Satoru Mori

Person

Sanda-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sputtering target material
- Patent number 11,427,888
- Issue date Aug 30, 2022
- Mitsubishi Materials Corporation
- Satoru Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
High purity copper sputtering target material
- Patent number 10,889,889
- Issue date Jan 12, 2021
- Mitsubishi Materials Corporation
- Satoru Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Cu—Ga alloy sputtering target and method of manufacturing Cu—Ga all...
- Patent number 10,822,691
- Issue date Nov 3, 2020
- Mitsubishi Materials Corporation
- Yuki Yoshida
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper alloy sputtering target and manufacturing method of copper a...
- Patent number 10,770,274
- Issue date Sep 8, 2020
- Mitsubishi Materials Corporation
- Satoru Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sputtering target for forming protective film, and laminated wiring...
- Patent number 10,538,059
- Issue date Jan 21, 2020
- Mitsubishi Materials Corporation
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target for forming protective film and multilayer wiring...
- Patent number 10,443,113
- Issue date Oct 15, 2019
- Mitsubishi Materials Corporation
- Satoru Mori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Sputtering target and method for producing same
- Patent number 10,351,946
- Issue date Jul 16, 2019
- Mitsubishi Materials Corporation
- Kazunori Igarashi
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Copper alloy sputtering target and manufacturing method of copper a...
- Patent number 10,062,552
- Issue date Aug 28, 2018
- Mitsubishi Materials Corporation
- Satoru Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu—Ga alloy sputtering target, and method for producing same
- Patent number 10,017,850
- Issue date Jul 10, 2018
- Mitsubishi Materials Corporation
- Yuuki Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Cu—Ga alloy sputtering target and method for producing same
- Patent number 9,748,080
- Issue date Aug 29, 2017
- Mitsubishi Materials Corporation
- Yuuki Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Sputtering target for forming protective film and laminated wiring...
- Patent number 9,543,128
- Issue date Jan 10, 2017
- Mitsubishi Materials Corporation
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper alloy sputtering target
- Patent number 9,518,320
- Issue date Dec 13, 2016
- Mitsubishi Materials Corporation
- Satoru Mori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method of forming thin film interconnect and thin film interconnect
- Patent number 8,796,144
- Issue date Aug 5, 2014
- Mitsubishi Materials Corporation
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor having a barrier layer as a constituting layer...
- Patent number 8,658,009
- Issue date Feb 25, 2014
- Mitsubishi Materials Corporation
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Thin-film transistor and intermediate of thin-film transistor
- Patent number 8,502,285
- Issue date Aug 6, 2013
- Mitsubishi Materials Corporation
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin-film transistor having high adhesive strength between barrier...
- Patent number 8,384,083
- Issue date Feb 26, 2013
- Mitsubishi Materials Corporation
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sputtering target for depositing ferroelectric film, method for pre...
- Patent number 5,997,704
- Issue date Dec 7, 1999
- Mitsubishi Materials Corporation
- Ichirou Shiono
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silver alloy foil for interconnector for solar cell
- Patent number 5,023,144
- Issue date Jun 11, 1991
- Mitsubishi Metal Corporation
- Shigeru Yamamoto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
SPUTTERING TARGET MATERIAL
- Publication number 20210010105
- Publication date Jan 14, 2021
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF MANUFACTURING Cu-Ga ALLOY SPUTTERING TARGET AND Cu-Ga ALL...
- Publication number 20190040524
- Publication date Feb 7, 2019
- MITSUBISHI MATERIALS CORPORATION
- Yuki Yoshida
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HIGH PURITY COPPER SPUTTERING TARGET MATERIAL
- Publication number 20180237901
- Publication date Aug 23, 2018
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cu-Ga ALLOY SPUTTERING TARGET AND METHOD OF MANUFACTURING Cu-Ga ALL...
- Publication number 20180066355
- Publication date Mar 8, 2018
- MITSUBISHI MATERIALS CORPORATION
- Yuki Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD OF COPPER A...
- Publication number 20170213711
- Publication date Jul 27, 2017
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu-Ga ALLOY SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
- Publication number 20170011895
- Publication date Jan 12, 2017
- MITSUBISHI MATERIALS CORPORATION
- Yuuki Yoshida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET AND METHOD FOR PRODUCING SAME
- Publication number 20160237551
- Publication date Aug 18, 2016
- MITSUBISHI MATERIALS CORPORATION
- Kazunori Igarashi
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CU-GA ALLOY SPUTTERING TARGET, AND METHOD FOR PRODUCING SAME
- Publication number 20160208376
- Publication date Jul 21, 2016
- MITSUBISHI MATERIALS CORPORATION
- Yuuki Yoshida
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SPUTTERING TARGET FOR FORMING PROTECTIVE FILM AND MULTILAYER WIRING...
- Publication number 20160201188
- Publication date Jul 14, 2016
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY SPUTTERING TARGET
- Publication number 20150060269
- Publication date Mar 5, 2015
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD OF COPPER A...
- Publication number 20150034482
- Publication date Feb 5, 2015
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SPUTTERING TARGET FOR FORMING PROTECTIVE FILM, AND LAMINATED WIRING...
- Publication number 20140315043
- Publication date Oct 23, 2014
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- B32 - LAYERED PRODUCTS
Information Patent Application
SPUTTERING TARGET FOR FORMING PROTECTIVE FILM AND LAMINATED WIRING...
- Publication number 20140227557
- Publication date Aug 14, 2014
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING THIN FILM INTERCONNECT AND THIN FILM INTERCONNECT
- Publication number 20130214412
- Publication date Aug 22, 2013
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR HAVING A BARRIER LAYER AS A CONSTITUTING LAYER...
- Publication number 20110309444
- Publication date Dec 22, 2011
- Ulvac, Inc.
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THIN-FILM TRANSISTOR HAVING HIGH ADHESIVE STRENGTH BETWEEN BARRIER...
- Publication number 20110193088
- Publication date Aug 11, 2011
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPUTTERING TARGET FOR FORMING THIN FILM TRANSISTOR WIRING FILM
- Publication number 20110192719
- Publication date Aug 11, 2011
- MITSUBISHI MATERIALS CORPORATION
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
THIN-FILM TRANSISTOR AND INTERMEDIATE OF THIN-FILM TRANSISTOR
- Publication number 20110133190
- Publication date Jun 9, 2011
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phase change film for semiconductor nonvolatile memory and sputteri...
- Publication number 20070053786
- Publication date Mar 8, 2007
- Mitsubishi Materials Corporation
- Sohei Nonaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Phase change recording film having high electric resistance and spu...
- Publication number 20050031484
- Publication date Feb 10, 2005
- MITSUBISHI MATERIALS CORPORATION
- Sohei Nonaka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Satoru Mori

