Satoshi Matagawa

Follow

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method of lapping semiconductor wafer and semiconductor wafer
- Patent number 11,456,168
- Issue date Sep 27, 2022
- Sumco Corporation
- Daisuke Hashimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 8,283,252
- Issue date Oct 9, 2012
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 7,589,023
- Issue date Sep 15, 2009
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
WAFER MANUFACTURING METHOD AND WAFER
- Publication number 20190252180
- Publication date Aug 15, 2019
- SUMCO CORPORATION
- Toshiyuki TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF LAPPING SEMICONDUCTOR WAFER AND SEMICONDUCTOR WAFER
- Publication number 20190181001
- Publication date Jun 13, 2019
- SUMCO CORPORATION
- Daisuke HASHIMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor wafer
- Publication number 20100009605
- Publication date Jan 14, 2010
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Application
Method of manufacturing semiconductor wafer
- Publication number 20030104698
- Publication date Jun 5, 2003
- Toru Taniguchi
- B24 - GRINDING POLISHING