Satoshi Ebihara

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Ibaraki, JP

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Patents Grantslast 30 patents

Information Patent Grant
Adhesive composition using polyamide-imide resin
- Patent number 10,913,249
- Issue date Feb 9, 2021
- Toyobo Co., Ltd.
- Takehisa Yane
- B32 - LAYERED PRODUCTS
Information Patent Grant
Flexible printed board and method for manufacturing flexible printe...
- Patent number 10,485,093
- Issue date Nov 19, 2019
- Nippon Mektron, Ltd.
- Satoshi Ebihara
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Shielding film, shielded printed circuit board, shielded flexible p...
- Patent number 7,709,750
- Issue date May 4, 2010
- Tatsuta System Electronics Co, Ltd.
- Kazuhiro Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE PRINTED BOARD AND METHOD FOR MANUFACTURING FLEXIBLE PRINTE...
- Publication number 20190090345
- Publication date Mar 21, 2019
- NIPPON MEKTRON, LTD.
- Satoshi EBIHARA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN
- Publication number 20180362815
- Publication date Dec 20, 2018
- Toyobo Co., Ltd.
- Takehisa YANE
- B32 - LAYERED PRODUCTS
Information Patent Application
ADHESIVE COMPOSITION USING POLYAMIDE-IMIDE RESIN
- Publication number 20170002242
- Publication date Jan 5, 2017
- TOYOBO CO., LTD.
- Takehisa YANE
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SHIELDING FILM, SHIELDED PRINTED CIRCUIT BOARD, SHIELDED FLEXIBLE P...
- Publication number 20090038839
- Publication date Feb 12, 2009
- TATSUTA SYSTEM ELECTRONICS Co., LTD
- Kazuhiro Hashimoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR