SATORU YUHAKU

Person

OSAKA, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Laminated mounting structure and memory card
- Patent number 7,875,974
- Issue date Jan 25, 2011
- Panasonic Corporation
- Manabu Gokan
- G11 - INFORMATION STORAGE
Information Patent Grant
Method for manufacturing component built-in module, and component b...
- Patent number 7,488,895
- Issue date Feb 10, 2009
- Panasonic Corporation
- Yoshitake Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component built-in module with embedded semiconductor chip...
- Patent number 7,018,866
- Issue date Mar 28, 2006
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit component built-in module with embedded semiconductor chip...
- Patent number 6,784,530
- Issue date Aug 31, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for planarizing circuit board and method for manufacturing s...
- Patent number 6,723,251
- Issue date Apr 20, 2004
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for planarizing circuit board and method for manufacturing s...
- Patent number 6,703,262
- Issue date Mar 9, 2004
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating bump electrodes with a leveling step for uni...
- Patent number 6,207,550
- Issue date Mar 27, 2001
- Matsushita Electric Industrial Co., Ltd.
- Nobuhiro Hase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thixotropic conductive paste
- Patent number 5,688,441
- Issue date Nov 18, 1997
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making multi-layered ceramic substrates
- Patent number 5,662,755
- Issue date Sep 2, 1997
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a ceramic substrate
- Patent number 5,547,530
- Issue date Aug 20, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ceramic substrate and manufacturing method thereof
- Patent number 5,525,402
- Issue date Jun 11, 1996
- Matsushita Electric Industrial Co., Ltd.
- Yoshifumi Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thixotropic conductive paste
- Patent number 5,503,777
- Issue date Apr 2, 1996
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly formed from conductive paste and insulating paste
- Patent number 5,496,619
- Issue date Mar 5, 1996
- Matsushita Electric Industrial Co., Ltd.
- Minehiro Itagaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive ink
- Patent number 5,407,473
- Issue date Apr 18, 1995
- Matsushita Electric Industrial Co., Ltd.
- Kazuhiro Miura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing multilayered ceramic substrate
- Patent number 5,370,759
- Issue date Dec 6, 1994
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiko Hakotani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayered ceramic substrate and method of manufacturing the same
- Patent number 5,252,519
- Issue date Oct 12, 1993
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated ceramic capacitor
- Patent number 5,014,158
- Issue date May 7, 1991
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Nishimura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Multilayered ceramic substrates and method for manufacturing the same
- Patent number 5,004,640
- Issue date Apr 2, 1991
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Conductor composition and method of manufacturing a multilayered ce...
- Patent number 4,906,405
- Issue date Mar 6, 1990
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Conductor composition and method of manufacturing a ceramic multila...
- Patent number 4,877,555
- Issue date Oct 31, 1989
- Matsushita Electric Industrial Co., Ltd.
- Satoru Yuhaku
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductor paste and method of manufacturing a multilayered ceramic...
- Patent number 4,863,683
- Issue date Sep 5, 1989
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Dielectric paste and method of manufacturing the paste
- Patent number 4,812,422
- Issue date Mar 14, 1989
- Matsushita Electric Industrial Co., Ltd.
- Satoru Yuhaku
- C03 - GLASS MINERAL OR SLAG WOOL
Information Patent Grant
Method of manufacturing a multilayer ceramic body
- Patent number 4,795,512
- Issue date Jan 3, 1989
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Conductor paste and method of manufacturing a multilayered ceramic...
- Patent number 4,714,570
- Issue date Dec 22, 1987
- Matsushita Electric Industrial Co., Ltd.
- Seiichi Nakatani
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Thick film conductor composition
- Patent number 4,695,403
- Issue date Sep 22, 1987
- Matsushita Electric Industrial Co., Ltd.
- Tsutomu Nishimura
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Grant
Mold for direct press molding of optical glass element
- Patent number 4,606,750
- Issue date Aug 19, 1986
- Matsushita Electric Industrial Co., Ltd.
- Hideo Torii
- C03 - GLASS MINERAL OR SLAG WOOL

Patents Applicationslast 30 patents

Information Patent Application
LAMINATED MOUNTING STRUCTURE AND MEMORY CARD
- Publication number 20090166838
- Publication date Jul 2, 2009
- Manabu Gokan
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD
- Publication number 20090166839
- Publication date Jul 2, 2009
- Panasonic Corporation
- Naoki Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing component built-in module, and component b...
- Publication number 20070119617
- Publication date May 31, 2007
- Matsushita Electric Industrial Co., Ltd.
- Yoshitake Hayashi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit component built-in module with embedded semiconductor chip...
- Publication number 20040145044
- Publication date Jul 29, 2004
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit component built-in module and method of manufacturing the same
- Publication number 20030137045
- Publication date Jul 24, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal wiring board, semiconductor device, and method for manufactur...
- Publication number 20030127725
- Publication date Jul 10, 2003
- Matsushita Electric Industrial Co., Ltd.
- Yasuhiro Sugaya
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for planarizing circuit board and method for manufacturing s...
- Publication number 20030092327
- Publication date May 15, 2003
- MINEHIRO ITAGAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PLANARIZING CIRCUIT BOARD AND METHOD FOR MANUFACTURING S...
- Publication number 20010029066
- Publication date Oct 11, 2001
- MINEHIRO ITAGAKI
- H01 - BASIC ELECTRIC ELEMENTS

SATORU YUHAKU

Person

Patents Grantslast 30 patents

Laminated mounting structure and memory card

Method for manufacturing component built-in module, and component b...

Circuit component built-in module with embedded semiconductor chip...

Circuit component built-in module with embedded semiconductor chip...

Method for planarizing circuit board and method for manufacturing s...

Method for planarizing circuit board and method for manufacturing s...

Method for fabricating bump electrodes with a leveling step for uni...

Thixotropic conductive paste

Method of making multi-layered ceramic substrates

Method of manufacturing a ceramic substrate

Ceramic substrate and manufacturing method thereof

Thixotropic conductive paste

Assembly formed from conductive paste and insulating paste

Conductive ink

Method for producing multilayered ceramic substrate

Multilayered ceramic substrate and method of manufacturing the same

Laminated ceramic capacitor

Multilayered ceramic substrates and method for manufacturing the same

Conductor composition and method of manufacturing a multilayered ce...

Conductor composition and method of manufacturing a ceramic multila...

Conductor paste and method of manufacturing a multilayered ceramic...

Dielectric paste and method of manufacturing the paste

Method of manufacturing a multilayer ceramic body

Conductor paste and method of manufacturing a multilayered ceramic...

Thick film conductor composition

Mold for direct press molding of optical glass element

Patents Applicationslast 30 patents

LAMINATED MOUNTING STRUCTURE AND MEMORY CARD

SEMICONDUCTOR STACK DEVICE AND MOUNTING METHOD

Method for manufacturing component built-in module, and component b...

Circuit component built-in module with embedded semiconductor chip...

Circuit component built-in module and method of manufacturing the same

Metal wiring board, semiconductor device, and method for manufactur...

Method for planarizing circuit board and method for manufacturing s...

METHOD FOR PLANARIZING CIRCUIT BOARD AND METHOD FOR MANUFACTURING S...