Satoru Yamamoto

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate cleaning method and substrate cleaning apparatus
- Patent number 12,030,092
- Issue date Jul 9, 2024
- Ebara Corporation
- Kenji Kodera
- B08 - CLEANING
Information Patent Grant
Substrate processing method and apparatus
- Patent number 10,811,284
- Issue date Oct 20, 2020
- Ebara Corporation
- Toshifumi Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vacuum suction pad and substrate holder
- Patent number 10,639,727
- Issue date May 5, 2020
- Ebara Corporation
- Satoru Yamamoto
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Vacuum contact pad
- Patent number D859331
- Issue date Sep 10, 2019
- Ebara Corporation
- Satoru Yamamoto
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Pressing member for substrate polishing apparatus
- Patent number D851140
- Issue date Jun 11, 2019
- Ebara Corporation
- Kenji Kamimura
- D15 - Machines not elsewhere specified
Information Patent Grant
Pressing member for substrate polishing apparatus
- Patent number D851142
- Issue date Jun 11, 2019
- Ebara Corporation
- Kenji Kamimura
- D15 - Machines not elsewhere specified
Information Patent Grant
Pressing member for substrate polishing apparatus
- Patent number D851141
- Issue date Jun 11, 2019
- Ebara Corporation
- Kenji Kamimura
- D15 - Machines not elsewhere specified
Information Patent Grant
Pressing member for substrate polishing apparatus
- Patent number D834075
- Issue date Nov 20, 2018
- Ebara Corporation
- Kenji Kamimura
- D15 - Machines not elsewhere specified
Information Patent Grant
Assembly structure for casing of electronic device, and electronic...
- Patent number 10,111,350
- Issue date Oct 23, 2018
- Mitsubishi Electric Corporation
- Takafumi Morihara
- B60 - VEHICLES IN GENERAL
Information Patent Grant
PLL circuit with improved phase difference detection
- Patent number 8,754,713
- Issue date Jun 17, 2014
- Renesas Electronics Corporation
- Toshiya Uozumi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor device and radio communication terminal mounting the...
- Patent number 8,633,746
- Issue date Jan 21, 2014
- Renesas Mobile Corporation
- Takayasu Norimatsu
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electroplating apparatus and electroplating method
- Patent number 8,029,653
- Issue date Oct 4, 2011
- Ebara Corporation
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Substrate processing apparatus and substrate processing method
- Patent number 7,947,156
- Issue date May 24, 2011
- Ebara Corporation
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
PLL circuit with improved phase difference detection
- Patent number 7,859,344
- Issue date Dec 28, 2010
- Renesas Electronics Corporation
- Toshiya Uozumi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,736,474
- Issue date Jun 15, 2010
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plating apparatus and plating method
- Patent number 7,553,400
- Issue date Jun 30, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Communication semiconductor integrated circuit device and a wireles...
- Patent number 7,499,689
- Issue date Mar 3, 2009
- Renesas Technology Corp.
- Toshiya Uozumi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Communication semiconductor integrated circuit device and a wireles...
- Patent number 7,499,688
- Issue date Mar 3, 2009
- Renesas Technology Corp.
- Toshiya Uozumi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Plating method and plating apparatus
- Patent number 7,479,213
- Issue date Jan 20, 2009
- Ebara Corporation
- Mizuki Nagai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wireless communication semiconductor integrated circuit device and...
- Patent number 7,423,493
- Issue date Sep 9, 2008
- Renesas Technology Corporation
- Toshiya Uozumi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Plating apparatus for substrate
- Patent number 7,311,809
- Issue date Dec 25, 2007
- Ebara Corporation
- Keiichi Kurashina
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit for wireless communication
- Patent number 7,301,416
- Issue date Nov 27, 2007
- Renesas Technology Corp.
- Satoru Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Semiconductor integrated circuit with PLL circuit
- Patent number 7,279,991
- Issue date Oct 9, 2007
- Renesas Technology Corp.
- Jiro Shinbo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Communication semiconductor integrated circuit device and a wireles...
- Patent number 7,205,850
- Issue date Apr 17, 2007
- Renesas Technology Corp.
- Toshiya Uozumi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Communication semiconductor integrated circuit device and wireless...
- Patent number 7,154,341
- Issue date Dec 26, 2006
- Renesas Technology Corp.
- Satoru Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Wireless communication semiconductor integrated circuit device and...
- Patent number 7,123,102
- Issue date Oct 17, 2006
- Renesas Technology Corporation
- Toshiya Uozumi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Transformerless charger with terminal safety features
- Patent number 7,023,176
- Issue date Apr 4, 2006
- Uniden Corporation
- Hiroshi Maebashi
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER

