Satoshi Kumagai

Person

Iwaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Sputtering target material
- Patent number 11,427,888
- Issue date Aug 30, 2022
- Mitsubishi Materials Corporation
- Satoru Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Manufacturing method of cylindrical sputtering target material
- Patent number 9,982,335
- Issue date May 29, 2018
- Mitsubishi Materials Corporation
- Akira Sakurai
- C21 - METALLURGY OF IRON
Information Patent Grant
Cylindrical sputtering target material
- Patent number 9,748,079
- Issue date Aug 29, 2017
- Mitsubishi Materials Corporation
- Michiaki Ohto
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Patents Applicationslast 30 patents

Information Patent Application
COPPER ALLOY TROLLEY WIRE
- Publication number 20220259701
- Publication date Aug 18, 2022
- MITSUBISHI MATERIALS CORPORATION
- Yoshiyuki Akiyama
- C21 - METALLURGY OF IRON
Information Patent Application
COPPER ALLOY MATERIAL, COMMUTATOR SEGMENT, AND ELECTRODE MATERIAL
- Publication number 20220119919
- Publication date Apr 21, 2022
- MITSUBISHI MATERIALS CORPORATION
- Satoshi Kumagai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
COPPER ALLOY MATERIAL
- Publication number 20220106669
- Publication date Apr 7, 2022
- MITSUBISHI MATERIALS CORPORATION
- Satoshi Kumagai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SPUTTERING TARGET MATERIAL
- Publication number 20210010105
- Publication date Jan 14, 2021
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Application
HOT EXTRUDED MATERIAL FOR CYLINDRICAL SPUTTERING TARGET AND METHOD...
- Publication number 20190055625
- Publication date Feb 21, 2019
- MITSUBISHI MATERIALS CORPORATION
- Michiaki Ohto
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING Ca-CONTAINING COPPER ALLOY
- Publication number 20160312335
- Publication date Oct 27, 2016
- MITSUBISHI MATERIALS CORPORATION
- Satoshi KUMAGAI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CYLINDRICAL SPUTTERING TARGET MATERIAL
- Publication number 20160203959
- Publication date Jul 14, 2016
- MITSUBISHI MATERIALS CORPORATION
- Michiaki OHTO
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
MANUFACTURING METHOD OF CYLINDRICAL SPUTTERING TARGET MATERIAL
- Publication number 20160194749
- Publication date Jul 7, 2016
- MITSUBISHI MATERIALS CORPORATION
- Akira SAKURAI
- C21 - METALLURGY OF IRON
Information Patent Application
COPPER MATERIAL FOR HIGH-PURITY COPPER SPUTTERING TARGET, AND HIGH-...
- Publication number 20160172167
- Publication date Jun 16, 2016
- MITSUBISHI MATERIALS CORPORATION
- Akira SAKURAI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
HIGHLY PURE COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, METHOD FO...
- Publication number 20130075272
- Publication date Mar 28, 2013
- MITSUBISHI MATERIALS CORPORATION
- Kiyotaka Nakaya
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROCESSED HIGH-PURITY COPPER MATERIAL HAVING UNIFORM AND FINE CRYST...
- Publication number 20120328468
- Publication date Dec 27, 2012
- Mitsubishi Materials Corporation
- Satoshi Kumagai
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...

Satoshi Kumagai

Person

Patents Grantslast 30 patents

Sputtering target material

Manufacturing method of cylindrical sputtering target material

Cylindrical sputtering target material

Patents Applicationslast 30 patents

COPPER ALLOY TROLLEY WIRE

COPPER ALLOY MATERIAL, COMMUTATOR SEGMENT, AND ELECTRODE MATERIAL

COPPER ALLOY MATERIAL

SPUTTERING TARGET MATERIAL

HOT EXTRUDED MATERIAL FOR CYLINDRICAL SPUTTERING TARGET AND METHOD...

METHOD FOR MANUFACTURING Ca-CONTAINING COPPER ALLOY

CYLINDRICAL SPUTTERING TARGET MATERIAL

MANUFACTURING METHOD OF CYLINDRICAL SPUTTERING TARGET MATERIAL

COPPER MATERIAL FOR HIGH-PURITY COPPER SPUTTERING TARGET, AND HIGH-...

HIGHLY PURE COPPER ANODE FOR ELECTROLYTIC COPPER PLATING, METHOD FO...

PROCESSED HIGH-PURITY COPPER MATERIAL HAVING UNIFORM AND FINE CRYST...