200094318
- Publication date Mar 26, 2020
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Hideyuki FUJIMOTO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20200083062
- Publication date Mar 12, 2020
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDED PRODUCT USING SAME
- Publication number 20200035637
- Publication date Jan 30, 2020
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Tatsuro Hori
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR PRODUCING SILVER NANOWIRE INK, SILVER NANOWIRE INK, AND...
- Publication number 20190382607
- Publication date Dec 19, 2019
- DOWA ELECTRONICS MATERLS CO., LTD.
- Kimitaka SATO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20190283129
- Publication date Sep 19, 2019
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B22 - CASTING POWDER METALLURGY
Information Patent Application
JOINING MATERIAL AND JOINING METHOD USING SAME
- Publication number 20190118257
- Publication date Apr 25, 2019
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET
- Publication number 20180331063
- Publication date Nov 15, 2018
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170252874
- Publication date Sep 7, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20170120395
- Publication date May 4, 2017
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...
- Publication number 20160254243
- Publication date Sep 1, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru KURITA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20160211195
- Publication date Jul 21, 2016
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING MATERIAL AND BONDING METHOD USING SAME
- Publication number 20160136763
- Publication date May 19, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY
- Publication number 20160121435
- Publication date May 5, 2016
- Toyota Jidosha Kabushiki Kaisha
- Masashi FURUKAWA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...
- Publication number 20160101486
- Publication date Apr 14, 2016
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi ENDOH
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL...
- Publication number 20150028085
- Publication date Jan 29, 2015
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Keiichi Endoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME
- Publication number 20140147695
- Publication date May 29, 2014
- DOWA METALTECH CO., LTD.
- Naoya Sunachi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
LOW-TEMPERATURE SINTERABLE METAL NANOPARTICLE COMPOSITION AND ELECT...
- Publication number 20140120359
- Publication date May 1, 2014
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Gregory A JABLONSKI
- B82 - NANO-TECHNOLOGY
Information Patent Application
BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME
- Publication number 20140113109
- Publication date Apr 24, 2014
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD
- Publication number 20130323529
- Publication date Dec 5, 2013
- DOWA ELECTRONICS MATERIALS CO., LTD.
- Satoru Kurita
- B32 - LAYERED PRODUCTS

Satoru Kurita

Person

Patents Grantslast 30 patents

Bonding material and bonding method using same

Joining material and joining method using same

Bonding material and bonding method using same

Bonding material and bonding method using same

Bonding material and bonding method using same

Electronic part mounting substrate and method for producing same

Bonding material and bonding method using same

Method of attaching an electronic part to a copper plate having a s...

Metal nanoparticle dispersion, method for producing metal nanoparti...

Bonding material and bonding method in which said bonding material...

Bonding material and bonding body, and bonding method

Bonding material comprising coated silver nanoparticles and bonded...

Patents Applicationslast 30 patents

BONDING MATERIAL AND BONDING METHOD EMPLOYING SAME

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

BONDING MATERIAL AND BONDED PRODUCT USING SAME

METHOD FOR PRODUCING SILVER NANOWIRE INK, SILVER NANOWIRE INK, AND...

BONDING MATERIAL AND BONDING METHOD USING SAME

JOINING MATERIAL AND JOINING METHOD USING SAME

METHOD FOR JOINING ELECTRONIC PART USING A JOINING SILVER SHEET

BONDING MATERIAL AND BONDING METHOD USING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

JOINING SILVER SHEET, METHOD FOR MANUFACTURING SAME, AND METHOD FOR...

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

BONDING MATERIAL AND BONDING METHOD USING SAME

METAL PASTE FOR JOINING, JOINING METHOD AND JOINED BODY

METAL NANOPARTICLE DISPERSION, METHOD FOR PRODUCING METAL NANOPARTI...

BONDING MATERIAL AND BONDING METHOD IN WHICH SAID BONDING MATERIAL...

ELECTRONIC PART MOUNTING SUBSTRATE AND METHOD FOR PRODUCING SAME

LOW-TEMPERATURE SINTERABLE METAL NANOPARTICLE COMPOSITION AND ELECT...

BONDING MATERIAL AND BONDED OBJECT PRODUCED USING SAME

BONDING MATERIAL AND BONDING BODY, AND BONDING METHOD