Person

Patents Grantslast 30 patents

Sputtering target material

High purity copper sputtering target material

Cu—Ga alloy sputtering target and method of manufacturing Cu—Ga all...

Copper alloy sputtering target and manufacturing method of copper a...

Sputtering target for forming protective film, and laminated wiring...

Sputtering target for forming protective film and multilayer wiring...

Sputtering target and method for producing same

Copper alloy sputtering target and manufacturing method of copper a...

Cu—Ga alloy sputtering target, and method for producing same

Cu—Ga alloy sputtering target and method for producing same

Sputtering target for forming protective film and laminated wiring...

Copper alloy sputtering target

Method of forming thin film interconnect and thin film interconnect

Thin film transistor having a barrier layer as a constituting layer...

Thin-film transistor and intermediate of thin-film transistor

Thin-film transistor having high adhesive strength between barrier...

Sputtering target for depositing ferroelectric film, method for pre...

Silver alloy foil for interconnector for solar cell

Patents Applicationslast 30 patents

SPUTTERING TARGET MATERIAL

METHOD OF MANUFACTURING Cu-Ga ALLOY SPUTTERING TARGET AND Cu-Ga ALL...

HIGH PURITY COPPER SPUTTERING TARGET MATERIAL

Cu-Ga ALLOY SPUTTERING TARGET AND METHOD OF MANUFACTURING Cu-Ga ALL...

COPPER ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD OF COPPER A...

Cu-Ga ALLOY SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

SPUTTERING TARGET AND METHOD FOR PRODUCING SAME

CU-GA ALLOY SPUTTERING TARGET, AND METHOD FOR PRODUCING SAME

SPUTTERING TARGET FOR FORMING PROTECTIVE FILM AND MULTILAYER WIRING...

COPPER ALLOY SPUTTERING TARGET

COPPER ALLOY SPUTTERING TARGET AND MANUFACTURING METHOD OF COPPER A...

SPUTTERING TARGET FOR FORMING PROTECTIVE FILM, AND LAMINATED WIRING...

SPUTTERING TARGET FOR FORMING PROTECTIVE FILM AND LAMINATED WIRING...

METHOD OF FORMING THIN FILM INTERCONNECT AND THIN FILM INTERCONNECT

THIN FILM TRANSISTOR HAVING A BARRIER LAYER AS A CONSTITUTING LAYER...

THIN-FILM TRANSISTOR HAVING HIGH ADHESIVE STRENGTH BETWEEN BARRIER...

SPUTTERING TARGET FOR FORMING THIN FILM TRANSISTOR WIRING FILM

THIN-FILM TRANSISTOR AND INTERMEDIATE OF THIN-FILM TRANSISTOR

Phase change film for semiconductor nonvolatile memory and sputteri...

Phase change recording film having high electric resistance and spu...