Patents Applicationslast 30 patents

Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20240109161
- Publication date Apr 4, 2024
- EBARA CORPORATION
- Satoru YAMAMOTO
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS
- Publication number 20220288650
- Publication date Sep 15, 2022
- EBARA CORPORATION
- Kenji Kodera
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORA...
- Publication number 20220130662
- Publication date Apr 28, 2022
- EBARA CORPORATION
- Satoru Yamamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORA...
- Publication number 20200066510
- Publication date Feb 27, 2020
- EBARA CORPORATION
- Satoru Yamamoto
- B08 - CLEANING
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20190385834
- Publication date Dec 19, 2019
- EBARA CORPORATION
- Masayuki NAKANISHI
- B24 - GRINDING POLISHING
Information Patent Application
VACUUM SUCTION PAD AND SUBSTRATE HOLDER
- Publication number 20180286772
- Publication date Oct 4, 2018
- EBARA CORPORATION
- Satoru YAMAMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING METHOD AND APPARATUS
- Publication number 20180277401
- Publication date Sep 27, 2018
- EBARA CORPORATION
- Toshifumi WATANABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ASSEMBLY STRUCTURE FOR CASING OF ELECTRONIC DEVICE, AND ELECTRONIC...
- Publication number 20180213661
- Publication date Jul 26, 2018
- Mitsubishi Electric Corporation
- Takafumi MORIHARA
- B60 - VEHICLES IN GENERAL
Information Patent Application
SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION TERMINAL MOUNTING THE...
- Publication number 20130093479
- Publication date Apr 18, 2013
- Renesas Mobile Corporation
- Takayasu NORIMATSU
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PLL CIRCUIT WITH IMPROVED PHASE DIFFERENCE DETECTION
- Publication number 20110064150
- Publication date Mar 17, 2011
- RENESAS ELECTRONICS CORPORATION
- Toshiya UOZUMI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
APPLIANCE CLAMPING BUSH AND APPLIANCE CLAMPING DEVICE USING THE SAME
- Publication number 20100226712
- Publication date Sep 9, 2010
- Takao Kuroki
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
PLATING APPARATUS AND PLATING METHOD
- Publication number 20100219078
- Publication date Sep 2, 2010
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Plating apparatus and plating method
- Publication number 20100163408
- Publication date Jul 1, 2010
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLL CIRCUIT
- Publication number 20100097150
- Publication date Apr 22, 2010
- Keisuke Ueda
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PLL CIRCUIT
- Publication number 20090267664
- Publication date Oct 29, 2009
- Toshiya UOZUMI
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20090020434
- Publication date Jan 22, 2009
- Akira Susaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Wireless communication semiconductor integrated circuit device and...
- Publication number 20080278245
- Publication date Nov 13, 2008
- Toshiya Uozumi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Substrate processing apparatus and substrate processing method
- Publication number 20080099340
- Publication date May 1, 2008
- Hiroyuki Kanda
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplating apparatus and electroplating method
- Publication number 20080029398
- Publication date Feb 7, 2008
- Satoru Yamamoto
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor integrated circuit with PLL circuit
- Publication number 20080012649
- Publication date Jan 17, 2008
- Jiro Shinbo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Semiconductor integrated circuit with PLL circuit
- Publication number 20080012650
- Publication date Jan 17, 2008
- Jiro Shinbo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Plating apparatus and plating method
- Publication number 20070238265
- Publication date Oct 11, 2007
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Communication semiconductor integrated circuit device and a wireles...
- Publication number 20070164828
- Publication date Jul 19, 2007
- Toshiya Uozumi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Communication semiconductor integrated circuit device and a wireles...
- Publication number 20070161360
- Publication date Jul 12, 2007
- Toshiya Uozumi
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Operation mechanism
- Publication number 20060283285
- Publication date Dec 21, 2006
- Hiroyuki Yabashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wireless communication semiconductor integrated circuit device and...
- Publication number 20060267699
- Publication date Nov 30, 2006
- Toshiya Uozumi
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor integrated circuit for communication
- Publication number 20060220757
- Publication date Oct 5, 2006
- Kunito Satake
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Plating apparatus and plating method
- Publication number 20060086616
- Publication date Apr 27, 2006
- Keiichi Kurashina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Semiconductor integrated circuit for wireless communication
- Publication number 20060014510
- Publication date Jan 19, 2006
- Satoru Yamamoto
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Semiconductor integrated circuit with PLL circuit
- Publication number 20060012442
- Publication date Jan 19, 2006
- Jiro Shinbo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Satoru Yamamoto

