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Satoshi Kumazawa

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  • Tokyo, JP
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Patents Grantslast 30 patents

  • Information Patent Grant

    Method of processing workpiece and laser processing apparatus
    • Patent number 12,121,993
    • Issue date Oct 22, 2024
    • Disco Corporation
    • Masatoshi Nayuki
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Optical axis adjusting method for laser processing apparatus
    • Patent number 11,577,339
    • Issue date Feb 14, 2023
    • Disco Corporation
    • Satoshi Kumazawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing device chip
    • Patent number 11,373,907
    • Issue date Jun 28, 2022
    • Disco Corporation
    • Satoshi Kumazawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of manufacturing glass interposer
    • Patent number 10,796,926
    • Issue date Oct 6, 2020
    • Disco Corporation
    • Tsubasa Obata
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Device wafer processing method
    • Patent number 10,679,897
    • Issue date Jun 9, 2020
    • Disco Corporation
    • Koichi Shigematsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Wafer dividing method
    • Patent number 10,354,919
    • Issue date Jul 16, 2019
    • Disco Corporation
    • Tomotaka Tabuchi
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Grant

    Method of processing wafer
    • Patent number 10,177,004
    • Issue date Jan 8, 2019
    • Disco Corporation
    • Yoshio Watanabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Workpiece dividing method
    • Patent number 9,649,775
    • Issue date May 16, 2017
    • Disco Corporation
    • Satoshi Kumazawa
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    LASER PROCESSING MACHINE AND PROCESSING METHOD OF WORKPIECE
    • Publication number 20230286079
    • Publication date Sep 14, 2023
    • Disco Corporation
    • Satoshi KUMAZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF PROCESSING WORKPIECE AND LASER PROCESSING APPARATUS
    • Publication number 20230166355
    • Publication date Jun 1, 2023
    • Disco Corporation
    • Masatoshi NAYUKI
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    OPTICAL AXIS ADJUSTING METHOD FOR LASER PROCESSING APPARATUS
    • Publication number 20200368845
    • Publication date Nov 26, 2020
    • Disco Corporation
    • Satoshi KUMAZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING DEVICE CHIP
    • Publication number 20200185276
    • Publication date Jun 11, 2020
    • Disco Corporation
    • Satoshi KUMAZAWA
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    METHOD OF MANUFACTURING GLASS INTERPOSER
    • Publication number 20190019692
    • Publication date Jan 17, 2019
    • Disco Corporation
    • Tsubasa Obata
    • C03 - GLASS MINERAL OR SLAG WOOL
  • Information Patent Application

    METHOD OF PROCESSING WAFER
    • Publication number 20180269068
    • Publication date Sep 20, 2018
    • Disco Corporation
    • Yoshio Watanabe
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DEVICE WAFER PROCESSING METHOD
    • Publication number 20180144983
    • Publication date May 24, 2018
    • Disco Corporation
    • Koichi Shigematsu
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WAFER DIVIDING METHOD
    • Publication number 20170140989
    • Publication date May 18, 2017
    • Disco Corporation
    • Tomotaka Tabuchi
    • B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
  • Information Patent Application

    METHOD OF DIVIDING WAFER
    • Publication number 20160307851
    • Publication date Oct 20, 2016
    • Disco Corporation
    • Yukinobu Ohura
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    WORKPIECE DIVIDING METHOD
    • Publication number 20130298744
    • Publication date Nov 14, 2013
    • Disco Corporation
    • Satoshi KUMAZAWA
    • B26 - HAND CUTTING TOOLS CUTTING SEVERING