Satoru Tomekawa

Person

Kyoto, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive paste composition
- Patent number 11,739,232
- Issue date Aug 29, 2023
- Kyoto Elex Co., Ltd.
- Toyoharu Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermosetting electroconductive paste composition, and solar cell a...
- Patent number 10,707,360
- Issue date Jul 7, 2020
- KYOTO ELEX CO., LTD.
- Toyoharu Matsubara
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer wiring substrate and manufacturing method of multilayer...
- Patent number 8,604,350
- Issue date Dec 10, 2013
- Panasonic Corporation
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring board, wiring board manufacturing method, and via paste
- Patent number 8,563,872
- Issue date Oct 22, 2013
- Panasonic Corporation
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
CONDUCTIVE ADHESIVE COMPOSITION
- Publication number 20230323162
- Publication date Oct 12, 2023
- KYOTO ELEX CO., LTD.
- Takamitsu ARAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE PASTE COMPOSITION
- Publication number 20220228015
- Publication date Jul 21, 2022
- KYOTO ELEX CO., LTD.
- Toyoharu MATSUBARA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMOSETTING ELECTROCONDUCTIVE PASTE COMPOSITION, AND SOLAR CELL A...
- Publication number 20190013422
- Publication date Jan 10, 2019
- KYOTO ELEX CO., LTD.
- Toyoharu MATSUBARA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130068513
- Publication date Mar 21, 2013
- KYOTO ELEX CO., LTD.
- Shogo Hirai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE
- Publication number 20130008698
- Publication date Jan 10, 2013
- PANASONIC CORPORATION
- Tsuyoshi Himori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE
- Publication number 20110290549
- Publication date Dec 1, 2011
- Shogo Hirai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD OF MULTILAYER...
- Publication number 20110278051
- Publication date Nov 17, 2011
- Tsuyoshi Himori
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Satoru Tomekawa

Person

Patents Grantslast 30 patents

Conductive paste composition

Thermosetting electroconductive paste composition, and solar cell a...

Multilayer wiring substrate and manufacturing method of multilayer...

Wiring board, wiring board manufacturing method, and via paste

Patents Applicationslast 30 patents

CONDUCTIVE ADHESIVE COMPOSITION

CONDUCTIVE PASTE COMPOSITION

THERMOSETTING ELECTROCONDUCTIVE PASTE COMPOSITION, AND SOLAR CELL A...

WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

MULTILAYER WIRING BOARD, PRODUCTION METHOD OF THE SAME, AND VIA PASTE

WIRING BOARD, WIRING BOARD MANUFACTURING METHOD, AND VIA PASTE

MULTILAYER WIRING SUBSTRATE AND MANUFACTURING METHOD OF MULTILAYER...