Person

Patents Grantslast 30 patents

Substrate cleaning method and substrate cleaning apparatus

Substrate processing method and apparatus

Vacuum suction pad and substrate holder

Vacuum contact pad

Pressing member for substrate polishing apparatus

Pressing member for substrate polishing apparatus

Pressing member for substrate polishing apparatus

Pressing member for substrate polishing apparatus

Assembly structure for casing of electronic device, and electronic...

PLL circuit with improved phase difference detection

Semiconductor device and radio communication terminal mounting the...

Electroplating apparatus and electroplating method

Substrate processing apparatus and substrate processing method

PLL circuit with improved phase difference detection

Plating apparatus and plating method

Plating apparatus and plating method

Communication semiconductor integrated circuit device and a wireles...

Communication semiconductor integrated circuit device and a wireles...

Plating method and plating apparatus

Wireless communication semiconductor integrated circuit device and...

Plating apparatus for substrate

Semiconductor integrated circuit for wireless communication

Semiconductor integrated circuit with PLL circuit

Communication semiconductor integrated circuit device and a wireles...

Communication semiconductor integrated circuit device and wireless...

Wireless communication semiconductor integrated circuit device and...

Transformerless charger with terminal safety features

Patents Applicationslast 30 patents

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE CLEANING METHOD AND SUBSTRATE CLEANING APPARATUS

SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORA...

SUBSTRATE PROCESSING DEVICE, SUBSTRATE PROCESSING METHOD, AND STORA...

SUBSTRATE PROCESSING METHOD

VACUUM SUCTION PAD AND SUBSTRATE HOLDER

SUBSTRATE PROCESSING METHOD AND APPARATUS

ASSEMBLY STRUCTURE FOR CASING OF ELECTRONIC DEVICE, AND ELECTRONIC...

SEMICONDUCTOR DEVICE AND RADIO COMMUNICATION TERMINAL MOUNTING THE...

PLL CIRCUIT WITH IMPROVED PHASE DIFFERENCE DETECTION

APPLIANCE CLAMPING BUSH AND APPLIANCE CLAMPING DEVICE USING THE SAME

PLATING APPARATUS AND PLATING METHOD

Plating apparatus and plating method

PLL CIRCUIT

PLL CIRCUIT

Substrate processing method and substrate processing apparatus

Wireless communication semiconductor integrated circuit device and...

Substrate processing apparatus and substrate processing method

Electroplating apparatus and electroplating method

Semiconductor integrated circuit with PLL circuit

Semiconductor integrated circuit with PLL circuit

Plating apparatus and plating method

Communication semiconductor integrated circuit device and a wireles...

Communication semiconductor integrated circuit device and a wireles...

Operation mechanism

Wireless communication semiconductor integrated circuit device and...

Semiconductor integrated circuit for communication

Plating apparatus and plating method

Semiconductor integrated circuit for wireless communication

Semiconductor integrated circuit with PLL circuit