Satoshi Hayashi

Person

Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Production method for polyamide acid particles, production method f...
- Patent number 9,228,118
- Issue date Jan 5, 2016
- Sekisui Chemical Co., Ltd.
- Satoshi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacturing semiconductor chip
- Patent number 7,335,578
- Issue date Feb 26, 2008
- Sekisui Chemical Co., Ltd.
- Masateru Fukuoka
- B24 - GRINDING POLISHING
Information Patent Grant
IC chip manufacturing method
- Patent number 6,939,741
- Issue date Sep 6, 2005
- Sekisui Chemical Co., Ltd.
- Masateru Fukuoka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC C...
- Publication number 20230348767
- Publication date Nov 2, 2023
- Sekisui Chemical Co., Ltd
- Izumi DAIDO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND ELECTRONI...
- Publication number 20230312923
- Publication date Oct 5, 2023
- Sekisui Chemical Co., Ltd
- Toshio TAKAHASHI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRODUCTION METHOD FOR POLYAMIDE ACID PARTICLES, PRODUCTION METHOD F...
- Publication number 20130289156
- Publication date Oct 31, 2013
- Satoshi Hayashi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Ic Chip Manufacturing Method
- Publication number 20080314507
- Publication date Dec 25, 2008
- Munehiro Hatai
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20070037364
- Publication date Feb 15, 2007
- Daihei Sugita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive material, method for peeling adhesive material, and pressu...
- Publication number 20060269715
- Publication date Nov 30, 2006
- Sekisui Chemical Co., Ltd.
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive material, method for peeling adhesive material, and pressu...
- Publication number 20050173051
- Publication date Aug 11, 2005
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive substance, adhesive product, and connected structure
- Publication number 20050054758
- Publication date Mar 10, 2005
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive material, method for unsticking adhesive material and boun...
- Publication number 20040261943
- Publication date Dec 30, 2004
- Masateru Fukuoka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for manufacturing semiconductor chip
- Publication number 20040259332
- Publication date Dec 23, 2004
- Masateru Fukuoka
- B24 - GRINDING POLISHING
Information Patent Application
Pressure sensitive adhesive double coated tape and method for produ...
- Publication number 20040248382
- Publication date Dec 9, 2004
- Munehiro Hatai
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Ic chip manufacturing method
- Publication number 20040185639
- Publication date Sep 23, 2004
- Masateru Fukuoka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Satoshi Hayashi

Person

Patents Grantslast 30 patents

Production method for polyamide acid particles, production method f...

Method for manufacturing semiconductor chip

IC chip manufacturing method

Patents Applicationslast 30 patents

PROVISIONAL FIXATION MATERIAL AND METHOD FOR PRODUCING ELECTRONIC C...

CURABLE RESIN COMPOSITION, TEMPORARY FIXING MATERIAL, AND ELECTRONI...

PRODUCTION METHOD FOR POLYAMIDE ACID PARTICLES, PRODUCTION METHOD F...

Ic Chip Manufacturing Method

Method for manufacturing semiconductor chip

Adhesive material, method for peeling adhesive material, and pressu...

Adhesive material, method for peeling adhesive material, and pressu...

Adhesive substance, adhesive product, and connected structure

Adhesive material, method for unsticking adhesive material and boun...

Method for manufacturing semiconductor chip

Pressure sensitive adhesive double coated tape and method for produ...

Ic chip manufacturing method