Satoshi Fujisawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Surface-treated copper foil, method for producing same, and copper...
- Patent number 8,852,754
- Issue date Oct 7, 2014
- Furukawa Electric Co., Ltd.
- Satoshi Fujisawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Flexible copper clad laminate
- Patent number 8,557,392
- Issue date Oct 15, 2013
- Furukawa Electric Co., Ltd.
- Satoshi Fujisawa
- B32 - LAYERED PRODUCTS
Information Patent Grant
Surface treated copper foil and copper clad laminate
- Patent number 8,512,873
- Issue date Aug 20, 2013
- Furukawa Electric Co., Ltd.
- Satoshi Fujisawa
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,985,488
- Issue date Jul 26, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,892,655
- Issue date Feb 22, 2011
- The Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Ultrathin copper foil with carrier and printed circuit board using...
- Patent number 7,771,841
- Issue date Aug 10, 2010
- Furukawa Electric Co., Ltd.
- Yuuji Suzuki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SURFACE-TREATED ROUGHENED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20130084463
- Publication date Apr 4, 2013
- FURUKAWA ELECTRIC CO., LTD.
- Satoshi Fujisawa
- B32 - LAYERED PRODUCTS
Information Patent Application
SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER...
- Publication number 20130040162
- Publication date Feb 14, 2013
- FURUKAWA ELECTRIC CO. LTD.
- Satoshi Fujisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMIN...
- Publication number 20120285734
- Publication date Nov 15, 2012
- FURUKAWA ELECTRIC CO., LTD.
- Takeo Uno
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
FLEXIBLE COPPER CLAD LAMINATE
- Publication number 20110189501
- Publication date Aug 4, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Satoshi Fujisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATED COPPER FOIL AND COPPER CLAD LAMINATE
- Publication number 20110189499
- Publication date Aug 4, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Satoshi Fujisawa
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20100270063
- Publication date Oct 28, 2010
- THE FURUKAWA ELECTRIC CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...
- Publication number 20070154692
- Publication date Jul 5, 2007
- Furukawa Circuit Foil Co., Ltd.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ultrathin copper foil with carrier and printed circuit board using...
- Publication number 20070141381
- Publication date Jun 21, 2007
- FURUKAWA CIRCUIT FOIL CO., LTD.
- Yuuji Suzuki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Satoshi Fujisawa

Person

Patents Grantslast 30 patents

Surface-treated copper foil, method for producing same, and copper...

Flexible copper clad laminate

Surface treated copper foil and copper clad laminate

Ultrathin copper foil with carrier and printed circuit board using...

Ultrathin copper foil with carrier and printed circuit board using...

Ultrathin copper foil with carrier and printed circuit board using...

Patents Applicationslast 30 patents

SURFACE-TREATED ROUGHENED COPPER FOIL AND COPPER CLAD LAMINATE

SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER...

ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, COPPER CLAD LAMIN...

FLEXIBLE COPPER CLAD LAMINATE

SURFACE TREATED COPPER FOIL AND COPPER CLAD LAMINATE

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

ULTRATHIN COPPER FOIL WITH CARRIER AND PRINTED CIRCUIT BOARD USING...

Ultrathin copper foil with carrier and printed circuit board using...