Satoshi Isa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked die package including a first die coupled to a substrate th...
- Patent number 11,705,432
- Issue date Jul 18, 2023
- Micron Technology, Inc.
- Hiroki Fujisawa
- G11 - INFORMATION STORAGE
Information Patent Grant
Stacked die package including a first die coupled to a substrate th...
- Patent number 11,081,468
- Issue date Aug 3, 2021
- Micron Technology, Inc.
- Hiroki Fujisawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
- Patent number 10,600,762
- Issue date Mar 24, 2020
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
- Patent number 10,431,566
- Issue date Oct 1, 2019
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses comprising semiconductor dies in face-to-face arrangements
- Patent number 10,115,709
- Issue date Oct 30, 2018
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,589,921
- Issue date Mar 7, 2017
- PS4 Luxco S.A.R.L.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,418,967
- Issue date Aug 16, 2016
- PS4 Luxco S.A.R.L.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with respective electrode pad rows and respect...
- Patent number 9,159,663
- Issue date Oct 13, 2015
- PS4 Luxco S.A.R.L.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack with bonding layer and wire retaining me...
- Patent number 8,970,052
- Issue date Mar 3, 2015
- PS4 Luxco S.A.R.L.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,796,077
- Issue date Aug 5, 2014
- PS4 Luxco, S.a.r.l.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having wiring layers with power-supply plane a...
- Patent number 8,604,601
- Issue date Dec 10, 2013
- Elpida Memory, Inc.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device that suppresses malfunctions due to noise gene...
- Patent number 8,587,097
- Issue date Nov 19, 2013
- Elpida Memory Inc.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device stack with bonding layer and wire retaining me...
- Patent number 8,581,417
- Issue date Nov 12, 2013
- Elpida Memory, Inc.
- Yu Hasegawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,569,898
- Issue date Oct 29, 2013
- Elpida Memory, Inc.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,426,983
- Issue date Apr 23, 2013
- Elpida Memory, Inc.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including plural electrode pads
- Patent number 8,331,182
- Issue date Dec 11, 2012
- Elipida Memory, Inc.
- Hiromasa Takeda
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device with additional power supply paths
- Patent number 8,243,465
- Issue date Aug 14, 2012
- Elpida Memory, Inc.
- Satoshi Itaya
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device
- Patent number 8,063,476
- Issue date Nov 22, 2011
- Elpida Memory, Inc.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,956,470
- Issue date Jun 7, 2011
- Elpida Memory, Inc.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,944,026
- Issue date May 17, 2011
- Elpida Memory, Inc.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,875,986
- Issue date Jan 25, 2011
- Elpida Memory, Inc.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including semiconductor chip with two pad rows
- Patent number 7,847,377
- Issue date Dec 7, 2010
- Fumiyuki Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inductance analysis system and method and program therefor
- Patent number 7,823,096
- Issue date Oct 26, 2010
- Elpida Memory, Inc.
- Mitsuaki Katagiri
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device including ground and power-supply planes and a...
- Patent number 7,816,768
- Issue date Oct 19, 2010
- Elpida Memory, Inc.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor stack package having wiring extension part which has...
- Patent number 7,777,350
- Issue date Aug 17, 2010
- Elpida Memory, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for designing semiconductor package, system for aiding to de...
- Patent number 7,694,245
- Issue date Apr 6, 2010
- Elpida Memory
- Mitsuaki Katagiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for designing semiconductor apparatus, system for aiding to...
- Patent number 7,689,944
- Issue date Mar 30, 2010
- Elpida Memory, Inc.
- Mitsuaki Katagiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for designing device, system for aiding to design device, an...
- Patent number 7,681,154
- Issue date Mar 16, 2010
- Elpida Memory, Inc.
- Mitsuaki Katagiri
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor package with bypass capacitor
- Patent number 7,667,317
- Issue date Feb 23, 2010
- Elpida Memory, Inc.
- Fumiyuki Osanai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked semiconductor package
- Patent number 7,642,635
- Issue date Jan 5, 2010
- Elpida Memory, Inc.
- Wataru Kikuchi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIE PACKAGE INCLUDING A FIRST DIE COUPLED TO A SUBSTRATE TH...
- Publication number 20210327856
- Publication date Oct 21, 2021
- Micron Technology, Inc.
- Hiroki Fujisawa
- G11 - INFORMATION STORAGE
Information Patent Application
STACKED DIE PACKAGE INCLUDING WIRE BONDING AND DIRECT CHIP ATTACHME...
- Publication number 20210066247
- Publication date Mar 4, 2021
- Micron Technology, Inc.
- Hiroki Fujisawa
- G11 - INFORMATION STORAGE
Information Patent Application
Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements
- Publication number 20190304955
- Publication date Oct 3, 2019
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements
- Publication number 20190013294
- Publication date Jan 10, 2019
- Micron Technology, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20160027754
- Publication date Jan 28, 2016
- PS4 LUXCO S.A.R.L.
- Mitsuaki Katagiri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150318265
- Publication date Nov 5, 2015
- PS4 LUXCO S.A.R.L.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150262974
- Publication date Sep 17, 2015
- PS4 LUXCO S.A.R.L.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140094000
- Publication date Apr 3, 2014
- Elpida Memory, Inc.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STACK WITH BONDING LAYER AND WIRE RETAINING ME...
- Publication number 20140035166
- Publication date Feb 6, 2014
- Elpida Memory, Inc.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130114223
- Publication date May 9, 2013
- Elpida Memory, Inc.
- Satoshi ITAYA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME
- Publication number 20120146242
- Publication date Jun 14, 2012
- ELPIDA MEMORY, INC.
- Hiroyuki Fujishima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110291295
- Publication date Dec 1, 2011
- ELPIDA MEMORY, INC.
- Satoshi ISA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20110180934
- Publication date Jul 28, 2011
- ELPIDA MEMORY, INC.
- Hiromasa TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package substrate and semiconductor device having the...
- Publication number 20110084395
- Publication date Apr 14, 2011
- Elpida Memory, Inc.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING PLURAL ELECTRODE PADS
- Publication number 20110063936
- Publication date Mar 17, 2011
- ELPIDA MEMORY, INC.
- Hiromasa Takeda
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE THAT SUPPRESSES MALFUNCTIONS DUE TO NOISE GENE...
- Publication number 20100314779
- Publication date Dec 16, 2010
- ELPIDA MEMORY, INC.
- Hiromasa TAKEDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100289141
- Publication date Nov 18, 2010
- Elpida Memory, Inc.
- Hiromasa Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100213611
- Publication date Aug 26, 2010
- Elpida Memory, Inc.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100208443
- Publication date Aug 19, 2010
- Elpida Memory, Inc.
- Satoshi ITAYA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100193929
- Publication date Aug 5, 2010
- ELPIDA MEMORY, INC.
- Ken IWAKURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20100193933
- Publication date Aug 5, 2010
- ELPIDA MEMORY, INC.
- Yu HASEGAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE THAT SUPRESSES MALFUNCTIONS DUE TO VOLTAGE RED...
- Publication number 20100188878
- Publication date Jul 29, 2010
- Elpida Memory, Inc.
- Hiromasa TAKEDA
- G11 - INFORMATION STORAGE
Information Patent Application
ELECTROMAGNETIC FIELD ANALYSIS OF SEMICONDUCTOR PACKAGE WITH SEMICO...
- Publication number 20100095257
- Publication date Apr 15, 2010
- ELPIDA MEMORY, INC.
- Kazutaka Koshiishi
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Semiconductor device
- Publication number 20090250801
- Publication date Oct 8, 2009
- Elpida Memory, Inc.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20090140409
- Publication date Jun 4, 2009
- ELPIDA MEMORY, INC.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor stack package having wiring extension part which has...
- Publication number 20090032973
- Publication date Feb 5, 2009
- Elpida Memory, Inc.
- Dai Sasaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080224311
- Publication date Sep 18, 2008
- Elpida Memory, Inc.
- Satoshi Isa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device
- Publication number 20080173987
- Publication date Jul 24, 2008
- Elpida Memory, Inc.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20080164585
- Publication date Jul 10, 2008
- ELPIDA MEMORY, INC.
- Kazutaka Koshiishi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DESIGNING DEVICE, SYSTEM FOR AIDING TO DESIGN DEVICE, AN...
- Publication number 20080072194
- Publication date Mar 20, 2008
- Elpida Memory, Inc.
- Mitsuaki KATAGIRI
- G06 - COMPUTING CALCULATING COUNTING

