Satoshi Honda

Person

Ibaraki-shi, Osaka, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Pressure-sensitive adhesive sheet and method for peeling pressure-s...
- Patent number 12,071,573
- Issue date Aug 27, 2024
- Nitto Denko Corporation
- Naofumi Kosaka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for peeling pressure-sensitive adhesive sheet
- Patent number 11,970,644
- Issue date Apr 30, 2024
- Nitto Denko Corporation
- Naofumi Kosaka
- B32 - LAYERED PRODUCTS
Information Patent Grant
Thermal bonding sheet and thermal bonding sheet with dicing tape
- Patent number 11,817,415
- Issue date Nov 14, 2023
- Nitto Denko Corporation
- Satoshi Honda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical pressure-sensitive adhesive composition and use thereof
- Patent number 11,795,350
- Issue date Oct 24, 2023
- Nitto Denko Corporation
- Masayuki Okamoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Sheet for heat bonding, and sheet for heat bonding having dicing tape
- Patent number 11,786,966
- Issue date Oct 17, 2023
- Nitto Denko Corporation
- Satoshi Honda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Sheet for heat bonding and sheet for heat bonding having dicing tape
- Patent number 11,390,777
- Issue date Jul 19, 2022
- Nitto Denko Corporation
- Satoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device manufacturing method
- Patent number 10,998,484
- Issue date May 4, 2021
- Nitto Denko Corporation
- Keisuke Okumura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joint manufacturing method
- Patent number 10,821,543
- Issue date Nov 3, 2020
- Nitto Denko Corporation
- Nao Kamakura
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Thermal bonding sheet, thermal bonding sheet with dicing tape, bond...
- Patent number 10,748,866
- Issue date Aug 18, 2020
- Nitto Denko Corporation
- Yuki Sugo
- B22 - CASTING POWDER METALLURGY

Patents Applicationslast 30 patents

Information Patent Application
PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHE...
- Publication number 20240392172
- Publication date Nov 28, 2024
- NITTO DENKO CORPORATION
- Yusuke TAKEDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PEELING PRESSURE-S...
- Publication number 20240368435
- Publication date Nov 7, 2024
- Nitto Denko Corporation
- Naofumi KOSAKA
- B32 - LAYERED PRODUCTS
Information Patent Application
RESIN SHEET AND USE THEREOF
- Publication number 20240141217
- Publication date May 2, 2024
- NITTO DENKO CORPORATION
- Satoshi HONDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET
- Publication number 20230167336
- Publication date Jun 1, 2023
- NITTO DENKO CORPORATION
- Mizuho NAGATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET
- Publication number 20230167337
- Publication date Jun 1, 2023
- NITTO DENKO CORPORATION
- Mizuho NAGATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ADHESIVE SHEET
- Publication number 20230019125
- Publication date Jan 19, 2023
- NITTO DENKO CORPORATION
- Mizuho NAGATA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIV...
- Publication number 20220315808
- Publication date Oct 6, 2022
- NITTO DENKO CORPORATION
- Daisuke MIZUNO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD FOR PRODUCING LAMINATE OF TWO-DIMENSIONAL MATERIAL AND LAMINATE
- Publication number 20220169002
- Publication date Jun 2, 2022
- NITTO DENKO CORPORATION
- Satoshi HONDA
- B32 - LAYERED PRODUCTS
Information Patent Application
OPTICAL PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND USE THEREOF
- Publication number 20210348036
- Publication date Nov 11, 2021
- NITTO DENKO CORPORATION
- Masayuki OKAMOTO
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Peeling Pressure-Sensitive Adhesive Sheet
- Publication number 20210230455
- Publication date Jul 29, 2021
- NITTO DENKO CORPORATION
- Naofumi KOSAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Pressure-Sensitive Adhesive Sheet and Method for Peeling Pressure-S...
- Publication number 20210214587
- Publication date Jul 15, 2021
- NITTO DENKO CORPORATION
- Naofumi KOSAKA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SHEET FOR HEAT BONDING AND SHEET FOR HEAT BONDING HAVING DICING TAPE
- Publication number 20210198526
- Publication date Jul 1, 2021
- NITTO DENKO CORPORATION
- Satoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
THERMAL-BONDING SHEET AND THERMAL-BONDING SHEET-ATTACHED DICING TAPE
- Publication number 20200048504
- Publication date Feb 13, 2020
- NITTO DENKO CORPORATION
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE
- Publication number 20190311936
- Publication date Oct 10, 2019
- NITTO DENKO CORPORATION
- Satoshi HONDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE
- Publication number 20190206825
- Publication date Jul 4, 2019
- NITTO DENKO CORPORATION
- Yuki Sugo
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SHEET FOR HEAT BONDING, AND SHEET FOR HEAT BONDING HAVING DICING TAPE
- Publication number 20190184460
- Publication date Jun 20, 2019
- NITTO DENKO CORPORATION
- Satoshi Honda
- B22 - CASTING POWDER METALLURGY
Information Patent Application
THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE
- Publication number 20190148331
- Publication date May 16, 2019
- NITTO DENKO CORPORATION
- Satoshi Honda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD
- Publication number 20190051807
- Publication date Feb 14, 2019
- NITTO DENKO CORPORATION
- Keisuke OKUMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Joint Manufacturing Method
- Publication number 20190047081
- Publication date Feb 14, 2019
- NITTO DENKO CORPORATION
- Nao Kamakura
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Thermal Bonding Sheet, Thermal Bonding Sheet with Dicing Tape, Bond...
- Publication number 20190043824
- Publication date Feb 7, 2019
- NITTO DENKO CORPORATION
- Yuki Sugo
- H01 - BASIC ELECTRIC ELEMENTS

Satoshi Honda

Person

Patents Grantslast 30 patents

Pressure-sensitive adhesive sheet and method for peeling pressure-s...

Method for peeling pressure-sensitive adhesive sheet

Thermal bonding sheet and thermal bonding sheet with dicing tape

Optical pressure-sensitive adhesive composition and use thereof

Sheet for heat bonding, and sheet for heat bonding having dicing tape

Sheet for heat bonding and sheet for heat bonding having dicing tape

Semiconductor device manufacturing method

Joint manufacturing method

Thermal bonding sheet, thermal bonding sheet with dicing tape, bond...

Patents Applicationslast 30 patents

PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHE...

PRESSURE-SENSITIVE ADHESIVE SHEET AND METHOD FOR PEELING PRESSURE-S...

RESIN SHEET AND USE THEREOF

ADHESIVE SHEET

ADHESIVE SHEET

ADHESIVE SHEET

PRESSURE-SENSITIVE ADHESIVE COMPOSITION, PRESSURE-SENSITIVE ADHESIV...

METHOD FOR PRODUCING LAMINATE OF TWO-DIMENSIONAL MATERIAL AND LAMINATE

OPTICAL PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND USE THEREOF

Method for Peeling Pressure-Sensitive Adhesive Sheet

Pressure-Sensitive Adhesive Sheet and Method for Peeling Pressure-S...

SHEET FOR HEAT BONDING AND SHEET FOR HEAT BONDING HAVING DICING TAPE

THERMAL-BONDING SHEET AND THERMAL-BONDING SHEET-ATTACHED DICING TAPE

THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE

THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE

SHEET FOR HEAT BONDING, AND SHEET FOR HEAT BONDING HAVING DICING TAPE

THERMAL BONDING SHEET AND THERMAL BONDING SHEET WITH DICING TAPE

SEMICONDUCTOR DEVICE MANUFACTURING METHOD

Joint Manufacturing Method

Thermal Bonding Sheet, Thermal Bonding Sheet with Dicing Tape, Bond...