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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor packaging structure and package having stress release...
- Patent number 9,859,185
- Issue date Jan 2, 2018
- Kyocera International, Inc.
- Satoru Tomie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE AND PACKAGE HAVING STRESS RELEASE...
- Publication number 20170221790
- Publication date Aug 3, 2017
- Kyocera International, Inc.
- Satoru TOMIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL MODULE AND OPTICAL MODULE PACKAGE INCORPORATING A HIGH-THER...
- Publication number 20160377823
- Publication date Dec 29, 2016
- Kyocera America Inc
- Paul GARLAND
- G02 - OPTICS