Satoshi Isa

Person

Patents Grantslast 30 patents

Stacked die package including a first die coupled to a substrate th...

Stacked die package including a first die coupled to a substrate th...

Apparatuses comprising semiconductor dies in face-to-face arrangements

Apparatuses comprising semiconductor dies in face-to-face arrangements

Apparatuses comprising semiconductor dies in face-to-face arrangements

Semiconductor device

Semiconductor device

Semiconductor device with respective electrode pad rows and respect...

Semiconductor device stack with bonding layer and wire retaining me...

Semiconductor device

Semiconductor device having wiring layers with power-supply plane a...

Semiconductor device that suppresses malfunctions due to noise gene...

Semiconductor device stack with bonding layer and wire retaining me...

Semiconductor device

Semiconductor device

Semiconductor device including plural electrode pads

Semiconductor device with additional power supply paths

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device

Semiconductor device including semiconductor chip with two pad rows

Inductance analysis system and method and program therefor

Semiconductor device including ground and power-supply planes and a...

Semiconductor stack package having wiring extension part which has...

Method for designing semiconductor package, system for aiding to de...

Method for designing semiconductor apparatus, system for aiding to...

Method for designing device, system for aiding to design device, an...

Semiconductor package with bypass capacitor

Stacked semiconductor package

Patents Applicationslast 30 patents

STACKED DIE PACKAGE INCLUDING A FIRST DIE COUPLED TO A SUBSTRATE TH...

STACKED DIE PACKAGE INCLUDING WIRE BONDING AND DIRECT CHIP ATTACHME...

Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements

Apparatuses Comprising Semiconductor Dies in Face-To-Face Arrangements

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE STACK WITH BONDING LAYER AND WIRE RETAINING ME...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Semiconductor package substrate and semiconductor device having the...

SEMICONDUCTOR DEVICE INCLUDING PLURAL ELECTRODE PADS

SEMICONDUCTOR DEVICE THAT SUPPRESSES MALFUNCTIONS DUE TO NOISE GENE...

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SEMICONDUCTOR DEVICE THAT SUPRESSES MALFUNCTIONS DUE TO VOLTAGE RED...

ELECTROMAGNETIC FIELD ANALYSIS OF SEMICONDUCTOR PACKAGE WITH SEMICO...

Semiconductor device

SEMICONDUCTOR DEVICE

Semiconductor stack package having wiring extension part which has...

SEMICONDUCTOR DEVICE

Semiconductor device

SEMICONDUCTOR DEVICE

METHOD FOR DESIGNING DEVICE, SYSTEM FOR AIDING TO DESIGN DEVICE, AN...